WU; Chia-Yang

Patent Applications and Registrations

Patent applications and USPTO patent grants for WU; Chia-Yang.The latest application filed is for "semiconductor device structure with barrier layer".

Company Profile

10.10.15

WU; Chia-Yang - Tainan City TW
Wu; Chia-Yang - Tainan TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Device Structure With Barrier Layer App 20220302283 - WU; Chia-Yang ; et al.	2022-09-22
Semiconductor device having source/drain with a protrusion Grant 11,270,888 - Wu , et al. March 8, 2	2022-03-08
Semiconductor Device Structure With Barrier Layer App 20210296472 - WU; Chia-Yang ; et al.	2021-09-23
Semiconductor device structure with barrier layer and method for forming the same Grant 11,031,488 - Wu , et al. June 8, 2	2021-06-08
Conductive Contact Having Staircase-Like Barrier Layers App 20210125935 - Wu; Chia-Yang ; et al.	2021-04-29
Conductive contact having staircase barrier layers Grant 10,886,226 - Wu , et al. January 5, 2	2021-01-05
Semiconductor Device With Dielectric Spacer Liner On Source/drain Contact App 20200343349 - HUNG; Chi-Cheng ; et al.	2020-10-29
Silicide implants Grant 10,763,338 - Wu , et al. Sep	2020-09-01
Semiconductor Device Having Source/drain With A Protrusion App 20200266069 - WU; Chia-Yang ; et al.	2020-08-20
Semiconductor Device Structure With Barrier Layer And Method For Forming The Same App 20200251577 - Kind Code	2020-08-06
Semiconductor device and method for manufacturing the same Grant 10,714,576 - Hung , et al.	2020-07-14
Method of forming semiconductor device using titanium-containing layer and device formed Grant 10,658,186 - Wu , et al.	2020-05-19
Semiconductor device structure with barrier layer and method for forming the same Grant 10,629,708 - Wu , et al.	2020-04-21
Conductive Contact Having Staircase-like Barrier Layers App 20200043858 - Wu; Chia-Yang ; et al.	2020-02-06
Semiconductor Device Structure With Barrier Layer And Method For Forming The Same App 20190148522 - WU; Chia-Yang ; et al.	2019-05-16
Method Of Forming Semiconductor Device Using Titanium-containing Layer And Device Formed App 20190148152 - WU; Chia-Yang ; et al.	2019-05-16
Silicide Implants App 20190067436 - WU; Chia-Yang ; et al.	2019-02-28
Method of forming semiconductor device using titanium-containing layer and device formed Grant 10,163,643 - Wu , et al. Dec	2018-12-25
Semiconductor Device And Method For Manufacturing The Same App 20180233565 - HUNG; Chi-Cheng ; et al.	2018-08-16
Method Of Forming Semiconductor Device Using Titanium-containing Layer And Device Formed App 20180166287 - WU; Chia-Yang ; et al.	2018-06-14
Semiconductor structure and manufacturing method thereof Grant 9,947,753 - Hung , et al. April 17, 2	2018-04-17
Semiconductor Structure And Manufacturing Method Thereof App 20160336412 - HUNG; Chi-Cheng ; et al.	2016-11-17
Cu/CuMn BARRIER LAYER AND FABRICATING METHOD THEREOF App 20140332961 - Lee; Wen-His ; et al.	2014-11-13
Self-forming Barrier Structure And Semiconductor Device Having The Same App 20140151884 - Lee; Wen-Hsi ; et al.	2014-06-05
Method for forming a damascene structure Grant 6,713,379 - Ku , et al. March 30, 2	2004-03-30

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