Wu; Chi-Chuan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wu; Chi-Chuan.The latest application filed is for "method for fabricating flip-chip semiconductor package with lead frame as chip carrier".

Company Profile

0.30.25

Wu; Chi-Chuan - Taichung Hsien TW
Wu; Chi-Chuan - Taichung TW
Wu; Chi-Chuan - Tai-Chung TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for fabricating flip-chip semiconductor package with lead frame as chip carrier Grant 7,781,264 - Wu , et al. August 24, 2	2010-08-24
Method for fabricating flip-chip semiconductor package with lead frame as chip carrier App 20070284710 - Wu; Chi-Chuan ; et al.	2007-12-13
Flip-chip semiconductor package with lead frame as chip carrier and fabrication method thereof Grant 7,274,088 - Wu , et al. September 25, 2	2007-09-25
Flip-chip semiconductor package with lead frame and method for fabricating the same Grant 7,170,168 - Wu , et al. January 30, 2	2007-01-30
Method of fabricating a thin and fine ball-grid array package with embedded heat spreader Grant 7,045,395 - Lo , et al. May 16, 2	2006-05-16
Flip-chip semiconductor package with lead frame and method for fabricating the same App 20060017173 - Wu; Chi-Chuan ; et al.	2006-01-26
Method of fabricating a thin and fine ball-grid array package with embedded heat spreader Grant 6,951,776 - Lo , et al. October 4, 2	2005-10-04
Method of fabricating a thin and fine ball-grid array package with embedded heat spreader Grant 6,949,413 - Lo , et al. September 27, 2	2005-09-27
Method of fabricating a thin and fine ball-grid array package with embedded heat spreader Grant 6,949,414 - Lo , et al. September 27, 2	2005-09-27
Method of fabricating a thin and fine ball-grid array package with embedded heat spreader Grant 6,933,175 - Lo , et al. August 23, 2	2005-08-23
Heat sink with collapse structure for semiconductor package Grant 6,858,931 - Huang , et al. February 22, 2	2005-02-22
Method of packaging multi chip module Grant 6,798,054 - Lo , et al. September 28, 2	2004-09-28
Semiconductor package having vertically mounted passive devices under a chip and a fabricating method thereof Grant 6,781,222 - Wu , et al. August 24, 2	2004-08-24
Semiconductor package and fabricating method thereof Grant 6,764,880 - Wu , et al. July 20, 2	2004-07-20
Semiconductor package with heat-dissipating structure and method of making the same Grant 6,753,602 - Wu June 22, 2	2004-06-22
Super low profile package with stacked dies Grant 6,731,015 - Wu , et al. May 4, 2	2004-05-04
Tape carrier package structure with dummy pads and dummy leads for package reinforcement Grant 6,713,850 - Yuan , et al. March 30, 2	2004-03-30
Method of mounting a passive component over an integrated circuit package substrate Grant 6,673,690 - Chuang , et al. January 6, 2	2004-01-06
Flip-chip semiconductor package with lead frame as chip carrier and fabrication method thereof App 20030230792 - Wu, Chi-Chuan ; et al.	2003-12-18
Lead frame and flip chip semiconductor package with the same Grant 6,661,087 - Wu December 9, 2	2003-12-09
Semiconductor package with heat-dissipating structure and method of making the same App 20030222336 - Wu, Chi Chuan	2003-12-04
Semiconductor package and fabricating method thereof App 20030214048 - Wu, Chi-Chuan ; et al.	2003-11-20
Method of fabricating a thin and fine ball-grid array package with embedded heat spreader App 20030178721 - Lo, Randy H.Y. ; et al.	2003-09-25
Method of fabricating a thin and fine ball-grid array package with embedded heat spreader App 20030162405 - Lo, Randy H.Y. ; et al.	2003-08-28
Stacked multi-chip package structure with on-chip integration of passive component Grant 6,611,434 - Lo , et al. August 26, 2	2003-08-26
Method of fabricating a thin and fine ball-grid array package with embedded heat spreader App 20030155647 - Lo, Randy H. Y. ; et al.	2003-08-21
Method of fabricating a thin and fine ball-grid array package with embedded heat spreader App 20030155648 - Lo, Randy H.Y. ; et al.	2003-08-21
Semiconductor package with heat-dissipating structure and method of making the same Grant 6,602,737 - Wu August 5, 2	2003-08-05
Method of fabricating a thin and fine ball-grid array package with embedded heat spreader App 20030134437 - Lo, Randy H. Y. ; et al.	2003-07-17
Stacked-die package structure Grant 6,593,662 - Pu , et al. July 15, 2	2003-07-15
Crack-preventive semiconductor package Grant 6,590,281 - Wu , et al. July 8, 2	2003-07-08
Crack-preventive Semiconductor Package App 20030092205 - Wu, Chi-Chuan ; et al.	2003-05-15
Heat sink with collapse structure and semiconductor package with heat sink App 20030089976 - Huang, Chien-Ping ; et al.	2003-05-15
Multiple stacked-chip packaging structure Grant 6,555,902 - Lo , et al. April 29, 2	2003-04-29
Lead frame and flip chip semiconductor package with the same App 20030067057 - Wu, Chi-Chuan	2003-04-10
Method of fabricating a thin and fine ball-grid array package with embedded heat spreader Grant 6,541,310 - Lo , et al. April 1, 2	2003-04-01
Heat sink with collapse structure and semiconductor package with heat sink Grant 6,538,321 - Huang , et al. March 25, 2	2003-03-25
Super low profile package with stacked dies App 20030025199 - Wu, Chi-Chuan ; et al.	2003-02-06
Flip chip type quad flat non-leaded package Grant 6,507,120 - Lo , et al. January 14, 2	2003-01-14
Multi-chip packaging structure Grant 6,507,098 - Lo , et al. January 14, 2	2003-01-14
Semiconductor package with heat dissipating structure Grant 6,472,743 - Huang , et al. October 29, 2	2002-10-29
Semiconductor package with heat-dissipating structure and method of making the same App 20020155640 - Wu, Chi Chuan	2002-10-24
Method Of Mounting An Exposed-pad Type Of Semiconductor Device Over A Printed Circuit Board App 20020146863 - Lin, Chieh-Yuan ; et al.	2002-10-10
Heat sink with collapse structure and semiconductor package with heat sink App 20020135076 - Huang, Chien-Ping ; et al.	2002-09-26
Semiconductor Package With Heat Dissipating Structure App 20020113308 - Huang, Chien-Ping ; et al.	2002-08-22
Semiconductor package for multi-chip stacks App 20020105789 - Chen, Yi-Hsin ; et al.	2002-08-08
Method of mounting a passive component over an integrated circuit package substrate App 20020098621 - Chuang, Jui Yu ; et al.	2002-07-25
DCA memory module and a fabrication method thereof App 20020094602 - Her, Tzong-Dar ; et al.	2002-07-18
Package structure stacking chips on front surface and back surface of substrate Grant 6,414,384 - Lo , et al. July 2, 2	2002-07-02
Package Structure Stacking Chips On Front Surface And Back Surface Of Substrate App 20020079567 - Lo, Randy H.Y. ; et al.	2002-06-27
Flip chip type quad flat non-leaded package App 20020079592 - Lo, Randy H.Y. ; et al.	2002-06-27
Passive element solder pad free of solder ball App 20020071935 - Wu, Chi-Chuan	2002-06-13
Multiple stacked-chip packaging structure App 20020014689 - Lo, Randy H.Y. ; et al.	2002-02-07
Method of singulating a batch of integrated circuit package units constructed on a single matrix base Grant 6,281,047 - Wu , et al. August 28, 2	2001-08-28
Wafer level packaging process of semiconductor Grant 6,242,283 - Lo , et al. June 5, 2	2001-06-05

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