Wu; Cheng-Tar

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wu; Cheng-Tar.The latest application filed is for "packages with molding structures and methods of forming the same".

Company Profile

0.4.5

Wu; Cheng-Tar - Jhongli TW
Wu; Cheng-Tar - Jhongli City TW
Wu; Cheng-Tar - Taoyuan Hsien TW
Wu; Cheng-Tar - Taipei TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Packages with molding structures and methods of forming the same Grant 10,157,849 - Huang , et al. Dec	2018-12-18
Wafer level chip scale package interconnects and methods of manufacture thereof Grant 9,892,962 - Wu , et al. February 13, 2	2018-02-13
Packages with Molding Structures and Methods of Forming the Same App 20170170124 - Huang; Chih-Fan ; et al.	2017-06-15
Wafer Level Chip Scale Package Interconnects and Methods of Manufacture Thereof App 20170154811 - Wu; Cheng-Tar ; et al.	2017-06-01
Packages with molding structures and methods of forming the same Grant 9,601,353 - Huang , et al. March 21, 2	2017-03-21
Packages With Molding Structures And Methods Of Forming The Same App 20160035666 - Huang; Chih-Fan ; et al.	2016-02-04
Biocidal polymer and process for preparing the same Grant 8,034,892 - Chang , et al. October 11, 2	2011-10-11
Platelet Adhesion-resistant Material App 20110129437 - TSAI; Ying-nan ; et al.	2011-06-02
Biocidal Polymer And Process For Preparing The Same App 20090318659 - CHANG; Ken-Yuan ; et al.	2009-12-24

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