Wu; Baoquan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wu; Baoquan.The latest application filed is for "fingerprint identification apparatus and electronic device".

Company Profile

13.10.15

Wu; Baoquan - Shenzhen CN
Wu; Baoquan - Guangdong CN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Fingerprint identification apparatus and electronic device Grant 11,403,870 - Liu , et al. August 2, 2	2022-08-02
Optical fingerprint identification apparatus and electronic device Grant 11,403,869 - Wu , et al. August 2, 2	2022-08-02
Optical fingerprint apparatus and electronic device Grant 11,321,957 - Wu , et al. May 3, 2	2022-05-03
Secondary packaging method and secondary package of through silicon via chip Grant 11,183,414 - Wu , et al. November 23, 2	2021-11-23
Fingerprint Identification Apparatus And Electronic Device App 20210326570 - LIU; Chenjin ; et al.	2021-10-21
Package Structure And Packaging Method App 20210118825 - LENG; Hanjian ; et al.	2021-04-22
Chip Interconnection Structure, Chip, And Chip Interconnection Method App 20210050330 - LENG; Hanjian ; et al.	2021-02-18
Method for fabricating fingerprint identification apparatus Grant 10,810,402 - Wu , et al. October 20, 2	2020-10-20
Fingerprint identification module and package structure of fingerprint identification chip Grant 10,810,400 - Wu , et al. October 20, 2	2020-10-20
Optical Fingerprint Apparatus And Electronic Device App 20200327299 - WU; Baoquan ; et al.	2020-10-15
Optical Fingerprint Identification Apparatus And Electronic Device App 20200327296 - WU; Baoquan ; et al.	2020-10-15
Optical module, fabrication method thereof, and terminal device using the same Grant 10,784,298 - Dong , et al. Sept	2020-09-22
Chip packaging structure and method, and electronic device Grant 10,770,413 - Wu , et al. Sep	2020-09-08
Optical Module, Fabrication Method Thereof, And Terminal Device Using The Same App 20190326339 - DONG; Haoxiang ; et al.	2019-10-24
Fingerprint identification module and method for manufacturing the same Grant 10,350,869 - Wu , et al. July 16, 2	2019-07-16
Chip Packaging Structure And Method, And Electronic Device App 20190081012 - WU; Baoquan ; et al.	2019-03-14
Secondary Packaging Method And Secondary Package Of Through Silicon Via Chip App 20190027390 - WU; Baoquan ; et al.	2019-01-24
Optical Fingerprint Sensor And Packaging Method Of Optical Fingerprint Sensor App 20190026525 - LONG; Wei ; et al.	2019-01-24
Fingerprint Identification Apparatus, Method For Fabricating Cover, And Electronic Terminal App 20190019009 - WU; Baoquan ; et al.	2019-01-17
Fingerprint Identification Module And Package Structure Of Fingerprint Identification Chip App 20190012516 - WU; Baoquan ; et al.	2019-01-10
Chip Packaging Structure And Chip Packaging Method App 20180102261 - LONG; Wei ; et al.	2018-04-12
Fingerprint Identification Module And Method For Manufacturing The Same App 20180015711 - WU; Baoquan ; et al.	2018-01-18
Chip packaging module Grant 9,831,216 - Wu , et al. November 28, 2	2017-11-28
Through Silicon Via Chip And Manufacturing Method Thereof, Fingerprint Identification Sensor And Terminal Device App 20170338191 - WU; Baoquan	2017-11-23
Chip Packaging Module App 20170092622 - WU; Baoquan ; et al.	2017-03-30

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