Wu; Chia-Hui
Patent Applications and Registrations
Patent applications and USPTO patent grants for Wu; Chia-Hui.The latest application filed is for "tunable light projector and light control element".
Company Profile
2.19.27
- Wu; Chia-Hui - Tainan TW
- Wu; Chia-Hui - Tainan City TW
- WU; Chia-Hui - Taoyuan City TW
- Wu; Chia-Hui - Lunbei Township Yunlin County TW
- Wu; Chia-Hui - Yunlin County TW
- Wu; Chia-Hui - Lunbei Township, Yunlin County N/A TW
- Wu; Chia-Hui - Taoyuan Shien TW
- Wu; Chia-Hui - Dalin Township Chiayi County TW
- Wu; Chia-Hui - Chiai County TW
- Wu; Chia-Hui - Tainan County TW
- WU; CHIA-HUI - Hsinhua TW
- Wu; Chia-Hui - Chiai TW
- Wu, Chia-Hui - Shanhwa Town TW
Patent Activity
| Patent | Date |
|---|---|
| Tunable light projector and light control element Grant 11,415,841 - Chen , et al. August 16, 2 | 2022-08-16 |
| Tunable Light Projector And Light Control Element App 20220179266 - Chen; Hung-Shan ; et al. | 2022-06-09 |
| Hinge And Smart Wearable Device With The Same App 20220082857 - CHEN; Chun-Lung ; et al. | 2022-03-17 |
| Stabilized Acyclic Saccharide Composite And Method For Stabilizing Acyclic Saccharides And Applications Thereof App 20220064201 - CHUNG; Po-Wen ; et al. | 2022-03-03 |
| Light-emitting device with yellow color filters Grant 10,804,441 - Wang , et al. October 13, 2 | 2020-10-13 |
| Light filter structure and image sensor Grant 10,670,784 - Wang , et al. | 2020-06-02 |
| Light-emitting Devices And Method For Fabricating The Same App 20200135985 - WANG; Wei-Ko ; et al. | 2020-04-30 |
| Optical sensor and manufacturing method thereof Grant 10,192,915 - Wang , et al. Ja | 2019-01-29 |
| Optical Sensor And Manufacturing Method Thereof App 20190027525 - WANG; Wei-Ko ; et al. | 2019-01-24 |
| Light Filter Structure And Image Sensor App 20180335555 - WANG; Wei-Ko ; et al. | 2018-11-22 |
| Hybrid image-sensing apparatus having filters permitting incident light in infrared region to be passed to time-of-flight pixel Grant 9,348,019 - Wang , et al. May 24, 2 | 2016-05-24 |
| Portable electrical device Grant 9,268,361 - Leung , et al. February 23, 2 | 2016-02-23 |
| Image Sensor For Light Field Device And Manufacturing Method Thereof App 20140183334 - WANG; Wei-Ko ; et al. | 2014-07-03 |
| Image-sensing Apparatus App 20140138519 - WANG; Wei-Ko ; et al. | 2014-05-22 |
| Portable Electrical Device App 20140118929 - LEUNG; Chee-Chun ; et al. | 2014-05-01 |
| Circuit board, fabricating method thereof and package structure Grant 8,674,503 - Cheng , et al. March 18, 2 | 2014-03-18 |
| Method for fabricating a proximity sensing module Grant 8,657,982 - Liang , et al. February 25, 2 | 2014-02-25 |
| Method For Fabricating A Proximity Sensing Module App 20130118676 - LIANG; Yuan-Chen ; et al. | 2013-05-16 |
| Circuit Board, Fabricating Method Thereof And Package Structure App 20130087906 - Cheng; Pai-Sheng ; et al. | 2013-04-11 |
| Electronic device and sliding assembly thereof Grant 8,199,478 - Liang , et al. June 12, 2 | 2012-06-12 |
| Computer-contained binder Grant 8,142,096 - Leung , et al. March 27, 2 | 2012-03-27 |
| Computer-contained binder Grant 8,137,020 - Leung , et al. March 20, 2 | 2012-03-20 |
| Built-in method of thermal dissipation layer for driver IC substrate and structure thereof Grant 8,017,873 - Wu September 13, 2 | 2011-09-13 |
| Electronic Device And Sliding Assembly Thereof App 20100309612 - Liang; Yuan-Chen ; et al. | 2010-12-09 |
| Computer-contained binder App 20100310302 - Leung; Chee-Chun ; et al. | 2010-12-09 |
| Computer-contained binder App 20100310303 - Leung; Chee-Chun ; et al. | 2010-12-09 |
| Built-in Method Of Thermal Dissipation Layer For Driver Ic Substrate And Structure Thereof App 20090218116 - Wu; Chia-Hui | 2009-09-03 |
| Method Of Manufacturing A Film Printed Circuit Board App 20090101513 - WU; CHIA-HUI ; et al. | 2009-04-23 |
| Semiconductor Device And Method Of Bump Formation App 20090091028 - Lin; Chiu-Shun ; et al. | 2009-04-09 |
| Method Of Manufacturing Chip On Film And Structure Thereof App 20090020316 - Wu; Chia-Hui ; et al. | 2009-01-22 |
| Method of manufacturing a film printed circuit board Grant 7,473,459 - Wu , et al. January 6, 2 | 2009-01-06 |
| Bonding pad and chip structure Grant 7,064,449 - Lin , et al. June 20, 2 | 2006-06-20 |
| Semiconductor package App 20060081968 - Bai; Shwang Shi ; et al. | 2006-04-20 |
| Bonding Pad And Chip Structure App 20060006531 - Lin; Chiu-Shun ; et al. | 2006-01-12 |
| Electrical connection structure App 20050133912 - Wu, Chia-Hui ; et al. | 2005-06-23 |
| Semiconductor device with bump electrodes Grant 6,861,749 - Wu , et al. March 1, 2 | 2005-03-01 |
| Casing for electronic devices and method for producing the same Grant 6,772,895 - Liang , et al. August 10, 2 | 2004-08-10 |
| Semiconductor Device And Manufacturing Method Thereof App 20040056351 - Wu, Chia-Hui ; et al. | 2004-03-25 |
| Casing for electronic devices and method for producing the same App 20030095376 - Liang, Yuan-Chen ; et al. | 2003-05-22 |
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