Wong; Wah S.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wong; Wah S..The latest application filed is for "method for fabricating a non-planar nitride-based heterostructure field effect transistor".

Company Profile

0.14.3

Wong; Wah S. - Montebello CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Wide-band transparent electrical contacts and interconnects for FPAS and a method of making the same Grant 9,640,680 - Son , et al. May 2, 2	2017-05-02
Enhancement mode normally-off gallium nitride heterostructure field effect transistor Grant 9,190,534 - Hussain , et al. November 17, 2	2015-11-17
Enhancement mode normally-off gallium nitride heterostructure field effect transistor Grant 8,728,884 - Hussain , et al. May 20, 2	2014-05-20
Integrated structure with transistors and schottky diodes and process for fabricating the same Grant 8,368,119 - Luh , et al. February 5, 2	2013-02-05
Integrated structure with transistors and Schottky diodes and process for fabricating the same Grant 7,989,277 - Luh , et al. August 2, 2	2011-08-02
Piezoelectric MEMS integration with GaN technology Grant 7,514,759 - Mehta , et al. April 7, 2	2009-04-07
Non-planar nitride-based heterostructure field effect transistor Grant 7,247,893 - Moon , et al. July 24, 2	2007-07-24
Method for fabricating a non-planar nitride-based heterostructure field effect transistor App 20050194602 - Moon, Jeong Sun ; et al.	2005-09-08
Method for fabricating a non-planar nitride-based heterostructure field effect transistor Grant 6,830,945 - Moon , et al. December 14, 2	2004-12-14
Method for fabricating a non-planar nitride-based heterostructure field effect transistor App 20040051112 - Moon, Jeong Sun ; et al.	2004-03-18
Ga/A1GaN Heterostructure Field Effect Transistor with dielectric recessed gate App 20040021152 - Nguyen, Chanh ; et al.	2004-02-05
Flip chip high power monolithic integrated circuit thermal bumps Grant 5,708,283 - Wen , et al. January 13, 1	1998-01-13
Flip chip high power monolithic integrated circuit thermal bumps and fabrication method Grant 5,616,517 - Wen , et al. April 1, 1	1997-04-01
Circuit structure with non-migrating silver contacts Grant 5,514,838 - Wen , et al. May 7, 1	1996-05-07
Beam lead mixer diode Grant 4,855,796 - Wong , et al. August 8, 1	1989-08-08

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