Wu; Chung-Lin

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wu; Chung-Lin.The latest application filed is for "vertical and horizontal circuit assemblies".

Company Profile

6.56.57

Wu; Chung-Lin - San Jose CA
Wu; Chung-Lin - Taichung TW
Wu; Chung-Lin - Hsinchu TW
Wu; Chung-Lin - Hsinchu City TW
Wu; Chung-Lin - Taichung City TW
Wu, Chung-Lin - Chang Hua Hsien TW
Wu; Chung-Lin - Taipei TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Substrate interposer on a leaderframe Grant 11,296,069 - Cabahug , et al. April 5, 2	2022-04-05
Vertical And Horizontal Circuit Assemblies App 20220059443 - TEYSSEYRE; Jerome ; et al.	2022-02-24
Vertical and horizontal circuit assemblies Grant 11,177,203 - Teysseyre , et al. November 16, 2	2021-11-16
Electronic Device Packaging With Galvanic Isolation App 20210193561 - Estacio; Maria Cristina ; et al.	2021-06-24
Semiconductor device assemblies Grant 11,004,777 - Teysseyre , et al. May 11, 2	2021-05-11
Electronic device packaging with galvanic isolation Grant 10,943,855 - Estacio , et al. March 9, 2	2021-03-09
Semiconductor Device Assemblies App 20200411421 - TEYSSEYRE; Jerome ; et al.	2020-12-31
Substrate Interposer On A Leadframe App 20200219866 - CABAHUG; Elsie Agdon ; et al.	2020-07-09
Substrate interposer on a leadframe Grant 10,546,847 - Cabahug , et al. Ja	2020-01-28
Isolation between semiconductor components Grant 10,446,498 - Constantino , et al. Oc	2019-10-15
Vertical And Horizontal Circuit Assemblies App 20190181083 - TEYSSEYRE; Jerome ; et al.	2019-06-13
Vertical and horizontal circuit assemblies Grant 10,256,178 - Teysseyre , et al.	2019-04-09
Electronic Device Packaging With Galvanic Isolation App 20190067171 - ESTACIO; Maria Cristina ; et al.	2019-02-28
Vertical And Horizontal Circuit Assemblies App 20180068935 - TEYSSEYRE; Jerome ; et al.	2018-03-08
Isolation Between Semiconductor Components App 20170373008 - CONSTANTINO; John ; et al.	2017-12-28
Isolation between semiconductor components Grant 9,735,112 - Constantino , et al. August 15, 2	2017-08-15
Packaged semiconductor devices and methods of manufacturing Grant 9,536,800 - Ashrafzadeh , et al. January 3, 2	2017-01-03
Package including a semiconductor die and a capacitive component Grant 9,478,519 - Ashrafzadeh , et al. October 25, 2	2016-10-25
Substrate Interposer On A Leadframe App 20160284631 - CABAHUG; Elsie Agdon ; et al.	2016-09-29
Data writing method, and memory controller and memory storage apparatus using the same Grant 9,378,130 - Wu , et al. June 28, 2	2016-06-28
Common drain power clip for battery pack protection mosfet Grant 9,379,045 - Wu , et al. June 28, 2	2016-06-28
Capacitive shear force sensor and method for fabricating thereof Grant 9,347,838 - Chen , et al. May 24, 2	2016-05-24
Package Including A Semiconductor Die And A Capacitive Component App 20160126219 - ASHRAFZADEH; Ahmad R. ; et al.	2016-05-05
Apparatus related to an improved package including a semiconductor die Grant 9,177,925 - Ashrafzadeh , et al. November 3, 2	2015-11-03
Semiconductor die package and method for making the same Grant 9,159,656 - Jeon , et al. October 13, 2	2015-10-13
Isolation Between Semiconductor Components App 20150200162 - CONSTANTINO; John ; et al.	2015-07-16
Packaged Semiconductor Devices And Methods Of Manufacturing App 20150162270 - ASHRAFZADEH; Ahmad R. ; et al.	2015-06-11
Methods And Apparatus Related To An Improved Package Including A Semiconductor Die App 20140312458 - ASHRAFZADEH; Ahmad ; et al.	2014-10-23
Wafer level MOSFET metallization Grant 8,866,218 - Kinzer , et al. October 21, 2	2014-10-21
Data writing method for a flash memory, and controller and storage system using the same Grant 8,806,301 - Yu , et al. August 12, 2	2014-08-12
Capacitive Shear Force Sensor And Method For Fabricating Thereof App 20140174204 - Chen; Sheng-Jui ; et al.	2014-06-26
Semiconductor Die Package And Method For Making The Same App 20140167238 - Jeon; Oseob ; et al.	2014-06-19
Multi-chip module power clip Grant 8,723,300 - Wu , et al. May 13, 2	2014-05-13
Flash memory storage device, controller thereof, and data programming method thereof Grant 8,706,952 - Hsu , et al. April 22, 2	2014-04-22
Common Drain Power Clip For Battery Pack Protection Mosfet App 20140070392 - Wu; Chung-Lin ; et al.	2014-03-13
Semiconductor die package and method for making the same Grant 8,664,752 - Jeon , et al. March 4, 2	2014-03-04
Multi-chip Module Power Clip App 20140042599 - Wu; Chung-Lin ; et al.	2014-02-13
Semiconductor dice with backside trenches filled with elastic material for improved attachment, packages using the same, and methods of making the same Grant 8,598,035 - Gruenhagen , et al. December 3, 2	2013-12-03
Data reading method, memory storage apparatus, and controller thereof Grant 8,578,245 - Yeh , et al. November 5, 2	2013-11-05
Wafer Level Mosfet Metallization App 20130277735 - KINZER; Daniel M. ; et al.	2013-10-24
Vertical MOSFET transistor having source/drain contacts disposed on the same side and method for manufacturing the same Grant 8,487,371 - Kinzer , et al. July 16, 2	2013-07-16
Data Writing Method, And Memory Controller And Memory Storage Apparatus Using The Same App 20130132640 - Wu; Chung-Lin ; et al.	2013-05-23
Wafer Level MOSFET Metallization App 20120248526 - Kinzer; Daniel M. ; et al.	2012-10-04
Thermal enhanced upper and dual heat sink exposed molded leadless package and method Grant 8,278,742 - Wu , et al. October 2, 2	2012-10-02
Storage device, memory controller, and data protection method Grant 8,255,656 - Yu , et al. August 28, 2	2012-08-28
Block management method for flash memory, and flash memory controller and flash memory storage device using the same Grant 8,230,162 - Yu , et al. July 24, 2	2012-07-24
Semiconductor Die Package And Method For Making The Same App 20120181675 - Jeon; Oseob ; et al.	2012-07-19
Data Reading Method, Memory Storage Apparatus, And Controller Thereof App 20120144267 - Yeh; Chih-Kang ; et al.	2012-06-07
High-power semiconductor die packages with integrated heat-sink capability and methods of manufacturing the same Grant 8,193,043 - Jeon , et al. June 5, 2	2012-06-05
Semiconductor die package and method for making the same Grant 8,183,088 - Jeon , et al. May 22, 2	2012-05-22
Semiconductor die structures for wafer-level chipscale packaging of power devices, packages and systems for using the same, and methods of making the same Grant 8,058,732 - Gruenhagen , et al. November 15, 2	2011-11-15
Semiconductor Dice With Backside Trenches Filled With Elastic Material For Improved Attachment, Packages Using The Same, And Methods Of Making The Same App 20110230046 - Gruenhagen; Michael D. ; et al.	2011-09-22
Flash Memory Storage Device, Controller Thereof, And Data Programming Method Thereof App 20110191525 - Hsu; Chih-Jen ; et al.	2011-08-04
Thermal enhanced upper and dual heat sink exposed molded leadless package Grant 7,968,982 - Wu , et al. June 28, 2	2011-06-28
Block Management Method For Flash Memory, And Flash Memory Controller And Flash Memory Storage Device Using The Same App 20110145482 - Yu; Hsiang-Hsiung ; et al.	2011-06-16
Semiconductor dice with backside trenches filled with elastic material for improved attachment, packages using the same, and methods of making the same Grant 7,960,800 - Gruenhagen , et al. June 14, 2	2011-06-14
Thermal Enhanced Upper And Dual Heat Sink Exposed Molded Leadless Package App 20110124158 - Wu; Chung-Lin ; et al.	2011-05-26
Data Writing Method For A Flash Memory, And Controller And Storage System Using The Same App 20110087950 - Yu; Hsiang-Hsiung ; et al.	2011-04-14
Storage Device, Memory Controller, And Data Protection Method App 20110066818 - Yu; Hsiang-Hsiung ; et al.	2011-03-17
High-power Semiconductor Die Packages With Integrated Heat-sink Capability And Methods Of Manufacturing The Same App 20110059580 - Jeon; Oseob ; et al.	2011-03-10
Device and method for optical nanoindentation measurement Grant 7,845,214 - Hsu , et al. December 7, 2	2010-12-07
Thin, thermally enhanced flip chip in a leaded molded package Grant 7,821,124 - Joshi , et al. October 26, 2	2010-10-26
Semiconductor Die Package And Method For Making The Same App 20100258925 - Jeon; Oseob ; et al.	2010-10-14
High-power semiconductor die packages with integrated heat-sink capability and methods of manufacturing the same Grant 7,800,219 - Jeon , et al. September 21, 2	2010-09-21
Semiconductor die package and method for making the same Grant 7,772,681 - Joshi , et al. August 10, 2	2010-08-10
Semiconductor Dice with Backside Trenches Filled With Elastic Material For Improved Attachment, Packages Using the Same, and Methods of Making the Same App 20100148325 - Gruenhagen; Michael D. ; et al.	2010-06-17
Semiconductor Die Structures for Wafer-Level Chipscale Packaging of Power Devices, Packages and Systems for Using the Same, and Methods of Making the Same App 20100123225 - Gruenhagen; Michael D. ; et al.	2010-05-20
Reliable Wafer-level Chip-scale Solder Bump Structure App 20100117231 - Lang; Dennis ; et al.	2010-05-13
Method for bonding a semiconductor substrate to a metal substrate Grant 7,635,635 - Yilmaz , et al. December 22, 2	2009-12-22
Semiconductor Package With Lead Intrusions App 20090261461 - Sapp; Steven ; et al.	2009-10-22
Device and method for optical nanoindentation measurement App 20090165537 - Hsu; Jiong-Shiun ; et al.	2009-07-02
High-Power Semiconductor Die Packages With Integrated Heat-Sink Capability and Methods of Manufacturing the Same App 20090166850 - Jeon; Oseob ; et al.	2009-07-02
Lead frame structure with aperture or groove for flip chip in a leaded molded package Grant 7,525,179 - Joshi , et al. April 28, 2	2009-04-28
Thermal Enhanced Upper And Dual Heat Sink Exposed Molded Leadless Package App 20090072362 - Wu; Chung-Lin ; et al.	2009-03-19
Thermal enhanced upper and dual heat sink exposed molded leadless package Grant 7,468,548 - Wu , et al. December 23, 2	2008-12-23
Thin, Thermally Enhanced Flip Chip In A Leaded Molded Package App 20080105957 - Joshi; Rajeev ; et al.	2008-05-08
Reliable Wafer-level Chip-scale Package Solder Bump Structure In A Packaged Semiconductor Device App 20080054461 - Lang; Dennis ; et al.	2008-03-06
Method of assembly for multi-flip chip on lead frame on overmolded IC package Grant 7,335,532 - Noquil , et al. February 26, 2	2008-02-26
Thin, thermally enhanced molded package with leadframe having protruding region Grant 7,332,806 - Joshi , et al. February 19, 2	2008-02-19
Method for bonding a semiconductor substrate to a metal substrate App 20070238263 - Yilmaz; Hamza ; et al.	2007-10-11
Thermal enhanced upper and dual heat sink exposed molded leadless package App 20070132091 - Wu; Chung-Lin ; et al.	2007-06-14
Method Of Assembly For Multi-flip Chip On Lead Frame On Overmolded Ic Package App 20070072347 - Noquil; Jonathan A. ; et al.	2007-03-29
Semiconductor die package and method for making the same App 20070001278 - Jeon; Oseob ; et al.	2007-01-04
Multi-flip chip on lead frame on over molded IC package and method of assembly Grant 7,154,186 - Noquil , et al. December 26, 2	2006-12-26
Lead frame structure with aperture or groove for flip chip in a leaded molded package App 20060284291 - Joshi; Rajeev ; et al.	2006-12-21
Lead frame structure with aperture or groove for flip chip in a leaded molded package Grant 7,081,666 - Joshi , et al. July 25, 2	2006-07-25
Method for making a semiconductor die package Grant 7,022,548 - Joshi , et al. April 4, 2	2006-04-04
Multi-flip chip on lead frame on over molded IC package and method of assembly App 20050206010 - Noquil, Jonathan A. ; et al.	2005-09-22
Wafer-level chip scale package and method for fabricating and using the same App 20050176233 - Joshi, Rajeev ; et al.	2005-08-11
Lead frame structure with aperture or groove for flip chip in a leaded molded package App 20050133893 - Joshi, Rajeev ; et al.	2005-06-23
Thin, thermally enhanced flip chip in a leaded molded package App 20050127483 - Joshi, Rajeev ; et al.	2005-06-16
Thin, thermally enhanced flip chip in a leaded molded package Grant 6,891,256 - Joshi , et al. May 10, 2	2005-05-10
Lead frame structure with aperture or groove for flip chip in a leaded molded package Grant 6,867,481 - Joshi , et al. March 15, 2	2005-03-15
Structure of integrated trace of chip package Grant 6,836,023 - Joshi , et al. December 28, 2	2004-12-28
Lead frame structure with aperture or groove for flip chip in a leaded molded package App 20040201081 - Joshi, Rajeev ; et al.	2004-10-14
Wafer-level chip scale package and method for fabricating and using the same App 20040191955 - Joshi, Rajeev ; et al.	2004-09-30
Semiconductor die including conductive columns App 20040137724 - Joshi, Rajeev ; et al.	2004-07-15
Semiconductor die including conductive columns Grant 6,683,375 - Joshi , et al. January 27, 2	2004-01-27
Structure of integrated trace of chip package App 20030197278 - Joshi, Rajeev ; et al.	2003-10-23
Thin, thermally enhanced flip chip in a leaded molded package App 20030075786 - Joshi, Rajeev ; et al.	2003-04-24
Structure rope buckle App 20030037417 - Shen, Yi-Chin ; et al.	2003-02-27
Semiconductor die including conductive columns App 20020192935 - Joshi, Rajeev ; et al.	2002-12-19
Ion sensitive transistor Grant 6,236,075 - Hsiung , et al. May 22, 2	2001-05-22

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