Wood; Dustin P.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Wood; Dustin P..The latest application filed is for "integrated circuit package substrate".
Company Profile
4.26.26
- Wood; Dustin P. - Chandler AZ
- Wood; Dustin P - Chandler AZ
- Wood; Dustin P. - Phoenix AZ
Patent Activity
| Patent | Date |
|---|---|
| Integrated circuit package substrate Grant 10,522,455 - Manusharow , et al. Dec | 2019-12-31 |
| Integrated Circuit Package Substrate App 20190164881 - MANUSHAROW; Mathew J. ; et al. | 2019-05-30 |
| Integrated circuit package substrate Grant 10,242,942 - Manusharow , et al. | 2019-03-26 |
| Integrated Circuit Package Substrate App 20170154842 - MANUSHAROW; Mathew J. ; et al. | 2017-06-01 |
| iTFC with optimized C(T) Grant 7,755,165 - Palanduz , et al. July 13, 2 | 2010-07-13 |
| Integrated circuit packages, systems, and methods Grant 7,687,905 - Stone , et al. March 30, 2 | 2010-03-30 |
| Integrated circuit package with improved power signal connection Grant 7,667,320 - Wood , et al. February 23, 2 | 2010-02-23 |
| iTFC with optimized C(T) Grant 7,656,644 - Palanduz , et al. February 2, 2 | 2010-02-02 |
| Interconnect shunt used for current distribution and reliability redundancy Grant 7,524,754 - Bohr , et al. April 28, 2 | 2009-04-28 |
| Array capacitors for broadband decoupling applications Grant 7,495,336 - Auernheimer , et al. February 24, 2 | 2009-02-24 |
| Array capacitors with voids to enable a full-grid socket Grant 7,463,492 - Radhakrishnan , et al. December 9, 2 | 2008-12-09 |
| Integrated Circuit Packages, Systems, And Methods App 20080142962 - Stone; Brent S. ; et al. | 2008-06-19 |
| Integrated Circuit Package With Improved Power Signal Connection App 20080136010 - Wood; Dustin P. ; et al. | 2008-06-12 |
| iTFC with optimized C(T) Grant 7,375,412 - Palanduz , et al. May 20, 2 | 2008-05-20 |
| iTFC WITH OPTIMIZED C(T) App 20080106844 - Palanduz; Cengiz A. ; et al. | 2008-05-08 |
| iTFC WITH OPTIMIZED C(T) App 20080106848 - Palanduz; Cengiz A. ; et al. | 2008-05-08 |
| Array capacitor with resistive structure Grant 7,365,428 - Auernheimer , et al. April 29, 2 | 2008-04-29 |
| Array capacitor for decoupling multiple voltage rails Grant 7,355,836 - Radhakrishnan , et al. April 8, 2 | 2008-04-08 |
| Integrated circuit package with improved power signal connection Grant 7,348,214 - Wood , et al. March 25, 2 | 2008-03-25 |
| Integrated circuit packages, systems, and methods Grant 7,339,263 - Stone , et al. March 4, 2 | 2008-03-04 |
| Selective plating of package terminals Grant 7,321,172 - Wood , et al. January 22, 2 | 2008-01-22 |
| Array capacitors with voids to enable a full-grid socket App 20070253142 - Radhakrishnan; Kaladhar ; et al. | 2007-11-01 |
| Array capacitors with voids to enable a full-grid socket Grant 7,265,995 - Radhakrishnan , et al. September 4, 2 | 2007-09-04 |
| Chip package with degassing holes Grant 7,243,423 - Wood July 17, 2 | 2007-07-17 |
| Array capacitors for broadband decoupling applications, and methods of operating same App 20070152301 - Auernheimer; Joel A. ; et al. | 2007-07-05 |
| Integrated circuit package with improved power signal connection App 20070114675 - Wood; Dustin P. ; et al. | 2007-05-24 |
| Interconnect shunt used for current distribution and reliability redundancy Grant 7,208,830 - Bohr , et al. April 24, 2 | 2007-04-24 |
| Selective plating of package terminals Grant 7,186,645 - Wood , et al. March 6, 2 | 2007-03-06 |
| Integrated circuit package with improved power signal connection Grant 7,183,644 - Wood , et al. February 27, 2 | 2007-02-27 |
| Array capacitor with IC contacts and applications Grant 7,173,804 - Radhakrishnan , et al. February 6, 2 | 2007-02-06 |
| Package substrate for integrated circuit and method of making the substrate Grant 7,152,313 - Wood , et al. December 26, 2 | 2006-12-26 |
| Array capacitor for decoupling multiple voltage rails App 20060274479 - Radhakrishnan; Kaladhar ; et al. | 2006-12-07 |
| Thermal solution with isolation layer App 20060256531 - Sauciuc; Ioan ; et al. | 2006-11-16 |
| Interconnect shunt used for current distribution and reliability redundancy App 20060097375 - Bohr; Mark ; et al. | 2006-05-11 |
| Array capacitor with resistive structure App 20060087030 - Auernheimer; Joel A. ; et al. | 2006-04-27 |
| Array capacitor with IC contacts and applications App 20060067030 - Radhakrishnan; Kaladhar ; et al. | 2006-03-30 |
| Selective plating of package terminals App 20060006535 - Wood; Dustin P. ; et al. | 2006-01-12 |
| Interconnect shunt used for current distribution and reliability redundancy App 20060001178 - Bohr; Mark ; et al. | 2006-01-05 |
| Integrated circuit packages, systems, and methods App 20050285243 - Stone, Brent S. ; et al. | 2005-12-29 |
| Integrated circuit packaging architecture Grant 6,979,891 - Wood , et al. December 27, 2 | 2005-12-27 |
| Integrated circuit package with improved power signal connection App 20050236707 - Wood, Dustin P. ; et al. | 2005-10-27 |
| Array capacitors with voids to enable a full-grid socket App 20050141206 - Radhakrishnan, Kaladhar ; et al. | 2005-06-30 |
| Package substrate for integrated circuit and method of making the substrate App 20050111207 - Wood, Dustin P. ; et al. | 2005-05-26 |
| Selective plating of package terminals App 20050112880 - Wood, Dustin P. ; et al. | 2005-05-26 |
| Chip package with degassing holes App 20050077077 - Wood, Dustin P. | 2005-04-14 |
| Integrated circuit packaging architecture App 20050051889 - Wood, Dustin P. ; et al. | 2005-03-10 |
| Chip package with degassing holes Grant 6,831,233 - Wood December 14, 2 | 2004-12-14 |
| Multilayer capacitor with multiple plates per layer Grant 6,819,543 - Vieweg , et al. November 16, 2 | 2004-11-16 |
| Multilayer Capacitor With Multiple Plates Per Layer App 20040125540 - Vieweg, Raymond A. ; et al. | 2004-07-01 |
| Chip package with degassing holes App 20010008313 - Wood, Dustin P. | 2001-07-19 |
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