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Patent applications and USPTO patent grants for Wu; Daike.The latest application filed is for "fabrication of conductive metal layer on semiconductor devices".
Patent | Date |
---|---|
Method for fabrication of a semiconductor device Grant 8,034,643 - Kang , et al. October 11, 2 | 2011-10-11 |
Fabrication of semiconductor devices for light emission Grant 8,004,001 - Yuan , et al. August 23, 2 | 2011-08-23 |
Fabrication of Conductive Metal Layer on Semiconductor Devices App 20080210970 - Kang; Xuejun ;   et al. | 2008-09-04 |
Fabrication of Semiconductor Devices App 20080164480 - Kang; Xuejun ;   et al. | 2008-07-10 |
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