Wu; Albert

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wu; Albert.The latest application filed is for "systems and methods of autonomously controlling vehicle states".

Company Profile

9.119.60

Wu; Albert - San Jose CA
Wu; Albert - Taipei TW
WU; Albert - Calabasas CA
WU; Albert - Sunnyvale CA
Wu; Albert - Palo Alto CA
- Palo Alto CA US
Wu; Albert - San Marino CA
Wu; Albert - Paramus NJ
Wu; Albert - Paramns NJ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Trademarks

Patent Activity

Patent	Date
Systems And Methods Of Autonomously Controlling Vehicle States App 20220161797 - Wu; Albert ; et al.	2022-05-26
Systems and methods of autonomously controlling vehicle states Grant 11,247,675 - Wu , et al. February 15, 2	2022-02-15
Traffic management via internet of things (IoT) devices Grant 11,200,799 - Vrabete , et al. December 14, 2	2021-12-14
Vehicle control system using nonlinear dynamic model states and steering offset estimation Grant 11,014,569 - Ghasemalizadeh , et al. May 25, 2	2021-05-25
Systems And Methods For Performing Segmentation Based On Tensor Inputs App 20210056363 - SONG; Bing ; et al.	2021-02-25
Systems and methods of autonomously controlling vehicle lane change maneuver Grant 10,906,549 - Wu February 2, 2	2021-02-02
Systems And Methods Of Autonomously Controlling Vehicle States App 20200398836 - Wu; Albert ; et al.	2020-12-24
System And Method For Controlling Autonomous Vehicles App 20200363816 - ZUO; Zhiyuan ; et al.	2020-11-19
Apparatus And Method For Controlling Velocity Of Autonomous Driving Vehicle, And Storage Medium App 20200339153 - ZUO; Zhiyuan ; et al.	2020-10-29
Systems And Methods Of Autonomously Controlling Vehicle Lane Change Maneuver App 20200180633 - Wu; Albert	2020-06-11
Vehicle Control System Using Nonlinear Dynamic Model States And Steering Offset Estimation App 20200039523 - Ghasemalizadeh; Omid ; et al.	2020-02-06
TRAFFIC MANAGEMENT VIA INTERNET OF THINGS (IoT) DEVICES App 20190251837 - Vrabete; Bradut ; et al.	2019-08-15
Package assembly including a semiconductor substrate in which a first portion of a surface of the semiconductor substrate is recessed relative to a second portion of the surface of the semiconductor substrate to form a recessed region in the semiconductor substrate Grant 9,768,144 - Wu , et al. September 19, 2	2017-09-19
Method and apparatus for improving the reliability of a connection to a via in a substrate Grant 9,659,851 - Wang , et al. May 23, 2	2017-05-23
Methods of making packages using thin Cu foil supported by carrier Cu foil Grant 9,565,770 - Sutardja , et al. February 7, 2	2017-02-07
Resistive random access memory cell structure Grant 9,490,427 - Sutardja , et al. November 8, 2	2016-11-08
Method and apparatus for incorporating passive devices in an integrated passive device separate from a die Grant 9,444,510 - Leong , et al. September 13, 2	2016-09-13
Recessed semiconductor substrates and associated techniques Grant 9,391,045 - Wu , et al. July 12, 2	2016-07-12
Method and apparatus for mounting solder balls to an exposed pad or terminal of a semiconductor package Grant 9,368,433 - Wu June 14, 2	2016-06-14
Package Assembly Including A Semiconductor Substrate In Which A First Portion Of A Surface Of The Semiconductor Substrate Is Recessed Relative To A Second Portion Of The Surface Of The Semiconductor Substrate To Form A Recessed Region In The Semiconductor Substrate App 20160155732 - Wu; Albert ; et al.	2016-06-02
Resistive Random Access Memory Cell Structure App 20160087201 - Sutardja; Pantas ; et al.	2016-03-24
Systems and methods for increasing the read sensitivity of a resistive random access memory (RRAM) Grant 9,275,731 - Sutardja , et al. March 1, 2	2016-03-01
Package assembly having a semiconductor substrate Grant 9,275,929 - Liou , et al. March 1, 2	2016-03-01
Package assembly including a semiconductor substrate in which a first portion of a surface of the semiconductor substrate is recessed relative to a second portion of the surface of the semiconductor substrate to form a recessed region in the semiconductor substrate Grant 9,257,410 - Wu , et al. February 9, 2	2016-02-09
Reducing source contact to gate spacing to decrease transistor pitch Grant 9,245,961 - Wu , et al. January 26, 2	2016-01-26
Test engine for integrated circuit chip testing Grant 9,244,115 - Wu , et al. January 26, 2	2016-01-26
Resistive random access memory cell structure with reduced programming voltage Grant 9,214,230 - Sutardja , et al. December 15, 2	2015-12-15
Method And Apparatus For Mounting Solder Balls To An Exposed Pad Or Terminal Of A Semiconductor Package App 20150318232 - Wu; Albert	2015-11-05
Semiconductor Package With A Semiconductor Die Embedded Within Substrates App 20150311147 - Wu; Albert ; et al.	2015-10-29
Attaching passive components to a semiconductor package Grant 9,171,744 - Liou , et al. October 27, 2	2015-10-27
Recessed Semiconductor Substrates And Associated Techniques App 20150279806 - Wu; Albert ; et al.	2015-10-01
Resistive memory cell and method for forming a resistive memory cell Grant 9,147,837 - Sutardja , et al. September 29, 2	2015-09-29
Method and apparatus for forming shallow trench isolation structures having rounded corners Grant 9,142,445 - Wu , et al. September 22, 2	2015-09-22
Method and apparatus for reforming a memory cell of a memory Grant 9,129,678 - Sutardja , et al. September 8, 2	2015-09-08
Method And Apparatus For Incorporating Passive Devices In An Integrated Passive Device Separate From A Die App 20150244410 - Leong; Poh Boon ; et al.	2015-08-27
Integrated circuit architecture for light emitting diode-based displays Grant 9,117,734 - Zhang , et al. August 25, 2	2015-08-25
Resistive random access memory and method for controlling manufacturing of corresponding sub-resolution features of conductive and resistive elements Grant 9,112,133 - Sutardja , et al. August 18, 2	2015-08-18
Method And Apparatus For Improving The Reliability Of A Connection To A Via In A Substrate App 20150228569 - Wang; Long-Ching ; et al.	2015-08-13
Package Assembly Having A Semiconductor Substrate App 20150221577 - Liou; Shiann-Ming ; et al.	2015-08-06
Analog circuit with improved layout for mismatch optimization Grant 9,099,335 - Wu August 4, 2	2015-08-04
Structures embedded within core material and methods of manufacturing thereof Grant 9,087,835 - Sutardja , et al. July 21, 2	2015-07-21
Attaching Passive Components To A Semiconductor Package App 20150200114 - Liou; Shiann-Ming ; et al.	2015-07-16
Semiconductor package with a semiconductor die embedded within substrates Grant 9,070,679 - Wu , et al. June 30, 2	2015-06-30
Method for forming one or more vias through a semiconductor substrate and forming a redistribution layer on the semiconductor substrate Grant 9,064,860 - Liou , et al. June 23, 2	2015-06-23
Power/ground Layout For Chips App 20150155202 - Sutardja; Sehat ; et al.	2015-06-04
Method and apparatus for detecting a row or a column of a memory to repair without reporting all corresponding defective memory cells Grant 9,047,252 - Lee , et al. June 2, 2	2015-06-02
Systems and methods for reading resistive random access memory (RRAM) cells Grant 9,047,945 - Sutardja , et al. June 2, 2	2015-06-02
Configuring resistive random access memory (RRAM) array for write operations Grant 9,042,159 - Sutardja , et al. May 26, 2	2015-05-26
Recessed semiconductor substrates and associated techniques Grant 9,034,730 - Wu , et al. May 19, 2	2015-05-19
Resistive Random Access Memory Cell Structure With Reduced Programming Voltage App 20150124520 - Sutardja; Pantas ; et al.	2015-05-07
Reducing source contact to gate spacing to decrease transistor pitch Grant 8,999,786 - Wu , et al. April 7, 2	2015-04-07
Attaching passive components to a semiconductor package Grant 8,987,830 - Liou , et al. March 24, 2	2015-03-24
Heat dissipating interposers Grant 8,987,893 - Sutardja , et al. March 24, 2	2015-03-24
Method And Apparatus For Reforming A Memory Cell Of A Memory App 20150063004 - Sutardja; Pantas ; et al.	2015-03-05
Power/ground layout for chips Grant 8,946,890 - Sutardja , et al. February 3, 2	2015-02-03
System and method for creating a bipolar resistive RAM (RRAM) Grant 8,947,909 - Sutardja , et al. February 3, 2	2015-02-03
Analog Circuit With Improved Layout For Mismatch Optimization App 20150028422 - Wu; Albert	2015-01-29
Method and apparatus for forming a contact in a cell of a resistive random access memory to reduce a voltage required to program the cell Grant 8,934,285 - Sutardja , et al. January 13, 2	2015-01-13
Integrated circuit packaging configurations Grant 8,884,419 - Liou , et al. November 11, 2	2014-11-11
Apparatus and method for reforming resistive memory cells Grant 8,885,388 - Sutardja , et al. November 11, 2	2014-11-11
Apparatus and method for repairing resistive memories and increasing overall read sensitivity of sense amplifiers Grant 8,873,309 - Sutardja , et al. October 28, 2	2014-10-28
High resistivity substrate for integrated passive device (IPD) applications Grant 8,861,214 - Wu , et al. October 14, 2	2014-10-14
Integrated Power Supply Architecture For Light Emitting Diode-based Displays App 20140284635 - Zhang; Wanfeng ; et al.	2014-09-25
Semiconductor package including a power plane and a ground plane Grant 8,796,839 - Sutardja , et al. August 5, 2	2014-08-05
Apparatus and method for remapping addresses of defective memory locations to redundant memory locations Grant 8,767,491 - Wu , et al. July 1, 2	2014-07-01
Method and system for detecting and repairing defective memory cells without reporting a defective memory cell Grant 8,762,801 - Lee , et al. June 24, 2	2014-06-24
Resistive Random Access Memory And Method For Controlling Manufacturing Of Corresponding Sub-resolution Features Of Conductive And Resistive Elements App 20140170832 - Sutardja; Pantas ; et al.	2014-06-19
Through via semiconductor die with backside redistribution layer Grant 8,754,506 - Liou , et al. June 17, 2	2014-06-17
Methods and apparatus for etching photo-resist material through multiple exposures of the photo-resist material Grant 8,753,976 - Wu , et al. June 17, 2	2014-06-17
Systems and methods for integrating LED displays and LED display controllers Grant 8,748,910 - Zhang , et al. June 10, 2	2014-06-10
Techniques And Configurations For Recessed Semiconductor Substrates App 20140124961 - WU; Albert ; et al.	2014-05-08
Apparatus And Method For Reforming Resistive Memory Cells App 20140112057 - Sutardja; Pantas ; et al.	2014-04-24
Systems And Methods For Reading Resistive Random Access Memory (rram) Cells App 20140104926 - SUTARDJA; Pantas ; et al.	2014-04-17
Apparatus And Method For Repairing Resistive Memories And Increasing Overall Read Sensitivity Of Sense Amplifiers App 20140104924 - Sutardja; Pantas ; et al.	2014-04-17
Method And Apparatus For Forming A Contact In A Cell Of A Resistive Random Access Memory To Reduce A Voltage Required To Program The Cell App 20140104928 - SUTARDJA; Pantas ; et al.	2014-04-17
Configuring Resistive Random Access Memory (rram) Array For Write Operations App 20140104927 - Sutardja; Pantas ; et al.	2014-04-17
Structures Embedded Within Core Material And Methods Of Manufacturing Thereof App 20140106508 - Sutardja; Sehat ; et al.	2014-04-17
Method And Apparatus For Forming Shallow Trench Isolation Structures Having Rounded Corners App 20140080285 - Wu; Albert ; et al.	2014-03-20
Methods Of Making Packages Using Thin Cu Foil Supported By Carrier Cu Foil App 20140041916 - Sutardja; Sehat ; et al.	2014-02-13
Method of stacking flip-chip on wire-bonded chip Grant 8,624,377 - Liou , et al. January 7, 2	2014-01-07
Structures embedded within core material and methods of manufacturing thereof Grant 8,618,654 - Sutardja , et al. December 31, 2	2013-12-31
Structures embedded within core material and methods of manufacturing thereof Grant 08618654 -	2013-12-31
High-density patterning Grant 8,609,528 - Sutardja , et al. December 17, 2	2013-12-17
Alpha shielding techniques and configurations Grant 8,603,861 - Tam , et al. December 10, 2	2013-12-10
Semiconductor packaging with internal wiring bus Grant 8,518,742 - Liu , et al. August 27, 2	2013-08-27
Methods for forming a plurality of contact holes in a microelectronic device Grant 8,501,619 - Wu , et al. August 6, 2	2013-08-06
Integrated circuit packaging configurations Grant 8,471,376 - Liou , et al. June 25, 2	2013-06-25
Method Of Stacking Flip-chip On Wire-bonded Chip App 20130147025 - Liou; Shiann-Ming ; et al.	2013-06-13
Memory repair system and method Grant 8,462,569 - Wu , et al. June 11, 2	2013-06-11
Alpha Shielding Techniques And Configurations App 20130143366 - Tam; Nelson ; et al.	2013-06-06
Method and systems for memory testing and test data reporting during memory testing Grant 8,423,841 - Lee , et al. April 16, 2	2013-04-16
Method of stacking flip-chip on wire-bonded chip Grant 8,372,692 - Liou , et al. February 12, 2	2013-02-12
Alpha shielding techniques and configurations Grant 8,368,214 - Tam , et al. February 5, 2	2013-02-05
Package Assembly Including A Semiconductor Substrate With Stress Relief Structure App 20130026609 - Wu; Albert ; et al.	2013-01-31
Embedded die with protective interposer Grant 8,338,934 - Wu , et al. December 25, 2	2012-12-25
Microelectronic Device Including Shallow Trench Isolation Structures Having Rounded Bottom Surfaces App 20120319231 - Wu; Albert ; et al.	2012-12-20
Test engine for integrated circuit chip testing Grant 8,330,477 - Wu , et al. December 11, 2	2012-12-11
Pre-formed conductive bumps on bonding pads Grant 8,319,353 - Liou , et al. November 27, 2	2012-11-27
Method for shallow trench isolation Grant 8,241,993 - Wu , et al. August 14, 2	2012-08-14
Memory repair system and method Grant 8,218,383 - Wu , et al. July 10, 2	2012-07-10
Power/ground Layout For Chips App 20120098127 - Sutardja; Sehat ; et al.	2012-04-26
Emebedded Structures And Methods Of Manufacture Thereof App 20120049364 - Sutardja; Sehat ; et al.	2012-03-01
Method to form high density phase change memory (PCM) top contact every two bits Grant 8,030,128 - Sutardja , et al. October 4, 2	2011-10-04
Pre-formed conductive bumps on bonding pads Grant 8,030,098 - Liou , et al. October 4, 2	2011-10-04
Embedded Die With Protective Interposer App 20110227223 - Wu; Albert ; et al.	2011-09-22
Method for fabricating 1T-DRAM on bulk silicon Grant 8,008,137 - Wu , et al. August 30, 2	2011-08-30
Methods for forming a plurality of contact holes in a microelectric device Grant 8,003,523 - Wu , et al. August 23, 2	2011-08-23
High-density patterning Grant 7,994,052 - Sutardja , et al. August 9, 2	2011-08-09
Techniques And Configurations For Recessed Semiconductor Substrates App 20110186960 - Wu; Albert ; et al.	2011-08-04
Recessed Semiconductor Substrates And Associated Techniques App 20110186992 - Wu; Albert ; et al.	2011-08-04
Recessed Semiconductor Substrates App 20110186998 - Wu; Albert ; et al.	2011-08-04
Method Of Stacking Flip-chip On Wire-bonded Chip App 20110180913 - Liou; Shiann-Ming ; et al.	2011-07-28
Methods to form wide heater trenches and to form memory cells to engage heaters Grant 7,985,616 - Sutardja , et al. July 26, 2	2011-07-26
Package Assembly Having A Semiconductor Substrate App 20110175218 - Liou; Shiann-Ming ; et al.	2011-07-21
Attaching Passive Components To A Semiconductor Package App 20110169163 - Liou; Shiann-Ming ; et al.	2011-07-14
Integrated Buck Power Supply Architectures For Led-based Displays App 20110148312 - Zhang; Wanfeng ; et al.	2011-06-23
Method and system for memory testing and test data reporting during memory testing Grant 7,958,413 - Lee , et al. June 7, 2	2011-06-07
Embedded Chip Packages App 20110121444 - Wu; Albert ; et al.	2011-05-26
Memory repair system and method Grant 7,948,818 - Wu , et al. May 24, 2	2011-05-24
High density via and metal interconnect structures, and methods of forming the same Grant 7,939,445 - Sutardja , et al. May 10, 2	2011-05-10
Ion implantation and process sequence to form smaller base pick-up Grant 7,939,414 - Sutardja , et al. May 10, 2	2011-05-10
Semiconductor packaging with internal wiring bus Grant 7,911,053 - Liu , et al. March 22, 2	2011-03-22
Self aligned integration of high density phase change memory with thin film access device Grant 7,892,936 - Wu , et al. February 22, 2	2011-02-22
Method to form high efficiency GST cell using a double heater cut Grant 7,888,166 - Sutardja , et al. February 15, 2	2011-02-15
Low base resistance bipolar junction transistor array Grant 7,863,709 - Sutardja , et al. January 4, 2	2011-01-04
Wirebond Structures App 20100301467 - Wu; Albert	2010-12-02
Phase change material (PCM) memory devices with bipolar junction transistors and methods for making thereof Grant 7,834,341 - Wu , et al. November 16, 2	2010-11-16
Stack die packages Grant 7,825,521 - Wu , et al. November 2, 2	2010-11-02
Methods of making and using fuse structures, and integrated circuits including the same Grant 7,820,493 - Cheng , et al. October 26, 2	2010-10-26
Ion implantation and process sequence to form smaller base pick-up Grant 7,807,539 - Sutardja , et al. October 5, 2	2010-10-05
Method To Form High Efficiency Gst Cell Using A Double Heater Cut App 20100173452 - Sutardja; Pantas ; et al.	2010-07-08
Memory repair system and method Grant 7,751,264 - Wu , et al. July 6, 2	2010-07-06
Ultra high density phase change memory having improved emitter contacts, improved GST cell reliability and highly matched UHD GST cells using column mirco-trench strips Grant 7,745,809 - Sutardja , et al. June 29, 2	2010-06-29
Alpha Shielding Techniques And Configurations App 20100140760 - Tam; Nelson ; et al.	2010-06-10
Method and system for memory testing and test data reporting during memory testing Grant 7,734,966 - Lee , et al. June 8, 2	2010-06-08
Method to form high efficiency GST cell using a double heater cut Grant 7,709,835 - Sutardja , et al. May 4, 2	2010-05-04
Fuse structures, methods of making and using the same, and integrated circuits including the same Grant 7,704,805 - Cheng , et al. April 27, 2	2010-04-27
High-density contact holes Grant 7,704,875 - Wu , et al. April 27, 2	2010-04-27
Insole cushioning device with repelling magnetic field Grant 7,694,440 - Wu April 13, 2	2010-04-13
Cross-point memory array Grant 7,622,731 - Sutardja , et al. November 24, 2	2009-11-24
Fuse structures, methods of making and using the same, and integrated circuits including the same Grant 7,589,363 - Cheng , et al. September 15, 2	2009-09-15
Stack Die Packages App 20090212410 - Wu; Albert ; et al.	2009-08-27
Stack die packages Grant 7,535,110 - Wu , et al. May 19, 2	2009-05-19
Method For Shallow Trench Isolation App 20090017593 - Wu; Albert ; et al.	2009-01-15
Semiconductor Packaging With Internal Wiring Bus App 20080258291 - Liu; Chenglin ; et al.	2008-10-23
Method To Form High Efficiency Gst Cell Using A Double Heater Cut App 20080246015 - Sutardja; Pantas ; et al.	2008-10-09
Phase Change Material (pcm) Memory Devices With Bipolar Junction Transistors And Methods For Making Thereof App 20080185570 - Wu; Albert ; et al.	2008-08-07
Memory repair system and method Grant 7,359,261 - Wu , et al. April 15, 2	2008-04-15
Fuse structures, methods of making and using the same, and integrated circuits including the same Grant 7,344,924 - Cheng , et al. March 18, 2	2008-03-18
Stack die packages App 20080006948 - Wu; Albert ; et al.	2008-01-10
Fabrication of wire bond pads over underlying active devices, passive devices and/or dielectric layers in integrated circuits Grant 7,288,845 - Sutardja , et al. October 30, 2	2007-10-30
Cross-point memory array App 20070215910 - Sutardja; Pantas ; et al.	2007-09-20
Method For Fabricating 1t-dram On Bulk Silicon App 20070215906 - Wu; Albert ; et al.	2007-09-20
Cross-point memory array App 20070218665 - Sutardja; Pantas ; et al.	2007-09-20
Fuse structures, methods of making and using the same, and integrated circuits including the same Grant 6,940,107 - Cheng , et al. September 6, 2	2005-09-06
Fabrication of wire bond pads over underlying active devices, passive devices and /or dielectric layers in integrated circuits App 20040070086 - Lee, Jin-Yuan ; et al.	2004-04-15
Multiple subcarrier communication system Grant 6,088,577 - Yang , et al. July 11, 2	2000-07-11
Semiconductor memory array with buried drain lines and methods therefor Grant 5,986,934 - Kao , et al. November 16, 1	1999-11-16
Digital compressed voice paging system which uses R.D.S. format for the ID signals and S.C.A. format for the voice signals both formats being FM subcarriers Grant 5,881,365 - Yang , et al. March 9, 1	1999-03-09
Method of making an EEPROM Grant 5,453,388 - Chen , et al. September 26, 1	1995-09-26