Wong; Will K.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Wong; Will K..The latest application filed is for "micro surface mount device packaging".
- Wong; Will K. - Belmont CA US
- WONG; Will K. - Daly City CA
| Patent | Date |
|---|---|
| Micro surface mount device packaging Grant 8,450,151 - Poddar , et al. May 28, 2 | 2013-05-28 |
| Micro Surface Mount Device Packaging App 20130127043 - Poddar; Anindya ; et al. | 2013-05-23 |
| Micro Surface Mount Device Packaging App 20130127044 - Poddar; Anindya ; et al. | 2013-05-23 |
| Foil plating for semiconductor packaging Grant 8,377,267 - Bayan , et al. February 19, 2 | 2013-02-19 |
| Low Profile Package And Method App 20120326300 - FENG; Tao ; et al. | 2012-12-27 |
| Method and leadframe for packaging integrated circuits Grant 8,298,871 - Wong , et al. October 30, 2 | 2012-10-30 |
| Backmetal Replacement For Use In The Packaging Of Integrated Circuits App 20120074561 - TU; Nghia T. ; et al. | 2012-03-29 |
| Laser Ablation Alternative To Low Cost Leadframe Process App 20110269269 - TU; Nghia T. ; et al. | 2011-11-03 |
| Method And Leadframe For Packaging Integrated Circuits App 20110104854 - Wong; Will K. ; et al. | 2011-05-05 |
| Foil Plating For Semiconductor Packaging App 20110073481 - BAYAN; Jaime A. ; et al. | 2011-03-31 |
| Thin Foil For Use In Packaging Integrated Circuits App 20100084748 - PODDAR; Anindya ; et al. | 2010-04-08 |
| Method And Leadframe For Packaging Integrated Circuits App 20090160039 - WONG; Will K. ; et al. | 2009-06-25 |
| Method Of Packaging Integrated Circuits App 20080290482 - Bayan; Jaime A. ; et al. | 2008-11-27 |
| Gang Flipping For Flip-chip Packaging App 20080241991 - Poddar; Anindya ; et al. | 2008-10-02 |
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