Wu; Fei-Jain
Patent Applications and Registrations
Patent applications and USPTO patent grants for Wu; Fei-Jain.The latest application filed is for "semiconductor package and method of fabricating the same".
- Wu; Fei-Jain - Hsinchu County TW
- Wu, Fei-Jain - Hsinchu TW
- Wu; Fei-Jain - Chelmsford MA
| Patent | Date |
|---|---|
| Semiconductor Package And Method Of Fabricating The Same App 20220037166 - Kuo; Chih-Ming ; et al. | 2022-02-03 |
| Flexible substrate Grant 9,961,759 - Hsieh , et al. May 1, 2 | 2018-05-01 |
| Flexible Substrate App 20170019984 - Hsieh; Chin-Tang ; et al. | 2017-01-19 |
| Flexible substrate Grant 9,510,441 - Hsieh , et al. November 29, 2 | 2016-11-29 |
| Flexible Substrate App 20160234927 - Hsieh; Chin-Tang ; et al. | 2016-08-11 |
| Substrate with bump structure and manufacturing method thereof Grant 9,177,830 - Wu , et al. November 3, 2 | 2015-11-03 |
| Semiconductor Package Process And Structure Thereof App 20140217578 - Ho; Lung-Hua ; et al. | 2014-08-07 |
| Metallized surface wafer level package structure App 20020180064 - Hwan, Lu-Chen ; et al. | 2002-12-05 |
| Solar controlled sun tracker for a sunbather Grant 5,211,172 - McGuane , et al. May 18, 1 | 1993-05-18 |
| Method for controlling accurate dispensing of adhesive droplets Grant 5,042,688 - Srivastava , et al. * August 27, 1 | 1991-08-27 |
| Method for controlling accurate dispensing of adhesive droplets Grant 4,935,261 - Srivastava , et al. June 19, 1 | 1990-06-19 |
| Inspection and repair of tab lifted leads Grant 4,813,588 - Srivastava , et al. March 21, 1 | 1989-03-21 |
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