loadpatents
name:-0.012649059295654
name:-0.0083880424499512
name:-0.0022690296173096
Wright; Lance Cole Patent Filings

Wright; Lance Cole

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wright; Lance Cole.The latest application filed is for "conductive plate stress reduction feature".

Company Profile
2.10.15
  • Wright; Lance Cole - Allen TX
  • Wright; Lance Cole - Van Alstyne TX
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Conductive Plate Stress Reduction Feature
App 20220208692 - Luo; Tianyi ;   et al.
2022-06-30
Semiconductor Package With Solder Standoff
App 20220115308 - Noquil; Jonathan Almeria ;   et al.
2022-04-14
Semiconductor package with solder standoff
Grant 11,177,197 - Noquil , et al. November 16, 2
2021-11-16
Semiconductor Package With Solder Standoff
App 20210090980 - Noquil; Jonathan Almeria ;   et al.
2021-03-25
Discrete device mounted on substrate
Grant 9,899,339 - Romig , et al. February 20, 2
2018-02-20
Integrated circuit package with printed circuit layer
Grant 9,111,845 - Romig , et al. August 18, 2
2015-08-18
Electronic assembly with three dimensional inkjet printed traces
Grant 8,945,986 - Romig , et al. February 3, 2
2015-02-03
Integrated Circuit Package With Printed Circuit Layer
App 20140361402 - Romig; Matthew David ;   et al.
2014-12-11
Integrated circuit package with printed circuit layer
Grant 8,847,349 - Romig , et al. September 30, 2
2014-09-30
Electronic assembly with three dimensional inkjet printed traces
Grant 8,816,513 - Romig , et al. August 26, 2
2014-08-26
Integrated Circuit Package With Printed Circuit Layer
App 20140175599 - Romig; Matthew David ;   et al.
2014-06-26
Electronic Assembly with Three Dimensional Inkjet Printed Traces
App 20140127856 - Romig; Matthew David ;   et al.
2014-05-08
Discrete Device Mounted On Substrate
App 20140124939 - Romig; Matthew David ;   et al.
2014-05-08
Electronic Assembly With Three Dimensional Inkjet Printed Traces
App 20140054795 - Romig; Matthew David ;   et al.
2014-02-27
Semiconductor Device Package Leadframe
App 20080290481 - Kudoh; Takahiko ;   et al.
2008-11-27
Apparatus for and method of packaging semiconductor devices
Grant 7,320,903 - Wright January 22, 2
2008-01-22
Apparatus for and method of packaging semiconductor devices
App 20060055026 - Wright; Lance Cole
2006-03-16
Apparatus for and method of packaging semiconductor devices
Grant 6,977,191 - Wright December 20, 2
2005-12-20
Apparatus to minimize paper particulate from paper based carrier tape reel
App 20040226857 - Wright, Lance Cole ;   et al.
2004-11-18
Apparatus for and method of packaging semiconductor devices
App 20040165975 - Wright, Lance Cole
2004-08-26
Apparatus for and method of packaging semiconductor devices
Grant 6,774,485 - Wright August 10, 2
2004-08-10
Chip carrier tape
App 20030218236 - Wright, Lance Cole ;   et al.
2003-11-27
Apparatus for and method of packaging semiconductor devices
App 20030124772 - Wright, Lance Cole
2003-07-03

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