WONG; Wing Shenq

Patent Applications and Registrations

Patent applications and USPTO patent grants for WONG; Wing Shenq.The latest application filed is for "molded range and proximity sensor with optical resin lens".

Company Profile

4.15.17

WONG; Wing Shenq - Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Molded Range And Proximity Sensor With Optical Resin Lens App 20210382197 - WONG; Wing Shenq ; et al.	2021-12-09
Molded range and proximity sensor with optical resin lens Grant 11,137,517 - Wong , et al. October 5, 2	2021-10-05
Molded Range And Proximity Sensor With Optical Resin Lens App 20200301042 - WONG; Wing Shenq ; et al.	2020-09-24
Molded range and proximity sensor with optical resin lens Grant 10,684,389 - Wong , et al.	2020-06-16
Integrated circuit (IC) package with a solder receiving area and associated methods Grant 10,529,652 - Wong J	2020-01-07
Integrated Circuit (IC) Package with a Solder Receiving Area and Associated Methods App 20190237393 - Wong; Wing Shenq	2019-08-01
Integrated circuit (IC) package with a solder receiving area and associated methods Grant 10,297,534 - Wong	2019-05-21
Molded Range And Proximity Sensor With Optical Resin Lens App 20190004207 - Wong; Wing Shenq ; et al.	2019-01-03
Molded range and proximity sensor with optical resin lens Grant 10,061,057 - Wong , et al. August 28, 2	2018-08-28
Integrated Circuit (IC) Package with a Solder Receiving Area and Associated Methods App 20180226325 - Wong; Wing Shenq	2018-08-09
Integrated circuit (IC) package with a solder receiving area and associated methods Grant 9,972,557 - Wong May 15, 2	2018-05-15
Patterned lead frame Grant 9,754,861 - Wong September 5, 2	2017-09-05
Optical package with recess in transparent cover Grant 9,608,029 - Wong March 28, 2	2017-03-28
Molded Range And Proximity Sensor With Optical Resin Lens App 20170052277 - Wong; Wing Shenq ; et al.	2017-02-23
Optical sensor package Grant 9,543,282 - Wong January 10, 2	2017-01-10
Image sensor device with sensing surface cavity and related methods Grant 9,525,002 - Wong December 20, 2	2016-12-20
Proximity and ranging sensor Grant 9,525,094 - Saugier , et al. December 20, 2	2016-12-20
Proximity And Ranging Sensor App 20160284920 - SAUGIER; Eric ; et al.	2016-09-29
Integrated circuit (IC) package with thick die pad functioning as a heat sink Grant 9,418,920 - Wong August 16, 2	2016-08-16
Integrated Circuit (ic) Package With Thick Die Pad, And Associated Methods App 20160197030 - WONG; Wing Shenq	2016-07-07
Image Sensor Device With Sensing Surface Cavity And Related Methods App 20160197113 - WONG; Wing Shenq	2016-07-07
Integrated Circuit (ic) Package With A Solder Receiving Area And Associated Methods App 20160172272 - WONG; Wing Shenq	2016-06-16
Patterned Lead Frame App 20160104663 - WONG; Wing Shenq	2016-04-14
Camera module Grant 9,258,467 - Wong February 9, 2	2016-02-09
Electronic Device Including Components In Component Receiving Cavity And Related Methods App 20150332995 - GOH; Kim-Yong ; et al.	2015-11-19
Optical Sensor Package App 20150137148 - Wong; Wing Shenq	2015-05-21
Camera Module App 20150138436 - Wong; Wing Shenq	2015-05-21
Electronic modules Grant 9,018,753 - Wong April 28, 2	2015-04-28
Electronic Modules And Methods Of Making Electronic Modules App 20150035133 - Wong; Wing Shenq	2015-02-05
Optical Package With Recess In Transparent Cover App 20150001111 - Wong; Wing Shenq	2015-01-01
Overmold with single attachment using optical film Grant 8,779,443 - Wong , et al. July 15, 2	2014-07-15
Overmold With Single Attachment Using Optical Film App 20140084308 - Wong; Wing Shenq ; et al.	2014-03-27

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