Wu; Huang Shuang

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wu; Huang Shuang.The latest application filed is for "castellation wafer level packaging of integrated circuit chips".

Company Profile

0.6.8

Wu; Huang Shuang - Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Castellation wafer level packaging of integrated circuit chips Grant 8,008,126 - Jeung , et al. August 30, 2	2011-08-30
Castellation Wafer Level Packaging Of Integrated Circuit Chips App 20100068851 - Jeung; Boon Suan ; et al.	2010-03-18
Castellation wafer level packaging of integrated circuit chips Grant 7,679,179 - Jeung , et al. March 16, 2	2010-03-16
Castellation wafer level packaging of integrated circuit chips Grant 7,528,477 - Jeung , et al. May 5, 2	2009-05-05
Castellation Wafer Level Packaging Of Integrated Circuit Chips App 20080067675 - Jeung; Boon Suan ; et al.	2008-03-20
Castellation wafer level packaging of integrated circuit chips Grant 7,276,387 - Jeung , et al. October 2, 2	2007-10-02
Castellation wafer level packaging of integrated circuit chips App 20060014319 - Jeung; Boon Suan ; et al.	2006-01-19
Castellation wafer level packaging of integrated circuit chips App 20060006519 - Jeung; Boon Suan ; et al.	2006-01-12
Castellation wafer level packaging of integrated circuit chips App 20060008946 - Jeung; Boon Suan ; et al.	2006-01-12
Castellation wafer level packaging of integrated circuit chips App 20060001142 - Jeung; Boon Suan ; et al.	2006-01-05
Castellation wafer level packaging of integrated circuit chips Grant 6,949,407 - Jeung , et al. September 27, 2	2005-09-27
Castellation Wafer Level Packaging Of Integrated Circuit Chips App 20050130345 - Jeung, Boon Suan ; et al.	2005-06-16
Castellation wafer level packaging of integrated circuit chips Grant 6,855,572 - Jeung , et al. February 15, 2	2005-02-15
Castellation wafer level packaging of integrated circuit chips App 20040043535 - Jeung, Boon Suan ; et al.	2004-03-04

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