Wong; Will
Patent Applications and Registrations
Patent applications and USPTO patent grants for Wong; Will.The latest application filed is for "foil plating for semiconductor packaging".
- Wong; Will - Belmont CA
- Wong; Will - Daly City CA US
- Wong; Will - Singapore SG
| Patent | Date |
|---|---|
| Foil plating for semiconductor packaging Grant 8,747,640 - Bayan , et al. June 10, 2 | 2014-06-10 |
| Method of making foil based semiconductor package Grant 8,375,577 - Wong , et al. February 19, 2 | 2013-02-19 |
| Foil Plating for Semiconductor Packaging App 20130026043 - Bayan; Jaime ; et al. | 2013-01-31 |
| Foil based semiconductor package Grant 8,101,470 - Poddar , et al. January 24, 2 | 2012-01-24 |
| Method of forming a gate stack structure Grant 7,932,152 - Wong , et al. April 26, 2 | 2011-04-26 |
| Foil Based Semiconductor Package App 20110074003 - PODDAR; Anindya ; et al. | 2011-03-31 |
| Foil Based Semiconductor Package App 20090305076 - Wong; Will ; et al. | 2009-12-10 |
| Method Of Forming A Gate Stack Structure App 20090197387 - WONG; Will ; et al. | 2009-08-06 |
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