Wong, Did Bun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wong, Did Bun.The latest application filed is for "method and apparatus for printing using an electrically conductive ink".

Company Profile

0.8.3

Wong, Did Bun - Glen Ellyn IL
Wong; Did-bun - Elmhurst IL

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method and apparatus for printing using an electrically conductive ink App 20040003734 - Shively, J. Thomas ; et al.	2004-01-08
Using ink temperature gain to identify causes of web breaks in a printing system Grant 6,507,832 - Evans , et al. January 14, 2	2003-01-14
Control methodology and apparatus for reducing delamination in a book binding system App 20020128990 - Kaminskas, Paul A. ; et al.	2002-09-12
Methods and apparatus for adjusting cover printing based on book caliper App 20020057453 - Michaelis, A. John ; et al.	2002-05-16
Device and method for identifying causes of web breaks in a printing system on web manufacturing attributes Grant 6,098,063 - Xie , et al. August 1, 2	2000-08-01
Device and method for decreasing web breaks in a printing system based on web tension ratios Grant 6,009,421 - Xie , et al. December 28, 1	1999-12-28
System and method for selective assembly and imaging of books Grant 4,789,147 - Berger , et al. December 6, 1	1988-12-06
System and method for selective assembly and imaging of books Grant 4,768,766 - Berger , et al. September 6, 1	1988-09-06
Collating and binding system and method with postage indication Grant RE32,690 - Wong June 7, 1	1988-06-07
Collating and binding system and method with postage indication Grant 4,674,052 - Wong , et al. June 16, 1	1987-06-16
Collating and binding system and method with postage indication Grant 4,500,083 - Wong February 19, 1	1985-02-19

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