Wu; Frederick C.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wu; Frederick C..The latest application filed is for "process for electroless copper deposition on a ruthenium seed".

Company Profile

0.9.16

Wu; Frederick C. - Cupertino CA US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Apparatus and process for plasma-enhanced atomic layer deposition Grant 9,032,906 - Ma , et al. May 19, 2	2015-05-19
Process For Electroless Copper Deposition On A Ruthenium Seed App 20120315756 - Weidman; Timothy W. ; et al.	2012-12-13
Apparatus and process for plasma-enhanced atomic layer deposition Grant 7,850,779 - Ma , et al. December 14, 2	2010-12-14
Method of recovering valuable material from exhaust gas stream of a reaction chamber Grant 7,833,358 - Chu , et al. November 16, 2	2010-11-16
Apparatus and process for plasma-enhanced atomic layer deposition Grant 7,682,946 - Ma , et al. March 23, 2	2010-03-23
Formation of composite tungsten films Grant 7,605,083 - Lai , et al. October 20, 2	2009-10-20
Apparatus And Process For Plasma-enhanced Atomic Layer Deposition App 20080268171 - MA; PAUL ; et al.	2008-10-30
Formation Of Composite Tungsten Films App 20080227291 - LAI; KEN K. ; et al.	2008-09-18
Formation of composite tungsten films Grant 7,384,867 - Lai , et al. June 10, 2	2008-06-10
Method of recovering valuable material from exhaust gas stream of a reaction chamber App 20070235059 - Chu; Schubert S. ; et al.	2007-10-11
Apparatus And Process For Plasma-enhanced Atomic Layer Deposition App 20070128862 - Ma; Paul ; et al.	2007-06-07
Apparatus And Process For Plasma-enhanced Atomic Layer Deposition App 20070128863 - Ma; Paul ; et al.	2007-06-07
Apparatus And Process For Plasma-enhanced Atomic Layer Deposition App 20070128864 - MA; PAUL ; et al.	2007-06-07
Apparatus And Process For Plasma-enhanced Atomic Layer Deposition App 20070119370 - MA; PAUL ; et al.	2007-05-31
Apparatus And Process For Plasma-enhanced Atomic Layer Deposition App 20070119371 - MA; PAUL ; et al.	2007-05-31
Atomic Layer Deposition Processes For Ruthenium Materials App 20070077750 - Ma; Paul ; et al.	2007-04-05
Atomic Layer Deposition Processes For Ruthenium Materials App 20070054487 - MA; PAUL ; et al.	2007-03-08
Process for electroless copper deposition on a ruthenium seed App 20060246699 - Weidman; Timothy W. ; et al.	2006-11-02
Formation of composite tungsten films App 20050287807 - Lai, Ken K. ; et al.	2005-12-29
Formation of composite tungsten films Grant 6,939,804 - Lai , et al. September 6, 2	2005-09-06
Formation of composite tungsten films App 20040014315 - Lai, Ken K. ; et al.	2004-01-22
Method of titanium and titanium nitride layer deposition App 20030072884 - Zhang, Tong ; et al.	2003-04-17
Formation of refractory metal nitrides using chemisorption techniques App 20030049931 - Byun, Jeong Soo ; et al.	2003-03-13
Method of forming a titanium silicide layer on a substrate Grant 6,524,952 - Srinivas , et al. February 25, 2	2003-02-25

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