Wong; Wingshenq
Patent Applications and Registrations
Patent applications and USPTO patent grants for Wong; Wingshenq.The latest application filed is for "window clamp top plate for integrated circuit packaging".
- Wong; Wingshenq - Singapore SG
| Patent | Date |
|---|---|
| Window clamp top plate for integrated circuit packaging Grant 8,796,826 - Zhang , et al. August 5, 2 | 2014-08-05 |
| Method and system for shielding semiconductor devices from light Grant 8,642,119 - Wong , et al. February 4, 2 | 2014-02-04 |
| Electromagnetic interference shielding on semiconductor devices Grant 8,576,574 - Wong , et al. November 5, 2 | 2013-11-05 |
| Window Clamp Top Plate For Integrated Circuit Packaging App 20130161806 - ZHANG; Xueren ; et al. | 2013-06-27 |
| Balanced Leadframe Package Structure And Method Of Manufacturing The Same App 20130147024 - GOH; Kim-Yong ; et al. | 2013-06-13 |
| Leadframe Pad Design With Enhanced Robustness To Die Crack Failure App 20130093072 - Zhang; Xueren ; et al. | 2013-04-18 |
| Method And System For Shielding Semiconductor Devices From Light App 20120070145 - Wong; Wingshenq ; et al. | 2012-03-22 |
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