Wu; Chi tse

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wu; Chi tse.The latest application filed is for "sputtering targets, sputter reactors, methods of forming cast ingots, and methods of forming metallic articles".

Company Profile

0.7.11

Wu; Chi tse - Veradale WA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Sputtering Targets, Sputter Reactors, Methods Of Forming Cast Ingots, And Methods Of Forming Metallic Articles App 20120273097 - Wu; Chi tse ; et al.	2012-11-01
Copper sputtering targets and methods of forming copper sputtering targets Grant 7,767,043 - Segal , et al. August 3, 2	2010-08-03
Copper Sputtering Targets and Methods of Forming Copper Sputtering Targets App 20100059147 - Segal; Vladimir M. ; et al.	2010-03-11
Physical vapor deposition target constructions Grant 7,618,520 - Wu , et al. November 17, 2	2009-11-17
Novel manufacturing design and processing methods and apparatus for sputtering targets App 20090045044 - Akins; Jared ; et al.	2009-02-19
Copper Sputtering Targets and Methods of Forming Copper Sputtering Targets App 20090020192 - Segal; Vladimir M. ; et al.	2009-01-22
Physical vapor deposition target constructions App 20060070876 - Wu; Chi tse ; et al.	2006-04-06
Physical vapor deposition targets App 20050178661 - Yi, Wuwen ; et al.	2005-08-18
Copper-containing sputtering targets, and methods of forming copper-containing sputtering targets Grant 6,858,102 - Kardokus , et al. February 22, 2	2005-02-22
Methods of forming copper-containing sputtering targets Grant 6,849,139 - Kardokus , et al. February 1, 2	2005-02-01
Sputtering targets, sputter reactors, methods of forming cast ingots, and methods of forming metallic articles App 20040144643 - Wu, Chi tse ; et al.	2004-07-29
Copper sputtering targets and methods of forming copper sputtering targets App 20040072009 - Segal, Vladimir M. ; et al.	2004-04-15
Physical vapor deposition targets Grant 6,713,391 - Yi , et al. March 30, 2	2004-03-30
Physical vapor deposition targets, and methods of forming physical vapor deposition targets App 20040009087 - Yi, Wuwen ; et al.	2004-01-15
Copper sputtering target assembly and method of making same Grant 6,645,427 - Kardokus , et al. November 11, 2	2003-11-11
Methods of forming copper-containing sputtering targets App 20020112791 - Kardokus, Janine K. ; et al.	2002-08-22
Physical vapor deposition targets App 20020102849 - Yi, Wuwen ; et al.	2002-08-01
Copper sputtering target assembly and method of making same Grant 6,113,761 - Kardokus , et al. September 5, 2	2000-09-05

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