Wrschka; Peter

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wrschka; Peter.The latest application filed is for "copper cleaning and protection formulations".

Company Profile

0.12.19

Wrschka; Peter - Phoenix AZ
Wrschka; Peter - Danbury CT
Wrschka; Peter - Tempo AZ
Wrschka; Peter - Wappingers Falls NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Fluid processing systems and methods Grant 9,586,188 - Lurcott , et al. March 7, 2	2017-03-07
Copper Cleaning And Protection Formulations App 20160075971 - LIU; Jun ; et al.	2016-03-17
Fluid Processing Systems And Methods App 20150321897 - LURCOTT; Steven M. ; et al.	2015-11-12
Fluid processing systems and methods Grant 9,038,855 - Lurcott , et al. May 26, 2	2015-05-26
Systems and methods for delivery of fluid-containing process material combinations Grant 8,507,382 - Hughes , et al. August 13, 2	2013-08-13
High throughput chemical mechanical polishing composition for metal film planarization Grant 8,304,344 - Boggs , et al. November 6, 2	2012-11-06
Method of passivating chemical mechanical polishing compositions for copper film planarization processes Grant 8,236,695 - Liu , et al. August 7, 2	2012-08-07
Fluid Processing Systems And Methods App 20120138631 - Lurcott; Steven M. ; et al.	2012-06-07
Systems And Methods For Delivery Of Fluid-containing Process Material Combinations App 20110008964 - Hughes; John E.Q. ; et al.	2011-01-13
Chemical Mechanical Polishing Compositions For Copper And Associated Materials And Method Of Using Same App 20100248480 - Darsillo; Michael ; et al.	2010-09-30
Chemical mechanical polishing compositions for copper and associated materials and method of using same Grant 7,736,405 - Darsillo , et al. June 15, 2	2010-06-15
Stabilization Of Polymer-silica Dispersions For Chemical Mechanical Polishing Slurry Applications App 20100087065 - Boggs; Karl E. ; et al.	2010-04-08
Integrated Chemical Mechanical Polishing Composition And Process For Single Platen Processing App 20090215269 - Boggs; Karl E. ; et al.	2009-08-27
Method Of Passivating Chemical Mechanical Polishing Compositions For Copper Film Planarization Processes App 20090137122 - Liu; Jun ; et al.	2009-05-28
High Throughput Chemical Mechanical Polishing Composition For Metal Film Planarization App 20080254628 - Boggs; Karl E. ; et al.	2008-10-16
Passivative chemical mechanical polishing composition for copper film planarization Grant 7,300,601 - Liu , et al. November 27, 2	2007-11-27
Passivative Chemical Mechanical Polishing Composition For Copper Film Planarization App 20070181852 - Liu; Jun ; et al.	2007-08-09
Chemical mechanical polishing compositions for step-ll copper line and other associated materials and method of using same App 20060249482 - Wrschka; Peter ; et al.	2006-11-09
Integration scheme for metal gap fill, with fixed abrasive CMP Grant 6,943,114 - Wrschka , et al. September 13, 2	2005-09-13
Chemical mechanical polishing (CMP) process using fixed abrasive pads Grant 6,899,597 - Wrschka , et al. May 31, 2	2005-05-31
Chemical mechanical polishing (CMP) process using fixed abrasive pads App 20050014454 - Wrschka, Peter ; et al.	2005-01-20
Integration scheme for metal gap fill, with fixed abrasive CMP App 20040248399 - Wrschka, Peter ; et al.	2004-12-09
Chemical mechanical polishing compositions for copper and associated materials and method of using same App 20040229461 - Darsillo, Michael ; et al.	2004-11-18
Passivative chemical mechanical polishing composition for copper film planarization App 20040108302 - Liu, Jun ; et al.	2004-06-10
Carbon-graded layer for improved adhesion of low-k dielectrics to silicon substrates Grant 6,740,539 - Conti , et al. May 25, 2	2004-05-25
Integration scheme for metal gap fill with HDP and fixed abrasive CMP App 20030186551 - Wrschka, Peter ; et al.	2003-10-02
Carbon-graded layer for improved adhesion of low-k dielectrics to silicon substrates App 20030153198 - Conti, Richard A. ; et al.	2003-08-14
Carbon-graded layer for improved adhesion of low-k dielectrics to silicon substrates App 20030017642 - Conti, Richard A. ; et al.	2003-01-23

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