loadpatents
name:-0.4672839641571
name:-0.22290301322937
name:-0.0061581134796143
Wu; Guangwei Patent Filings

Wu; Guangwei

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wu; Guangwei.The latest application filed is for "multi-layered chemical-mechanical planarization pad".

Company Profile
0.15.12
  • Wu; Guangwei - Sunnyvale CA
  • Wu; Guangwei - Wilmington DE
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Multi-layered chemical-mechanical planarization pad
Grant 9,796,063 - Lefevre , et al. October 24, 2
2017-10-24
Chemical-mechanical planarization pad including patterned structural domains
Grant 9,162,341 - LeFevre , et al. October 20, 2
2015-10-20
Multi-layered Chemical-mechanical Planarization Pad
App 20140311043 - LEFEVRE; Paul ;   et al.
2014-10-23
Multi-layered chemical-mechanical planarization pad
Grant 8,790,165 - Lefevre , et al. July 29, 2
2014-07-29
Method of grooving a chemical-mechanical planarization pad
Grant 8,758,659 - Lefevre , et al. June 24, 2
2014-06-24
Chemical mechanical planarization pad with void network
Grant 8,684,794 - Lefevre , et al. April 1, 2
2014-04-01
Chemical-mechanical Planarization Pad Including Patterned Structural Domains
App 20130244548 - LEFEVRE; Paul ;   et al.
2013-09-19
Chemical-mechanical planarization pad including patterned structural domains
Grant 8,435,099 - Lefevre , et al. May 7, 2
2013-05-07
Polishing pad with controlled void formation
Grant 8,377,351 - Lefevre , et al. February 19, 2
2013-02-19
Method Of Grooving A Chemical-mechanical Planarization Pad
App 20120073210 - LEFEVRE; Paul ;   et al.
2012-03-29
Multi-layered Chemical-mechanical Planarization Pad
App 20100221983 - LEFEVRE; Paul ;   et al.
2010-09-02
Chemical-mechanical Planarization Pad Including Patterned Structural Domains
App 20100221985 - LEFEVRE; Paul ;   et al.
2010-09-02
Polishing Pad With Controlled Void Formation
App 20090246504 - LEFEVRE; Paul ;   et al.
2009-10-01
Stacked pad and method of use
App 20070087177 - Wu; Guangwei ;   et al.
2007-04-19
Smooth pads for CMP and polishing substrates
Grant 7,118,461 - West , et al. October 10, 2
2006-10-10
Recirculating anode
App 20040251126 - Pinto, Martin de Tezanos ;   et al.
2004-12-16
Improved fuel for a zinc-based fuel cell and regeneration thereof
App 20040053132 - Smedley, Stuart I. ;   et al.
2004-03-18
Conditioner and conditioning methods for smooth pads
App 20030194955 - West, Thomas E. ;   et al.
2003-10-16
Smooth pads for CMP and polishing substrates
App 20030181155 - West, Thomas E. ;   et al.
2003-09-25
Methods and apparatus for polishing and planarization
App 20020137431 - Labunsky, Michael A. ;   et al.
2002-09-26
Method for polishing a composite comprising an insulator, a metal, and titanium
Grant 6,001,269 - Sethuraman , et al. December 14, 1
1999-12-14
Composition and method for polishing a composite comprising titanium
Grant 5,770,103 - Wang , et al. June 23, 1
1998-06-23

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