Wu; Hua-Shu
Patent Applications and Registrations
Patent applications and USPTO patent grants for Wu; Hua-Shu.The latest application filed is for "manufacturing process of mems device".
Company Profile
0.26.25
- Wu; Hua-Shu - Hsinchu N/A TW
- WU; HUA-SHU - HSINCHU CITY TW
- Wu; Hua-Shu - Hsin-Chu TW
- Wu; Hua-Shu - HsiChu TW
Patent Activity
| Patent | Date |
|---|---|
| Method and system for MEMS devices Grant 10,040,681 - Wu , et al. August 7, 2 | 2018-08-07 |
| Manufacturing process of MEMS device Grant 9,278,853 - Chien , et al. March 8, 2 | 2016-03-08 |
| Manufacturing Process Of Mems Device App 20140227817 - CHIEN; YU-HAO ; et al. | 2014-08-14 |
| MEMS device with simplified electrical conducting paths Grant 8,754,529 - Chien , et al. June 17, 2 | 2014-06-17 |
| Mems Device And Manufacturing Process Thereof App 20120248615 - CHIEN; YU-HAO ; et al. | 2012-10-04 |
| Methods of fabricating a micromechanical structure Grant 8,278,724 - Chang , et al. October 2, 2 | 2012-10-02 |
| Microelectromechanical System Device And Semi-manufacture And Manufacturing Method Thereof App 20120146452 - WU; HUA-SHU ; et al. | 2012-06-14 |
| System for overlay measurement in semiconductor manufacturing Grant 8,119,992 - Lu , et al. February 21, 2 | 2012-02-21 |
| Semiconductor fabrication method suitable for MEMS Grant 8,084,361 - Huang , et al. December 27, 2 | 2011-12-27 |
| Chip holder with wafer level redistribution layer Grant 8,049,323 - Chen , et al. November 1, 2 | 2011-11-01 |
| Method of fabricating an integrated CMOS-MEMS device Grant 8,012,785 - Liang , et al. September 6, 2 | 2011-09-06 |
| Method And System For Mems Devices App 20110049652 - Wu; Hua-Shu ; et al. | 2011-03-03 |
| Bonding Structures And Methods Of Forming Bonding Structures App 20110042827 - LU; Szu Wei ; et al. | 2011-02-24 |
| Bonding structures and methods of forming bonding structures Grant 7,851,331 - Lu , et al. December 14, 2 | 2010-12-14 |
| Method Of Fabricating An Integrated CMOS-MEMS Device App 20100273286 - Liang; Kai-Chih ; et al. | 2010-10-28 |
| Process for wafer bonding Grant 7,732,299 - Chang , et al. June 8, 2 | 2010-06-08 |
| Semiconductor structures Grant 7,728,396 - Wu , et al. June 1, 2 | 2010-06-01 |
| Ultra-fine pitch probe card structure Grant 7,696,766 - Cheng , et al. April 13, 2 | 2010-04-13 |
| System For Overlay Measurement In Semiconductor Manufacturing App 20090294685 - Lu; Hsiao-Tzu ; et al. | 2009-12-03 |
| Method of overlay measurement for alignment of patterns in semiconductor manufacturing Grant 7,582,538 - Lu , et al. September 1, 2 | 2009-09-01 |
| Methods of fabricating a micromechanical structure Grant 7,468,327 - Chang , et al. December 23, 2 | 2008-12-23 |
| Semiconductor Fabrication Method Suitable For Mems App 20080299769 - Huang; Tsung-Cheng ; et al. | 2008-12-04 |
| Method for forming micromachined structure Grant 7,459,344 - Chang , et al. December 2, 2 | 2008-12-02 |
| Double-diffused-drain MOS device with floating non-insulator spacers Grant 7,453,127 - Wu , et al. November 18, 2 | 2008-11-18 |
| Chip Holder With Wafer Level Redistribution Layer App 20080197473 - Chen; Chen-Shien ; et al. | 2008-08-21 |
| Process For Wafer Bonding App 20080194076 - Chang; Fa-Yuan ; et al. | 2008-08-14 |
| Ultra-fine pitch probe card structure App 20080180123 - Cheng; Hsu Ming ; et al. | 2008-07-31 |
| Bonding Structures And Methods Of Forming Bonding Structures App 20080122114 - Lu; Szu Wei ; et al. | 2008-05-29 |
| Method For Forming Micromachined Structure App 20080038859 - Chang; Chia-Hua ; et al. | 2008-02-14 |
| Test probe for integrated circuits with ultra-fine pitch terminals App 20080018350 - Chao; Clinton ; et al. | 2008-01-24 |
| Methods of fabricating a micromechanical structure App 20070287213 - Chang; Chia-Hua ; et al. | 2007-12-13 |
| Micro-lens and micro-lens fabrication method Grant 7,295,374 - Chang , et al. November 13, 2 | 2007-11-13 |
| Double-diffused-drain MOS device with floating non-insulator spacer App 20070187784 - Wu; Hua-Shu ; et al. | 2007-08-16 |
| Ink-channel wafer integrated with CMOS wafer for inkjet printhead and fabrication method thereof Grant 7,255,425 - Lai , et al. August 14, 2 | 2007-08-14 |
| Semiconductor Structures App 20070145366 - Wu; Hua-Shu ; et al. | 2007-06-28 |
| Semiconductor methods and structures Grant 7,198,975 - Wu , et al. April 3, 2 | 2007-04-03 |
| System and method for overlay measurement in semiconductor manufacturing App 20060228816 - Lu; Hsiao-Tzu ; et al. | 2006-10-12 |
| Micro-lens micro-lens fabrication method App 20060193054 - Chang; Ming-Chih ; et al. | 2006-08-31 |
| Three dimensional structure formed by using an adhesive silicon wafer process App 20060189023 - Chang; Fa-Yuan ; et al. | 2006-08-24 |
| Micro pipe manufacturing method Grant 7,094,711 - Chang , et al. August 22, 2 | 2006-08-22 |
| Semiconductor methods and structures App 20060131697 - Wu; Hua-Shu ; et al. | 2006-06-22 |
| Ink-channel wafer integrated with CMOS wafer for inkjet printhead and fabrication method thereof App 20060119662 - Lai; Tsung-Mu ; et al. | 2006-06-08 |
| Method for manufacturing micro-optical mirror arrays Grant 7,011,933 - Chang , et al. March 14, 2 | 2006-03-14 |
| Micro pipe manufacturing method App 20050215025 - Chang, Ming-Chih ; et al. | 2005-09-29 |
| Method of patterning lines in semiconductor devices Grant 6,875,689 - Wu April 5, 2 | 2005-04-05 |
| Method for manufacturing micro-optical mirror arrays App 20050031997 - Chang, Ming-Chih ; et al. | 2005-02-10 |
| Method of patterning lines in semiconductor devices App 20030104702 - Wu, Hua-Shu | 2003-06-05 |
| Method of forming a MOSFET device featuring a dual salicide process Grant 6,534,405 - Wu March 18, 2 | 2003-03-18 |
| Method for forming via holes Grant 6,080,674 - Wu , et al. June 27, 2 | 2000-06-27 |
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