Wright; Steven Lorenz

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wright; Steven Lorenz.The latest application filed is for "transferrable pillar structure for fanout package or interconnect bridge".

Company Profile

4.16.15

Wright; Steven Lorenz - Cortlandt Manor NY
Wright; Steven Lorenz - Tucson AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Transferrable Pillar Structure For Fanout Package Or Interconnect Bridge App 20220181286 - Rubin; Joshua M. ; et al.	2022-06-09
Multi-chip package structures with discrete redistribution layers Grant 11,164,817 - Rubin , et al. November 2, 2	2021-11-02
Multi-chip package structure having high density chip interconnect bridge with embedded power distribution network Grant 11,133,259 - Rubin , et al. September 28, 2	2021-09-28
Multi-chip package structures formed by joining chips to pre-positioned chip interconnect bridge devices Grant 11,114,410 - Rubin , et al. September 7, 2	2021-09-07
Multi-chip Package Structures Having Embedded Chip Interconnect Bridges And Fan-out Redistribution Layers App 20210265275 - Rubin; Joshua M. ; et al.	2021-08-26
Multi-chip package structures having embedded chip interconnect bridges and fan-out redistribution layers Grant 11,094,637 - Rubin , et al. August 17, 2	2021-08-17
Multi-chip Package Structure Having High Density Chip Interconnect Bridge With Embedded Power Distribution Network App 20210183773 - Rubin; Joshua M. ; et al.	2021-06-17
Multi-chip Package Structures Formed By Joining Chips To Pre-positioned Chip Interconnect Bridge Devices App 20210159211 - Rubin; Joshua M. ; et al.	2021-05-27
Multi-chip Package Structures Having Embedded Chip Interconnect Bridges And Fan-out Redistribution Layers App 20210134728 - Rubin; Joshua M. ; et al.	2021-05-06
Multi-chip Package Structures Formed With Interconnect Bridge Devices And Chip Packages With Discrete Redistribution Layers App 20210134724 - Rubin; Joshua M. ; et al.	2021-05-06
Device layer thin-film transfer to thermally conductive substrate Grant 10,396,220 - Dang , et al. A	2019-08-27
Device Layer Thin-film Transfer To Thermally Conductive Substrate App 20190148564 - DANG; Bing ; et al.	2019-05-16
Device layer thin-film transfer to thermally conductive substrate Grant 10,243,091 - Dang , et al.	2019-03-26
Device Layer Thin-film Transfer To Thermally Conductive Substrate App 20180226516 - DANG; Bing ; et al.	2018-08-09
Device layer thin-film transfer to thermally conductive substrate Grant 10,032,943 - Dang , et al. July 24, 2	2018-07-24
Device Layer Thin-film Transfer To Thermally Conductive Substrate App 20170179307 - DANG; Bing ; et al.	2017-06-22
System and method for selective image capture, transmission and reconstruction Grant 8,582,648 - Berman , et al. November 12, 2	2013-11-12
Method for precision assembly of integrated circuit chip packages Grant 7,615,405 - Andry , et al. November 10, 2	2009-11-10
System and Method for Selective Image Capture, Transmission and Reconstruction App 20090167948 - Berman; Steven T. ; et al.	2009-07-02
Microelectronic device connection structure Grant 7,501,708 - Andry , et al. March 10, 2	2009-03-10
System and method for selective image capture, transmission and reconstruction Grant 7,492,821 - Berman , et al. February 17, 2	2009-02-17
Method For Precision Assembly Of Integrated Circuit Chip Packages App 20080182362 - Andry; Paul Stephen ; et al.	2008-07-31
Microelectronic Device Connection Structure App 20080023851 - Andry; Paul Stephen ; et al.	2008-01-31
Method for precision assembly of integrated circuit chip packages Grant 7,282,391 - Andry , et al. October 16, 2	2007-10-16
Method For Precision Assembly Of Integrated Circuit Chip Packages App 20070222065 - Andry; Paul Stephen ; et al.	2007-09-27
System and method for selective image capture, transmission and reconstruction App 20060176951 - Berman; Steven T. ; et al.	2006-08-10
Method and system for error diffusion with a plurality of error measures Grant 6,870,643 - Thompson , et al. March 22, 2	2005-03-22
TFT LCD active data line repair Grant 6,697,037 - Alt , et al. February 24, 2	2004-02-24
Color calibration of displays Grant 6,690,383 - Braudaway , et al. February 10, 2	2004-02-10
Method and system for error diffusion with a plurality of error measures App 20020140955 - Thompson, Gerhard Robert ; et al.	2002-10-03

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