Wu; Chung-Jung

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wu; Chung-Jung.The latest application filed is for "packaged semiconductor device including liquid-cooled lid and methods of forming the same".

Company Profile

2.8.13

Wu; Chung-Jung - Hsinchu TW
Wu; Chung-Jung - Hsinchu City TW
Wu; Chung-Jung - Jhubei City TW
Wu; Chung-Jung - Tainan TW
WU; Chung-Jung - Tainan City TW
Wu; Chung-Jung - Taoyuan County TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Packaged Semiconductor Device Including Liquid-Cooled Lid and Methods of Forming the Same App 20220310482 - Hsiao; Sheng-Tsung ; et al.	2022-09-29
Semiconductor Device And Manufacturing Method Thereof App 20220262705 - Wu; Chung-Jung ; et al.	2022-08-18
Packaged semiconductor device including liquid-cooled lid and methods of forming the same Grant 11,410,910 - Hsiao , et al. August 9, 2	2022-08-09
Semiconductor device and manufacturing method thereof Grant 11,387,164 - Wu , et al. July 12, 2	2022-07-12
Semiconductor device and manufacturing method thereof Grant 11,342,242 - Wu , et al. May 24, 2	2022-05-24
Method For Proximity Sensing And Applied Electronic Device Thereof App 20220057852 - Lin; Wang-An ; et al.	2022-02-24
Capacitance Sensing Device Operation Method App 20220057540 - LIN; WANG-AN ; et al.	2022-02-24
Packaged Semiconductor Device Including Liquid-Cooled Lid and Methods of Forming the Same App 20220037231 - Hsiao; Sheng-Tsung ; et al.	2022-02-03
Proximity Detection Method And Circuit Thereof App 20220021387 - LIN; WANG-AN ; et al.	2022-01-20
Method Of Forming Semiconductor Package With Composite Thermal Interface Material Structure App 20210384103 - SHAO; Tung-Liang ; et al.	2021-12-09
Semiconductor package with composite thermal interface material structure and method of forming the same Grant 11,107,747 - Shao , et al. August 31, 2	2021-08-31
Semiconductor Device And Manufacturing Method Thereof App 20210066164 - Wu; Chung-Jung ; et al.	2021-03-04
Semiconductor Package With Composite Thermal Interface Material Structure And Method Of Forming The Same App 20200091034 - SHAO; Tung-Liang ; et al.	2020-03-19
Solder bump stretching method for forming a solder bump joint in a device Grant 9,978,709 - Yang , et al. May 22, 2	2018-05-22
Solder Bump Stretching Method For Forming A Solder Bump Joint In A Device App 20170012019 - YANG; Su-Chun ; et al.	2017-01-12
Solder bump joint in a device including lamellar structures Grant 9,475,145 - Yang , et al. October 25, 2	2016-10-25
Handheld electronic device and flashlight module Grant 8,870,403 - Tsai , et al. October 28, 2	2014-10-28
Solder Bump Stretching Method For Forming A Solder Bump Joint In A Device App 20130221521 - Yang; Su-Chun ; et al.	2013-08-29
Handheld Electronic Device And Flashlight Module App 20130163229 - Tsai; Meng-Han ; et al.	2013-06-27

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