Woodbury; Dustin A.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Woodbury; Dustin A..The latest application filed is for "integrated process for thin film resistors with silicides".

Company Profile

0.9.9

Woodbury; Dustin A. - Indian Harbour Beach FL
Woodbury; Dustin A. - Indian Habour Beach FL
Woodbury; Dustin A. - Indian Harbor Beach FL

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Integrated process for thin film resistors with silicides Grant 8,338,914 - Gasner , et al. December 25, 2	2012-12-25
Integrated Process For Thin Film Resistors With Silicides App 20100117198 - Gasner; John T. ; et al.	2010-05-13
Integrated process for thin film resistors with silicides Grant 7,662,692 - Gasner , et al. February 16, 2	2010-02-16
Method of forming an integrated circuit having a device wafer with a diffused doped backside layer Grant 7,605,052 - Czagas , et al. October 20, 2	2009-10-20
Integrated process for thin film resistors with silicides Grant 7,341,958 - Gasner , et al. March 11, 2	2008-03-11
Integrated Process For Thin Film Resistors With Silicides App 20080026536 - Gasner; John T. ; et al.	2008-01-31
Method Of Forming An Integrated Circuit Having A Device Wafer With A Diffused Doped Backside Layer App 20080026595 - Czagas; Joseph A. ; et al.	2008-01-31
Integrated circuit having a device wafer with a diffused doped backside layer Grant 7,285,475 - Czagas , et al. October 23, 2	2007-10-23
Method and structure for non-single-polycrystalline capacitor in an integrated circuit Grant 7,098,103 - Woodbury , et al. August 29, 2	2006-08-29
Integrated process for thin film resistors with silicides App 20060166505 - Gasner; John T. ; et al.	2006-07-27
Integrated circuit having a device wafer with a diffused doped backside layer App 20060009007 - Czagas; Joseph A. ; et al.	2006-01-12
Integrated circuit having a device wafer with a diffused doped backside layer Grant 6,946,364 - Czagas , et al. September 20, 2	2005-09-20
Method and structure for non-single-polycrystalline capacitor in an integrated circuit App 20050202629 - Woodbury, Dustin A. ; et al.	2005-09-15
Integrated circuit having a device wafer with a diffused doped backside layer Grant 6,867,495 - Czagas , et al. March 15, 2	2005-03-15
Integrated circuit having a device wafer with a diffused doped backside layer App 20040161905 - Czagas, Joseph A. ; et al.	2004-08-19
Highly linear integrated resistive contact Grant 6,667,523 - Woodbury , et al. December 23, 2	2003-12-23
Highly linear integrated resistive contact App 20020109230 - Woodbury, Dustin A. ; et al.	2002-08-15
Integrated circuit having a device wafer with a diffused doped backside layer App 20020072200 - Czagas, Joseph A. ; et al.	2002-06-13

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