Workman; Derek B.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Workman; Derek B..The latest application filed is for "hyperbranched polymer and cycloaliphatic epoxy resin thermosets".
- Workman; Derek B. - Noblesville IN
| Patent | Date |
|---|---|
| Radiopaque polymers for circuit board assembly Grant 7,790,814 - Basheer , et al. September 7, 2 | 2010-09-07 |
| Dendritic polyol, cycloaliphatic epoxy resin and cationic initiator Grant 7,754,824 - Basheer , et al. July 13, 2 | 2010-07-13 |
| Hyperbranched Polymer And Cycloaliphatic Epoxy Resin Thermosets App 20090082528 - Basheer; Rafil A. ; et al. | 2009-03-26 |
| Silica nanoparticles thermoset resin compositions Grant 7,498,197 - Basheer , et al. March 3, 2 | 2009-03-03 |
| Silica Nanoparticles Thermoset Resin Compositions App 20080122118 - Basheer; Rafil A. ; et al. | 2008-05-29 |
| Underfill method Grant 7,331,106 - Workman , et al. February 19, 2 | 2008-02-19 |
| Devices with microjetted polymer standoffs App 20070235217 - Workman; Derek B. | 2007-10-11 |
| Electronic assembly including multiple substrates Grant 7,205,652 - Fairchild , et al. April 17, 2 | 2007-04-17 |
| Electronic module with form in-place pedestal Grant 7,202,571 - Thompson , et al. April 10, 2 | 2007-04-10 |
| Hyperbranched polymer and cycloaliphatic epoxy resin thermosets App 20060252892 - Basheer; Rafil A. ; et al. | 2006-11-09 |
| Enhancement of underfill physical properties by the addition of thermotropic cellulose Grant 7,119,449 - Workman , et al. October 10, 2 | 2006-10-10 |
| Radiopaque polymers for circuit board assembly App 20060222860 - Basheer; Rafil A. ; et al. | 2006-10-05 |
| Electronic assembly including multiple substrates App 20060214299 - Fairchild; M. Ray ; et al. | 2006-09-28 |
| Underfill method App 20060200985 - Workman; Derek B. ; et al. | 2006-09-14 |
| Methods of making a curable composition having low coefficient of thermal expansion and an integrated circuit and a curable composition and integrated circuit made there from App 20060199301 - Basheer; Rafil A. ; et al. | 2006-09-07 |
| Electronic module with form in-place pedestal App 20060033195 - Thompson; Brian D. ; et al. | 2006-02-16 |
| No-flow underfill process and material therefor Grant 6,943,058 - Chaudhuri , et al. September 13, 2 | 2005-09-13 |
| Enhancement of underfill physical properties by the addition of a thermotropic cellulose App 20050122697 - Workman, Derek B. ; et al. | 2005-06-09 |
| Underfill method App 20050014313 - Workman, Derek B. ; et al. | 2005-01-20 |
| No-flow underfill process and material therefor App 20040185602 - Chaudhuri, Arun K. ; et al. | 2004-09-23 |
| No-flow underfill material and underfill method for flip chip devices Grant 6,660,560 - Chaudhuri , et al. December 9, 2 | 2003-12-09 |
| No-flow underfill material and underfill method for flip chip devices App 20030049411 - Chaudhuri, Arun K. ; et al. | 2003-03-13 |
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