Wong; Lin-Yin

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wong; Lin-Yin.The latest application filed is for "packaging substrate having heat-dissipating structure".

Company Profile

0.8.10

Wong; Lin-Yin - Hsinchu TW
Wong; Lin-Yin - Hsin-Chu TW
Wong; Lin-Yin - Hsin-feng TW
Wong; Lin-Yin - Hsin-Chu City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Stacked package module and board having exposed ends Grant 7,968,991 - Wong , et al. June 28, 2	2011-06-28
Chip carrier structure having semiconductor chip embedded therein and metal layer formed thereon Grant 7,880,296 - Wong , et al. February 1, 2	2011-02-01
Packaging substrate having heat-dissipating structure Grant 7,656,015 - Wong , et al. February 2, 2	2010-02-02
Stack structure of carrier boards embedded with semiconductor components and method for fabricating the same Grant 7,507,915 - Chang , et al. March 24, 2	2009-03-24
Packaging substrate having heat-dissipating structure App 20090072384 - Wong; Lin-Yin ; et al.	2009-03-19
Stacked package module App 20080246135 - Wong; Lin-Yin ; et al.	2008-10-09
Stacked package module App 20080230886 - Wong; Lin-Yin ; et al.	2008-09-25
Chip Carrier Structure Having Semiconductor Chip Embedded Therein And Metal Layer Formed Thereon App 20080217762 - Wong; Lin-Yin ; et al.	2008-09-11
Semiconductor package substrate having bonding pads with plated layer thereon and process of manufacturing the same Grant 7,396,753 - Chu , et al. July 8, 2	2008-07-08
Semiconductor package substrate with embedded resistors and method for fabricating the same Grant 7,323,762 - Lai , et al. January 29, 2	2008-01-29
Stack Structure Of Carrier Boards Embedded With Semiconductor Components And Method For Fabricating The Same App 20070084628 - Chang; Chia-Wei ; et al.	2007-04-19
Semiconductior Package Substrate With Embedded Resistors And Method For Fabricating Same App 20060261462 - Lai; Zao-Kuo ; et al.	2006-11-23
Semiconductor package substrate with embedded resistors and method for fabricating same Grant 7,135,377 - Lai , et al. November 14, 2	2006-11-14
Heat sink structure with embedded electronic components for semiconductor package Grant 7,050,304 - Hsu , et al. May 23, 2	2006-05-23
Semiconductor package substrate with embedded resistors and method for fabricating the same App 20060094156 - Lai; Zao-Kuo ; et al.	2006-05-04
Semiconductor package substrate having bonding pads with plated layer thereon and process of manufacturing the same App 20060006422 - Chu; Chih-Liang ; et al.	2006-01-12
Heat sink structure with embedded electronic components for semiconductor package App 20050047094 - Hsu, Shih-Ping ; et al.	2005-03-03
Semiconductor package substrate having bonding pads with plated layer thereon and process of manufacturing the same App 20040099961 - Chu, Chih-Liang ; et al.	2004-05-27

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