Wu; Chin-Ta

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wu; Chin-Ta.The latest application filed is for "head of a chip picker".

Company Profile

2.5.7

Wu; Chin-Ta - Hsinchu TW
WU; Chin-Ta - Hukou Township TW
WU; Chin-Ta - Hukou TW
Wu; Chin-Ta - Hsinchu County TW
Wu; Chin-Ta - Jiading Hsiang Kaohsiung Hsien TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor package having partial outer metal layer and packaging method thereof Grant 11,410,945 - Chen , et al. August 9, 2	2022-08-09
Wafer storage device, carrier plate and wafer cassette Grant 11,367,641 - Wu , et al. June 21, 2	2022-06-21
Head Of A Chip Picker App 20220118631 - CHOU; Wu-Yi ; et al.	2022-04-21
Laser Cutting Method For A Wafer App 20210339338 - CHIU; Chui-Liang ; et al.	2021-11-04
Semiconductor Package Having Partial Outer Metal Layer And Packaging Method Thereof App 20210288003 - CHEN; Shih-Chun ; et al.	2021-09-16
Semiconductor Packaging Structure With Back-deposited Shielding Layer And Manufacturing Method Thereof App 20210217632 - CHEN; Shih-Chun ; et al.	2021-07-15
Chip Carrier Device App 20210217641 - CHEN; Shih-Chun ; et al.	2021-07-15
Wafer Storage Device, Carrier Plate And Wafer Cassette App 20210193492 - WU; Chin-Ta ; et al.	2021-06-24
Wafer processing method with full edge trimming Grant 10,388,535 - Chiu , et al. A	2019-08-20
Laser Color Marking Method For A Semiconductor Package App 20190229064 - Wu; Chin-Ta ; et al.	2019-07-25
PU foam rubber fluid applicator Grant 7,000,805 - Wu , et al. February 21, 2	2006-02-21
Methods of fabricating a word-line spacer for wide over-etching window on outside diameter (OD) and strong fence Grant 6,869,837 - Liu , et al. March 22, 2	2005-03-22

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