Wong; Yam Mo
Patent Applications and Registrations
Patent applications and USPTO patent grants for Wong; Yam Mo.The latest application filed is for "apparatus for testing multiple semiconductor dice with increased throughput".
- Wong; Yam Mo - Singapore SG
- - Singapore SG
| Patent | Date |
|---|---|
| Apparatus for testing multiple semiconductor dice with increased throughput Grant 9,989,587 - Wong , et al. June 5, 2 | 2018-06-05 |
| Apparatus For Testing Multiple Semiconductor Dice With Increased Throughput App 20160334464 - WONG; Yam Mo ; et al. | 2016-11-17 |
| Wire bonder including a transducer, a bond head, and a mounting apparatus Grant 08919631 - | 2014-12-30 |
| Wire bonder including a transducer, a bond head, and a mounting apparatus Grant 8,919,631 - Wong , et al. December 30, 2 | 2014-12-30 |
| Wire Bonder Including A Transducer, A Bond Head, And A Mounting Apparatus App 20130240605 - WONG; Yam Mo ; et al. | 2013-09-19 |
| Flanged transducer having improved rigidity Grant 7,997,470 - Li , et al. August 16, 2 | 2011-08-16 |
| Vacuum wire tensioner for wire bonder Grant 7,954,689 - Kwan , et al. June 7, 2 | 2011-06-07 |
| Wire bonding method for forming low-loop profiles Grant 7,780,064 - Wong , et al. August 24, 2 | 2010-08-24 |
| Electronic device handler for a bonding apparatus Grant 7,677,431 - Wong , et al. March 16, 2 | 2010-03-16 |
| Apparatus for delivering shielding gas during wire bonding Grant 7,628,307 - Wong , et al. December 8, 2 | 2009-12-08 |
| Electronic device handler for a bonding apparatus Grant 7,568,606 - Wong , et al. August 4, 2 | 2009-08-04 |
| Method of forming low wire loops and wire loops formed using the method Grant 7,494,042 - Wong , et al. February 24, 2 | 2009-02-24 |
| Vacuum Wire Tensioner For Wire Bonder App 20080272178 - KWAN; Ka Shing Kenny ; et al. | 2008-11-06 |
| Flanged Transducer Having Improved Rigidity App 20080121679 - LI; Hing Leung Marchy ; et al. | 2008-05-29 |
| Apparatus For Delivering Shielding Gas During Wire Bonding App 20080099531 - WONG; Yam Mo ; et al. | 2008-05-01 |
| Electronic Device Handler For A Bonding Apparatus App 20080093004 - WONG; Yam Mo ; et al. | 2008-04-24 |
| Electronic Device Handler For A Bonding Apparatus App 20080092370 - WONG; Yam Mo ; et al. | 2008-04-24 |
| Wire bond with improved shear strength Grant 7,314,157 - Wong January 1, 2 | 2008-01-01 |
| Wire Bonding Method For Forming Low-loop Profiles App 20070284416 - WONG; Yam Mo ; et al. | 2007-12-13 |
| Stud bumping apparatus Grant 7,303,109 - Kwan , et al. December 4, 2 | 2007-12-04 |
| Method of fabricating a wire bond with multiple stitch bonds Grant 7,214,606 - Wong , et al. May 8, 2 | 2007-05-08 |
| Capillary holder Grant 7,100,812 - Zhai , et al. September 5, 2 | 2006-09-05 |
| Capillary Holder App 20060175377 - Zhai; Bao Nian ; et al. | 2006-08-10 |
| Multiple-ball wire bonds Grant 7,064,433 - Wong , et al. June 20, 2 | 2006-06-20 |
| Bondhead for wire bonding apparatus Grant 7,025,243 - Wong , et al. April 11, 2 | 2006-04-11 |
| Wire bond with improved shear strength App 20060032894 - Wong; Yam Mo | 2006-02-16 |
| Bondhead for wire bonding apparatus App 20050279805 - Wong, Yam Mo ; et al. | 2005-12-22 |
| Wire bond with multiple stitch bonds App 20050202621 - Wong, Yam Mo ; et al. | 2005-09-15 |
| Multiple-ball wire bonds App 20050191839 - Wong, Yam Mo ; et al. | 2005-09-01 |
| Method of forming low wire loops and wire loops formed using the method App 20050072833 - Wong, Yam Mo ; et al. | 2005-04-07 |
| Apparatus and method to prevent oxidation of electronic devices Grant 6,866,182 - Wong , et al. March 15, 2 | 2005-03-15 |
| Stud bumping apparatus App 20050001018 - Kwan, Ka Shing Kenny ; et al. | 2005-01-06 |
| Apparatus for detecting the oscillation amplitude of an oscillating object Grant 6,827,247 - Fan , et al. December 7, 2 | 2004-12-07 |
| Multiple-head wire-bonding system Grant 6,749,100 - Wong , et al. June 15, 2 | 2004-06-15 |
| Apparatus and method to prevent oxidation of electronic devices App 20040065720 - Wong, Yam Mo ; et al. | 2004-04-08 |
| Method of bonding wires Grant 6,672,503 - Or , et al. January 6, 2 | 2004-01-06 |
| Method of and apparatus for monitoring a ball forming process Grant 6,660,956 - Boller , et al. December 9, 2 | 2003-12-09 |
| Bonding system Grant 6,572,001 - Wong , et al. June 3, 2 | 2003-06-03 |
| Multiple-head wire-bonding system App 20030098340 - Wong, Yam Mo ; et al. | 2003-05-29 |
| Method of bonding wires App 20020060239 - Or, Siu Wing ; et al. | 2002-05-23 |
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