Wu; Feng-Inn

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wu; Feng-Inn.The latest application filed is for "cmp safe alignment mark".

Company Profile

3.14.14

Wu; Feng-Inn - Taichung TW
WU; Feng-Inn - Hsinchu TW
WU; Feng-Inn - Taichung City TW
Wu; Feng-Inn - Hsinchu City TW
Wu; Feng-Inn - Hsinchu Ciy TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Polishing head, chemical-mechanical polishing system and method for polishing substrate Grant 11,407,083 - Hsu , et al. August 9, 2	2022-08-09
Cmp Safe Alignment Mark App 20220102285 - HSU; Huang-Jen ; et al.	2022-03-31
Method Of Manufacturing A Semiconductor Device And A Semiconductor Device App 20210407819 - Wei; Yu-Chen ; et al.	2021-12-30
Polishing Head, Chemical-mechanical Polishing System And Method For Polishing Substrate App 20190308295 - HSU; Shu-Bin ; et al.	2019-10-10
Polishing head, chemical-mechanical polishing system and method for polishing substrate Grant 10,328,549 - Hsu , et al.	2019-06-25
Method of CMP pad conditioning Grant 9,908,213 - Yeh , et al. March 6, 2	2018-03-06
Semiconductor manufacturing apparatus and method thereof Grant 9,768,080 - Chen , et al. September 19, 2	2017-09-19
Chemical mechanical polishing apparatus and polishing method using the same Grant 9,481,069 - Chen , et al. November 1, 2	2016-11-01
Localized CMP to improve wafer planarization Grant 9,418,904 - Wang , et al. August 16, 2	2016-08-16
Method Of And Apparatus For Cmp Pad Conditioning App 20160023324 - Yeh; Hsiu-Ming ; et al.	2016-01-28
Apparatus for CMP pad conditioning Grant 9,149,906 - Yeh , et al. October 6, 2	2015-10-06
Semiconductor Manufacturing Apparatus And Method Thereof App 20150170978 - CHEN; JIA-JHEN ; et al.	2015-06-18
Polishing Head, Chemical-mechanical Polishing System And Method For Polishing Substrate App 20150158140 - HSU; Shu-Bin ; et al.	2015-06-11
Chemical Mechanical Polishing Apparatus And Polishing Method Using The Same App 20150126095 - CHEN; Yuan-Hsuan ; et al.	2015-05-07
Slurry supply system for CMP process Grant 8,992,287 - Wang , et al. March 31, 2	2015-03-31
Systems providing an air zone for a chucking stage Grant 8,939,815 - Tsai , et al. January 27, 2	2015-01-27
Slurry Sluppy System for CMP Process App 20130143474 - Wang; Sheng-Chen ; et al.	2013-06-06
Localized CMP to Improve Wafer Planarization App 20130122613 - Wang; Sheng-Chen ; et al.	2013-05-16
Method Of And Apparatus For Cmp Pad Conditioning App 20130059503 - Yeh; Hsiu-Ming ; et al.	2013-03-07
Systems and Methods Providing an Air Zone for a Chucking Stage App 20120214383 - Tsai; Hui-Ting ; et al.	2012-08-23
Removal of wafer edge defocus due to CMP Grant 6,664,189 - Lin , et al. December 16, 2	2003-12-16

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