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Patent applications and USPTO patent grants for Worster; Bruce W..The latest application filed is for "method for characterizing defects on semiconductor wafers".
Patent | Date |
---|---|
Method for characterizing defects on semiconductor wafers Grant 7,384,806 - Worster , et al. June 10, 2 | 2008-06-10 |
Method for Characterizing Defects on Semiconductor Wafers App 20070104357 - Worster; Bruce W. ;   et al. | 2007-05-10 |
Method for characterizing defects on semiconductor wafers Grant 7,154,605 - Worster , et al. December 26, 2 | 2006-12-26 |
Method for characterizing defects on semiconductor wafers Grant 6,661,515 - Worster , et al. December 9, 2 | 2003-12-09 |
Method for characterizing defects on semiconductor wafers App 20030203520 - Worster, Bruce W. ;   et al. | 2003-10-30 |
Method for characterizing defects on semiconductor wafers App 20020012118 - Worster, Bruce W. ;   et al. | 2002-01-31 |
Method for characterizing defects on semiconductor wafers Grant 6,288,782 - Worster , et al. September 11, 2 | 2001-09-11 |
Laser imaging system for inspection and analysis of sub-micron particles Grant 5,963,314 - Worster , et al. October 5, 1 | 1999-10-05 |
Method for characterizing defects on semiconductor wafers Grant 5,808,735 - Lee , et al. September 15, 1 | 1998-09-15 |
Laser imaging system for inspection and analysis of sub-micron particles Grant 5,479,252 - Worster , et al. December 26, 1 | 1995-12-26 |
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