Woo; Seung Wan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Woo; Seung Wan.The latest application filed is for "method for manufacturing semiconductor package".

Company Profile

0.5.14

Woo; Seung Wan - Suwon KR
Woo; Seung Wan - Suwon-si KR
Woo; Seung-Wan - Yongin-si KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Printed circuit board having embedded electronic device and method of manufacturing the same Grant 9,504,169 - Hwang , et al. November 22, 2	2016-11-22
System of measuring warpage and method of measuring warpage Grant 9,470,635 - Woo , et al. October 18, 2	2016-10-18
Method For Manufacturing Semiconductor Package App 20150380276 - SHIN; Yee Na ; et al.	2015-12-31
Method for manufacturing semiconductor package Grant 9,171,780 - Shin , et al. October 27, 2	2015-10-27
Electronic component package Grant 9,155,192 - Lee , et al. October 6, 2	2015-10-06
Method For Manufacturing Semiconductor Package App 20150147849 - SHIN; Yee Na ; et al.	2015-05-28
Printed Circuit Board Having Embedded Electronic Device And Method Of Manufacturing The Same App 20150014034 - Hwang; Young Nam ; et al.	2015-01-15
Image Sensor Module And Method Of Manufacturing The Same App 20140374870 - Lee; Kyung Ho ; et al.	2014-12-25
Calibration Block For Measuring Warpage, Warpage Measuring Apparatus Using The Same, And Method Thereof App 20140354797 - Woo; Seung Wan ; et al.	2014-12-04
System Of Measuring Warpage And Method Of Measuring Warpage App 20140184782 - WOO; Seung Wan ; et al.	2014-07-03
Electronic Component Package And Method Of Manufacturing The Same App 20140145322 - HWANG; Young Nam ; et al.	2014-05-29
Lamination Layer Type Semiconductor Package App 20140145323 - LEE; Kyung Ho ; et al.	2014-05-29
Electronic Component Package App 20140146498 - Lee; Kyung Ho ; et al.	2014-05-29
System Of Measuring Warpage And Method Of Measuring Warpage App 20140104417 - WOO; Seung Wan ; et al.	2014-04-17
Semiconductor Chip Package And Manufacturing Method Thereof App 20140061891 - KIM; Po Chul ; et al.	2014-03-06
Apparatus For Measuring Warpage Characteristic Of Specimen App 20130100460 - WOO; Seung Wan ; et al.	2013-04-25
Rechargeable battery Grant 7,981,540 - Jeong , et al. July 19, 2	2011-07-19
Rechargeable Battery App 20080107961 - Jeong; Dong-Ho ; et al.	2008-05-08

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