Wu; Hsiao-Chia
Patent Applications and Registrations
Patent applications and USPTO patent grants for Wu; Hsiao-Chia.The latest application filed is for "semiconductor device, termination structure and method of forming the same".
- Wu; Hsiao-Chia - Hsinchu TW
- Wu; Hsiao-Chia - Hsinchu City TW
- Wu; Hsiao-Chia - Jiangsu CN
- Wu; Hsiao-Chia - Wuxi N/A CN
| Patent | Date |
|---|---|
| Semiconductor device and method of operating the same and structure for suppressing current leakage Grant 9,508,793 - Wu , et al. November 29, 2 | 2016-11-29 |
| Semiconductor Device, Termination Structure And Method Of Forming The Same App 20160172436 - Ho; Geng-Tai ; et al. | 2016-06-16 |
| Semiconductor Device And Method Of Operating The Same And Structure For Suppressing Current Leakage App 20160118378 - Wu; Hsiao-Chia ; et al. | 2016-04-28 |
| Method for manufacturing semiconductor thick metal structure Grant 8,956,972 - Wu , et al. February 17, 2 | 2015-02-17 |
| Semiconductor device and method for fabricating semiconductor buried layer Grant 8,889,535 - Song , et al. November 18, 2 | 2014-11-18 |
| Method For Manufacturing Semiconductor Thick Metal Structure App 20140329385 - Wu; Hsiao-Chia ; et al. | 2014-11-06 |
| Semiconductor Device And Method For Fabricating Semiconductor Buried Layer App 20130134562 - Song; Hua ; et al. | 2013-05-30 |
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