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Method for forming semiconductor device having isolation structures with different thicknesses Grant 11,450,555 - Wu , et al. September 20, 2 | 2022-09-20 |
MIM capacitor with a symmetrical capacitor insulator structure Grant 11,430,729 - Lin , et al. August 30, 2 | 2022-08-30 |
Film Structure For Bond Pad App 20220254744 - Yang; Julie ;   et al. | 2022-08-11 |
Data Storage Structure For Improving Memory Cell Reliability App 20220238802 - Trinh; Hai-Dang ;   et al. | 2022-07-28 |
Method For Manufacturing Reflective Structure App 20220173290 - LIN; CHIA-HUA ;   et al. | 2022-06-02 |
Strained Gate Semiconductor Device With Doped Interlayer Dielectric Material App 20220165882 - WU; Cheng-Ta ;   et al. | 2022-05-26 |
Film structure for bond pad Grant 11,322,464 - Yang , et al. May 3, 2 | 2022-05-03 |
Data storage structure for improving memory cell reliability Grant 11,309,491 - Trinh , et al. April 19, 2 | 2022-04-19 |
Mim Capacitor With A Symmetrical Capacitor Insulator Structure App 20220084935 - Lin; Hsing-Lien ;   et al. | 2022-03-17 |
Strained gate semiconductor device with oxygen-doped interlayer dielectric material Grant 11,271,114 - Wu , et al. March 8, 2 | 2022-03-08 |
Top-electrode Barrier Layer For Rram App 20220069215 - Lin; Hsing-Lien ;   et al. | 2022-03-03 |
Method To Reduce Breakdown Failure In A Mim Capacitor App 20220069068 - Lin; Hsing-Lien ;   et al. | 2022-03-03 |
Semiconductor structure Grant 11,257,997 - Lin , et al. February 22, 2 | 2022-02-22 |
Top-electrode barrier layer for RRAM Grant 11,152,568 - Lin , et al. October 19, 2 | 2021-10-19 |
Method to reduce breakdown failure in a MIM capacitor Grant 11,152,455 - Lin , et al. October 19, 2 | 2021-10-19 |
Wireless camera wafer for vacuum chamber diagnostics Grant 11,131,025 - Tsai , et al. September 28, 2 | 2021-09-28 |
Method of forming a device having a doping layer and device formed Grant 11,094,583 - Wu , et al. August 17, 2 | 2021-08-17 |
Formation of silicide contacts in semiconductor devices Grant 11,081,563 - Tsai , et al. August 3, 2 | 2021-08-03 |
Semiconductor Structure App 20210202809 - LIN; CHIA-HUA ;   et al. | 2021-07-01 |
Method For Forming Semiconductor Device Having Isolation Structures With Different Thicknesses App 20210202301 - WU; Cheng-Ta ;   et al. | 2021-07-01 |
Rram Structure App 20210159407 - Trinh; Hai-Dang ;   et al. | 2021-05-27 |
Semiconductor Structure And Method For Forming The Same App 20210135102 - LIN; HSING-LIEN ;   et al. | 2021-05-06 |
Film Structure For Bond Pad App 20210098398 - Yang; Julie ;   et al. | 2021-04-01 |
Method To Reduce Breakdown Failure In A Mim Capacitor App 20210091169 - Lin; Hsing-Lien ;   et al. | 2021-03-25 |
Semiconductor device having isolation structures with different thicknesses Grant 10,950,490 - Wu , et al. March 16, 2 | 2021-03-16 |
Diffusion Barrier Layer In Top Electrode To Increase Break Down Voltage App 20210074805 - Lin; Hsing-Lien ;   et al. | 2021-03-11 |
Resistive Memory Cell Having A Low Forming Voltage App 20210066591 - Trinh; Hai-Dang ;   et al. | 2021-03-04 |
Data Storage Structure For Improving Memory Cell Reliability App 20210066587A1 - | 2021-03-04 |
RRAM structure Grant 10,910,560 - Trinh , et al. February 2, 2 | 2021-02-02 |
Wireless Camera Wafer For Vacuum Chamber Diagnostics App 20210005487 - Tsai; Tzu-Chung ;   et al. | 2021-01-07 |
Top-electrode Barrier Layer For Rram App 20200411758 - Lin; Hsing-Lien ;   et al. | 2020-12-31 |
Semiconductor device and forming method thereof Grant 10,879,354 - Wu , et al. December 29, 2 | 2020-12-29 |
Semiconductor device structure with multiple resistance variable layers Grant 10,868,247 - Trinh , et al. December 15, 2 | 2020-12-15 |
Physical Vapor Deposition Chamber With Target Surface Morphology Monitor App 20200377997 - Trinh; Hai-Dang ;   et al. | 2020-12-03 |
Method to enhance electrode adhesion stability Grant 10,818,544 - Lin , et al. October 27, 2 | 2020-10-27 |
Strained Gate Semiconductor Device With Doped Interlayer Dielectric Material App 20200295193 - WU; Cheng-Ta ;   et al. | 2020-09-17 |
Semiconductor Device Structure With Multiple Resistance Variable Layers App 20200274058 - Trinh; Hai-Dang ;   et al. | 2020-08-27 |
Wireless camera wafer for vacuum chamber diagnostics Grant 10,748,798 - Tsai , et al. A | 2020-08-18 |
Strained gate semiconductor device having an interlayer dielectric doped with oxygen and a large species material Grant 10,672,909 - Wu , et al. | 2020-06-02 |
Semiconductor device structure with multiple resistance variable layers Grant 10,658,581 - Trinh , et al. | 2020-05-19 |
Rram Structure App 20200098985 - Trinh; Hai-Dang ;   et al. | 2020-03-26 |
Semiconductor Device And Method For Manufacturing The Same App 20200052203 - TRINH; HAI-DANG ;   et al. | 2020-02-13 |
Method for manufacturing multi-voltage devices using high-K-metal-gate (HKMG) technology Grant 10,535,568 - Tsao , et al. Ja | 2020-01-14 |
Method Of Forming A Device Having A Doping Layer And Device Formed App 20190214297 - WU; Chii-Ming ;   et al. | 2019-07-11 |
Semiconductor Device Structure With Multiple Resistance Variable Layers App 20190157553 - TRINH; Hai-Dang ;   et al. | 2019-05-23 |
Semiconductor Device Having Isolation Structures With Different Thicknesses App 20190139814 - WU; Cheng-Ta ;   et al. | 2019-05-09 |
Method For Manufacturing Multi-voltage Devices Using High-k-metal-gate (hkmg) Technology App 20190139837 - Tsao; Chun-Han ;   et al. | 2019-05-09 |
Method To Enhance Electrode Adhesion Stability App 20190096753 - Lin; Hsing-Lien ;   et al. | 2019-03-28 |
Method for manufacturing multi-voltage devices using high-K-metal-gate (HKMG) technology Grant 10,177,043 - Tsao , et al. J | 2019-01-08 |
Method of forming a device having a doping layer and device formed Grant 10,157,780 - Wu , et al. Dec | 2018-12-18 |
Semiconductor device having isolation structures with different thickness and method of forming the same Grant 10,157,770 - Wu , et al. Dec | 2018-12-18 |
Method of forming ultra-shallow junctions in semiconductor devices Grant 10,128,115 - Nieh , et al. November 13, 2 | 2018-11-13 |
Strained Gate Semiconductor Device With Doped Interlayer Dielectric Material App 20180308979 - WU; Cheng-Ta ;   et al. | 2018-10-25 |
Methods for straining a transistor gate through interlayer dielectric (ILD) doping schemes Grant 10,020,401 - Wu , et al. July 10, 2 | 2018-07-10 |
Semiconductor devices, FinFET devices and methods of forming the same Grant 9,997,633 - Hsiao , et al. June 12, 2 | 2018-06-12 |
Method Of Forming A Device Having A Doping Layer And Device Formed App 20180151419 - WU; Chii-Ming ;   et al. | 2018-05-31 |
Semiconductor Device And Forming Method Thereof App 20180151670 - WU; Chii-Ming ;   et al. | 2018-05-31 |
Methods for Straining a Transistor Gate through Interlayer Dielectric (ILD) Doping Schemes App 20180151740 - WU; Cheng-Ta ;   et al. | 2018-05-31 |
Semiconductor Device Having Isolation Structure And Method Of Forming The Same App 20180151414 - WU; Cheng-Ta ;   et al. | 2018-05-31 |
Fin field effect transistor and method for fabricating the same Grant 9,929,268 - Wu , et al. March 27, 2 | 2018-03-27 |
Method of fabricating gate electrode using a treated hard mask Grant 9,881,840 - Huang , et al. January 30, 2 | 2018-01-30 |
Semiconductor device and manufacturing method of the same Grant 9,859,129 - Kuo , et al. January 2, 2 | 2018-01-02 |
Fin Field Effect Transistor And Method For Fabricating The Same App 20170301793 - Wu; Chii-Ming ;   et al. | 2017-10-19 |
Semiconductor Device And Manufacturing Method Of The Same App 20170250089 - Kuo; Ting-Huang ;   et al. | 2017-08-31 |
Fin Field Effect Transistor And Method For Fabricating The Same App 20170250268 - Hsiao; Ru-Shang ;   et al. | 2017-08-31 |
Method of manufacturing strained source/drain structures Grant 9,698,057 - Nieh , et al. July 4, 2 | 2017-07-04 |
Semiconductor device and method for forming the same Grant 9,653,594 - Tsai , et al. May 16, 2 | 2017-05-16 |
Fin field effect transistor and method for fabricating the same Grant 9,620,503 - Liao , et al. April 11, 2 | 2017-04-11 |
Semiconductor Devices, Finfet Devices And Methods Of Forming The Same App 20170098711 - Hsiao; Ru-Shang ;   et al. | 2017-04-06 |
Tilt implantation for STI formation in FinFET structures Grant 9,570,557 - Chou , et al. February 14, 2 | 2017-02-14 |
Source/drain formation and structure Grant 9,537,004 - Wu , et al. January 3, 2 | 2017-01-03 |
Tilt Implantation For Sti Formation In Finfet Structures App 20160322462 - CHOU; Chen Cheng ;   et al. | 2016-11-03 |
Semiconductor Device and Method for Forming the Same App 20160163847 - Tsai; Wen-Chi ;   et al. | 2016-06-09 |
Semiconductor device and method for forming the same Grant 9,252,019 - Tsai , et al. February 2, 2 | 2016-02-02 |
Improved Formation Of Silicide Contacts In Semiconductor Devices App 20150380509 - Tsai; Yan-Ming ;   et al. | 2015-12-31 |
Method of making a shallow trench isolation (STI) structures Grant 9,184,088 - Huang , et al. November 10, 2 | 2015-11-10 |
Method of Manufacturing Strained Source/Drain Structures App 20150262886 - Nieh; Chun-Feng ;   et al. | 2015-09-17 |
Formation of silicide contacts in semiconductor devices Grant 9,129,842 - Tsai , et al. September 8, 2 | 2015-09-08 |
Mechanisms for forming stressor regions in a semiconductor device Grant 9,117,745 - Tsai , et al. August 25, 2 | 2015-08-25 |
Formation Of Silicide Contacts In Semiconductor Devices App 20150206881 - Tsai; Yan-Ming ;   et al. | 2015-07-23 |
Mechanisms for forming ultra shallow junction Grant 9,048,181 - Wu , et al. June 2, 2 | 2015-06-02 |
Method of manufacturing strained source/drain structures Grant 9,048,253 - Nieh , et al. June 2, 2 | 2015-06-02 |
Method And Apparatus For Thermal Mapping And Thermal Process Control App 20150069046 - TSAI; CHUN HSIUNG ;   et al. | 2015-03-12 |
Mechanisms For Forming Ultra Shallow Junction App 20140342537 - WU; Chii-Ming ;   et al. | 2014-11-20 |
Mechanisms of doping oxide for forming shallow trench isolation Grant 8,877,602 - Huang , et al. November 4, 2 | 2014-11-04 |
Methods of manufacturing metal-silicide features Grant 8,791,528 - Lin , et al. July 29, 2 | 2014-07-29 |
Rapid thermal annealing to reduce pattern effect Grant 8,753,980 - Tsai , et al. June 17, 2 | 2014-06-17 |
Mechanisms For Forming Stressor Regions In A Semiconductor Device App 20140154876 - TSAI; Chun Hsiung ;   et al. | 2014-06-05 |
Mechanisms for forming ultra shallow junction Grant 8,735,266 - Wu , et al. May 27, 2 | 2014-05-27 |
Method Of Making A Shallow Trench Isolation (sti) Structures App 20140120693 - HUANG; Yu-Lien ;   et al. | 2014-05-01 |
Method of Manufacturing Strained Source/Drain Structures App 20140024188 - Nieh; Chun-Feng ;   et al. | 2014-01-23 |
Mechanisms For Forming Ultra Shallow Junction App 20130334605 - WU; Chii-Ming ;   et al. | 2013-12-19 |
Doped oxide for shallow trench isolation (STI) Grant 8,592,915 - Huang , et al. November 26, 2 | 2013-11-26 |
Method of manufacturing strained source/drain structures Grant 8,569,139 - Nieh , et al. October 29, 2 | 2013-10-29 |
Method for making a disilicide Grant 8,536,010 - Nieh , et al. September 17, 2 | 2013-09-17 |
Mechanisms for forming ultra shallow junction Grant 8,536,658 - Wu , et al. September 17, 2 | 2013-09-17 |
Rapid Thermal Annealing To Reduce Pattern Effect App 20130143418 - TSAI; Chun Hsiung ;   et al. | 2013-06-06 |
Semiconductor Device and Method for Forming the Same App 20130049219 - Tsai; Wen-Chi ;   et al. | 2013-02-28 |
Asymmetric rapid thermal annealing to reduce pattern effect Grant 8,383,513 - Tsai , et al. February 26, 2 | 2013-02-26 |
Mechanisms For Forming Ultra Shallow Junction App 20130037863 - WU; Chii-Ming ;   et al. | 2013-02-14 |
Method For Making A Disilicide App 20130034944 - NIEH; Chun-Wen ;   et al. | 2013-02-07 |
Method Of Fabricating Gate Elctrode Using A Treated Hard Mask App 20120315733 - HUANG; Yu-Lien ;   et al. | 2012-12-13 |
Source/Drain Formation and Structure App 20120299121 - Wu; Chii-Ming ;   et al. | 2012-11-29 |
Method for making a disilicide Grant 8,304,319 - Nieh , et al. November 6, 2 | 2012-11-06 |
Mechanisms for forming ultra shallow junction Grant 8,298,925 - Wu , et al. October 30, 2 | 2012-10-30 |
Doped Oxide For Shallow Trench Isolation (sti) App 20120187524 - HUANG; Yu-Lien ;   et al. | 2012-07-26 |
Mechanisms Of Doping Oxide For Forming Shallow Trench Isolation App 20120190167 - HUANG; Yu-Lien ;   et al. | 2012-07-26 |
Methods of manufacturing metal-silicide features Grant 8,202,799 - Lin , et al. June 19, 2 | 2012-06-19 |
Mechanisms For Forming Ultra Shallow Junction App 20120112248 - Wu; Chii-Ming ;   et al. | 2012-05-10 |
Method Of Manufacturing Strained Source/drain Structures App 20120108026 - NIEH; Chun-Feng ;   et al. | 2012-05-03 |
Asymmetric Rapid Thermal Annealing To Reduce Pattern Effect App 20120083135 - TSAI; Chun Hsiung ;   et al. | 2012-04-05 |
Method For Making A Disilicide App 20120012903 - NIEH; Chun-Wen ;   et al. | 2012-01-19 |
Method And Apparatus For Measuring Intra-die Temperature App 20110295539 - TSAI; Chun Hsiung ;   et al. | 2011-12-01 |
High Temperature Implantation Method For Stressor Formation App 20110212590 - Wu; Chii-Ming ;   et al. | 2011-09-01 |
Method Of Forming Ultra-shallow Junctions In Semiconductor Devices App 20110212592 - NIEH; Chun-Feng ;   et al. | 2011-09-01 |
Methods Of Manufacturing Metal-silicide Features App 20100314698 - Lin; Chen-Tung ;   et al. | 2010-12-16 |
Methods Of Manufacturing Metal-silicide Features App 20100273324 - Lin; Chen-Tung ;   et al. | 2010-10-28 |
Flash anneal for a PAI, NiSi process Grant 7,795,119 - Lo , et al. September 14, 2 | 2010-09-14 |
Methods of manufacturing metal-silicide features Grant 7,781,316 - Lin , et al. August 24, 2 | 2010-08-24 |
Method For Making A Thermally-stable Silicide App 20100151639 - Shue; Shau-Lin ;   et al. | 2010-06-17 |
Method of forming a MOS device with an additional layer Grant 7,732,289 - Wu , et al. June 8, 2 | 2010-06-08 |
Silicided regions for NMOS and PMOS devices Grant 7,687,861 - Wu , et al. March 30, 2 | 2010-03-30 |
Silicide formation with a pre-amorphous implant Grant 7,625,801 - Wu , et al. December 1, 2 | 2009-12-01 |
Flash Anneal for a PAI, NiSi Process App 20090020757 - Lo; Chia Ping ;   et al. | 2009-01-22 |
Method for silicide formation on semiconductor devices Grant 7,446,042 - Wu , et al. November 4, 2 | 2008-11-04 |
Silicide formation on SiGe Grant 7,432,559 - Lai , et al. October 7, 2 | 2008-10-07 |
Method for forming a semiconductor device Grant 7,405,151 - Wang , et al. July 29, 2 | 2008-07-29 |
Semiconductor structure including silicide regions and method of making same Grant 7,396,767 - Wu , et al. July 8, 2 | 2008-07-08 |
Silicide formation on SiGe App 20080121929 - Lai; Jerry ;   et al. | 2008-05-29 |
Silicide formation with a pre-amorphous implant App 20080070370 - Wu; Chii-Ming ;   et al. | 2008-03-20 |
Methods of Manufacturing Metal-Silicide Features App 20070284678 - Lin; Chen-Tung ;   et al. | 2007-12-13 |
Method for making a thermally stable silicide App 20070221993 - Shue; Shau-Lin ;   et al. | 2007-09-27 |
Methods of manufacturing metal-silicide features Grant 7,268,065 - Lin , et al. September 11, 2 | 2007-09-11 |
Method of forming contact plug on silicide structure Grant 7,256,137 - Wu , et al. August 14, 2 | 2007-08-14 |
Method for silicide formation on semiconductor devices App 20070178696 - Wu; Chii-Ming ;   et al. | 2007-08-02 |
Method of manufacturing a contact interconnection layer containing a metal and nitrogen by atomic layer deposition for deep sub-micron semiconductor technology Grant 7,235,482 - Wu , et al. June 26, 2 | 2007-06-26 |
Silicided regions for NMOS and PMOS devices App 20070090462 - Wu; Chii-Ming ;   et al. | 2007-04-26 |
Method of forming metal silicide Grant 7,205,234 - Wu , et al. April 17, 2 | 2007-04-17 |
Method of forming a MOS device with an additional layer App 20070010051 - Wu; Chii-Ming ;   et al. | 2007-01-11 |
Method to improve thermal stability of silicides with additives App 20060246720 - Wu; Chii-Ming ;   et al. | 2006-11-02 |
Semiconductor Device And Fabrication Method Thereof App 20060205235 - Wang; Gin Jei ;   et al. | 2006-09-14 |
Semiconductor device and fabrication method thereof Grant 7,078,810 - Wang , et al. July 18, 2 | 2006-07-18 |
Semiconductor device and fabrication method thereof App 20060113673 - Wang; Gin Jie ;   et al. | 2006-06-01 |
Method of forming silicided gate structure Grant 7,015,126 - Wu , et al. March 21, 2 | 2006-03-21 |
Semiconductor structure including silicide regions and method of making same App 20060011996 - Wu; Chii-Ming ;   et al. | 2006-01-19 |
Methods of manufacturing metal-silicide features App 20050280118 - Lin, Chen-Tung ;   et al. | 2005-12-22 |
Method of forming silicided gate structure App 20050272235 - Wu, Chii-Ming ;   et al. | 2005-12-08 |
Silicide formation using a metal-organic chemical vapor deposited capping layer App 20050239287 - Wang, Mei-Yun ;   et al. | 2005-10-27 |
Method of forming metal silicide App 20050176227 - Wu, Chii-Ming ;   et al. | 2005-08-11 |
Method of forming contact plug on silicide structure App 20050158986 - Wu, Chii-Ming ;   et al. | 2005-07-21 |
Sputtering process with temperature control for salicide application App 20050092598 - Wang, Mei-Yun ;   et al. | 2005-05-05 |
Method of forming contact plug on silicide structure Grant 6,884,736 - Wu , et al. April 26, 2 | 2005-04-26 |
Method of manufacturing a contact interconnection layer containing a metal and nitrogen by atomic layer deposition for deep sub-micron semiconductor technology App 20050054196 - Wu, Chii-Ming ;   et al. | 2005-03-10 |
Method of multi-element compound deposition by atomic layer deposition for IC barrier layer applications App 20050045092 - Wu, Chii-Ming ;   et al. | 2005-03-03 |
Method for depositing an adhesion/barrier layer to improve adhesion and contact resistance Grant 6,803,309 - Chou , et al. October 12, 2 | 2004-10-12 |
Novel method to reduce resistivity of atomic layer tungsten chemical vapor depositon App 20040074438 - Wu, Chii-Ming ;   et al. | 2004-04-22 |
Method of forming contact plug on silicide structure App 20040067635 - Wu, Chii-Ming ;   et al. | 2004-04-08 |
Method for depositing an adhesion/barrier layer to improve adhesion and contact resistance App 20040005775 - Chou, Shih-Wei ;   et al. | 2004-01-08 |