Woychik; Charles Gerard
Patent Applications and Registrations
Patent applications and USPTO patent grants for Woychik; Charles Gerard.The latest application filed is for "tileable sensor array".
Company Profile
1.27.22
- Woychik; Charles Gerard - Niskayuna NY US
- Woychik; Charles Gerard - Nishkayuna NY
- Woychik; Charles Gerard - Vestal NY
Patent Activity
| Patent | Date |
|---|---|
| Demountable interconnect structure Grant 9,953,910 - Woychik , et al. April 24, 2 | 2018-04-24 |
| Method of making demountable interconnect structure Grant 9,610,758 - Woychik , et al. April 4, 2 | 2017-04-04 |
| Low cost manufacturing of micro-channel heatsink Grant 8,929,071 - Beaupre , et al. January 6, 2 | 2015-01-06 |
| Tileable sensor array Grant 8,659,148 - Tkaczyk , et al. February 25, 2 | 2014-02-25 |
| Detector array with a through-via interposer Grant 8,575,558 - Tkaczyk , et al. November 5, 2 | 2013-11-05 |
| Interconnect structure Grant 8,498,131 - Fillion , et al. July 30, 2 | 2013-07-30 |
| Large area modular sensor array assembly and method for making the same Grant 8,345,508 - Wodnicki , et al. January 1, 2 | 2013-01-01 |
| Method of forming a micro pin hybrid interconnect array Grant 8,296,940 - Woychik , et al. October 30, 2 | 2012-10-30 |
| Tileable Sensor Array App 20120133001 - Tkaczyk; John Eric ; et al. | 2012-05-31 |
| Detector Array With A Through-via Interposer App 20120133054 - Tkaczyk; John Eric ; et al. | 2012-05-31 |
| Electronic Assembly App 20120049079 - Yanoff; Brian David ; et al. | 2012-03-01 |
| Interconnect structure App 20110299821 - Fillion; Raymond Albert ; et al. | 2011-12-08 |
| Micro Pin Hybrid Interconnect Array And Method Of Manufacturing Same App 20110253430 - Woychik; Charles Gerard ; et al. | 2011-10-20 |
| Large Area Modular Sensor Array Assembly And Method For Making The Same App 20110071397 - Wodnicki; Robert Gideon ; et al. | 2011-03-24 |
| Monitoring or imaging system with interconnect structure for large area sensor array Grant 7,892,176 - Wodnicki , et al. February 22, 2 | 2011-02-22 |
| Integrated Direct Conversion Detector Module App 20100327173 - Woychik; Charles Gerard ; et al. | 2010-12-30 |
| Ultrasound Probe With Replaceable Head Portion App 20100249598 - Smith; Lowell Scott ; et al. | 2010-09-30 |
| Methods of making and using integrated and testable sensor array Grant 7,781,238 - Wodnicki , et al. August 24, 2 | 2010-08-24 |
| Low cost anufacturing of micro-channel heatsink App 20100157526 - Beaupre; Richard Alfred ; et al. | 2010-06-24 |
| Methods Of Making And Using Integrated And Testable Sensor Array App 20090148967 - Wodnicki; Robert Gideon ; et al. | 2009-06-11 |
| Interconnect Structure App 20090028491 - Fillion; Raymond Albert ; et al. | 2009-01-29 |
| Demountable Interconnect Structure App 20080318027 - Woychik; Charles Gerard ; et al. | 2008-12-25 |
| Method Of Making Demountable Interconnect Structure App 20080314867 - Woychik; Charles Gerard ; et al. | 2008-12-25 |
| Ultrasound System With Through Via Interconnect Structure App 20080315331 - Wodnicki; Robert Gideon ; et al. | 2008-12-25 |
| Recoverable Electronic Component App 20080318055 - Fillion; Raymond Albert ; et al. | 2008-12-25 |
| Method For Making An Interconnect Structure And Interconnect Component Recovery Process App 20080318413 - Fillion; Raymond Albert ; et al. | 2008-12-25 |
| Integrated sensor arrays and method for making and using such arrays App 20080296708 - Wodnicki; Robert Gideon ; et al. | 2008-12-04 |
| Modular sensor assembly and methods of fabricating the same Grant 7,451,651 - Woychik , et al. November 18, 2 | 2008-11-18 |
| Monitoring Or Imaging System With Interconnect Structure For Large Area Sensor Array App 20080273424 - Wodnicki; Robert Gideon ; et al. | 2008-11-06 |
| Modular sensor assembly and methods of fabricating the same App 20080134793 - Woychik; Charles Gerard ; et al. | 2008-06-12 |
| Methods of making and using a floating interposer Grant 6,946,329 - Pierson , et al. September 20, 2 | 2005-09-20 |
| Method for joining a semiconductor chip to a chip carrier substrate and resulting chip package Grant 6,821,814 - LaFontaine, Jr. , et al. November 23, 2 | 2004-11-23 |
| Floating interposer App 20040201396 - Pierson, Mark Vincent ; et al. | 2004-10-14 |
| Floating interposer Grant 6,774,315 - Pierson , et al. August 10, 2 | 2004-08-10 |
| Method of making a CTE compensated chip interposer Grant 6,516,513 - Milkovich , et al. February 11, 2 | 2003-02-11 |
| Method of making a CTE compensated chip interposer App 20020088116 - Milkovich, Cynthia Susan ; et al. | 2002-07-11 |
| High density integrated circuit packaging with chip stacking and via interconnections Grant 6,236,115 - Gaynes , et al. May 22, 2 | 2001-05-22 |
| Method for joining a semiconductor chip to a chip carrier substrate and resulting chip package App 20010001216 - LaFontaine, William Rena JR. ; et al. | 2001-05-17 |
| High density integrated circuit packaging with chip stacking and via interconnections Grant 6,187,678 - Gaynes , et al. February 13, 2 | 2001-02-13 |
| Method for joining a semiconductor chip to a chip carrier substrate and resulting chip package Grant 6,162,660 - LaFontaine, Jr. , et al. December 19, 2 | 2000-12-19 |
| Semiconductor chip package having chip-to-carrier mechanical/electrical connection formed via solid state diffusion Grant 6,130,476 - LaFontaine, Jr. , et al. October 10, 2 | 2000-10-10 |
| High density integrated circuit packaging with chip stacking and via interconnections Grant 6,002,177 - Gaynes , et al. December 14, 1 | 1999-12-14 |
| Lead-free, tin-based multi-component solder alloys Grant 5,730,932 - Sarkhel , et al. March 24, 1 | 1998-03-24 |
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