Wu; Enboa

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wu; Enboa.The latest application filed is for "omni reflective optics for wide angle emission led light bulb".

Company Profile

0.16.17

Wu; Enboa - Hong Kong N/A HK
Wu; Enboa - Irvine CA
Wu; Enboa - Taipei TW
WU; ENBOA - Taipei City TW
Wu; Enboa - Hsinchu TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Omni reflective optics for wide angle emission LED light bulb Grant 8,672,512 - Zhou , et al. March 18, 2	2014-03-18
High reliability high voltage vertical LED arrays Grant 8,558,254 - Ho , et al. October 15, 2	2013-10-15
Omni Reflective Optics For Wide Angle Emission Led Light Bulb App 20120300453 - Zhou; Li ; et al.	2012-11-29
Remote control lighting assembly and use thereof Grant 8,013,347 - Zhang , et al. September 6, 2	2011-09-06
Method for self-assembling microstructures Grant 7,943,052 - Wu , et al. May 17, 2	2011-05-17
Thermal enhanced low profile package structure and method for fabricating the same Grant 7,754,530 - Wu , et al. July 13, 2	2010-07-13
Thermal Enhanced Low Profile Package Structure And Method For Fabricating The Same App 20090155954 - WU; ENBOA ; et al.	2009-06-18
Thermal enhanced low profile package structure Grant 7,511,365 - Wu , et al. March 31, 2	2009-03-31
LED assembly and use thereof Grant 7,482,632 - Lu , et al. January 27, 2	2009-01-27
Light emitting device Grant 7,474,287 - Wu , et al. January 6, 2	2009-01-06
Remote control lighting assembly and use thereof App 20080211369 - Zhang; Zhikuan ; et al.	2008-09-04
Light emitting diode matrix App 20080099772 - Shuy; Geoffrey Wen-Tai ; et al.	2008-05-01
Method for wafer level package of sensor chip Grant 7,351,609 - Wu , et al. April 1, 2	2008-04-01
Method For Self-assembling Microstructures App 20080023435 - WU; Enboa ; et al.	2008-01-31
LED assembly and use thereof App 20080013334 - Lu; Ming ; et al.	2008-01-17
Semiconductor package system and method of improving heat dissipation of a semiconductor package App 20080001277 - Wen; Tsrong Yi ; et al.	2008-01-03
Method for wafer level package of sensor chip App 20070224728 - Wu; Enboa ; et al.	2007-09-27
Light emitting diode covered with a reflective layer and method for fabricating the same Grant 7,271,020 - Wu , et al. September 18, 2	2007-09-18
Light emitting diode die with at least one phosphor layer and method for forming the same App 20070145884 - Wu; Enboa ; et al.	2007-06-28
Light emitting device App 20070146256 - Wu; Enboa ; et al.	2007-06-28
Optical subassembly of optical transceiver Grant 7,203,426 - Wu , et al. April 10, 2	2007-04-10
Method for self-assembling microstructures App 20070007237 - Wu; Enboa ; et al.	2007-01-11
Optical subassembly of optical transceiver App 20060274999 - Wu; Enboa ; et al.	2006-12-07
Thermal enhanced low profile package structure and method for fabricating the same App 20060237827 - Wu; Enboa ; et al.	2006-10-26
Structure of electronic package and method for fabricating the same App 20060108146 - Wu; Enboa ; et al.	2006-05-25
Multi-wavelength optical transceiver subassembly module App 20060088255 - Wu; Enboa ; et al.	2006-04-27
Light emitting diode covered with a reflective layer and method for fabricating the same App 20060086943 - Wu; Enboa ; et al.	2006-04-27
Tunable long period fiber grating structure and fabrication method Grant 7,013,066 - Wu , et al. March 14, 2	2006-03-14
Electronic substrate having an aperture position through a substrate, conductive pads, and an insulating layer Grant 6,459,150 - Wu , et al. October 1, 2	2002-10-01
Wafer level package incorporating dual stress buffer layers for I/O redistribution and method for fabrication Grant 6,433,427 - Wu , et al. August 13, 2	2002-08-13
Wafer Level Package Incorporating Dual Stress Buffer Layers For I/o Redistribution App 20020093107 - Wu, Enboa ; et al.	2002-07-18

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