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Preventing dielectric void over trench isolation region
Grant 11,171,036 - Shi , et al. November 9, 2 | 2021-11-09 |
Air gap regions of a semiconductor device
Grant 11,018,221 - Wong , et al. May 25, 2 | 2021-05-25 |
Preventing Dielectric Void Over Trench Isolation Region
App 20210111065 - Shi; Yongjun ; et al. | 2021-04-15 |
Air Gap Regions Of A Semiconductor Device
App 20210050412 - WONG; Chun Yu ; et al. | 2021-02-18 |
STI structure with liner along lower portion of longitudinal sides of active region, and related FET and method
Grant 10,910,276 - Shi , et al. February 2, 2 | 2021-02-02 |
Vertically oriented metal silicide containing e-fuse device
Grant 10,879,171 - Wong , et al. December 29, 2 | 2020-12-29 |
Self-aligned chamferless interconnect structures of semiconductor devices
Grant 10,804,199 - Shi , et al. October 13, 2 | 2020-10-13 |
Fin-type transistors with spacers on the gates
Grant 10,636,894 - Shen , et al. | 2020-04-28 |
Self-aligned Chamferless Interconnect Structures Of Semiconductor Devices
App 20200098688 - SHI; YONGJUN ; et al. | 2020-03-26 |
Vertically Oriented Metal Silicide Containing E-fuse Device
App 20200020631 - Wong; Chun Yu ; et al. | 2020-01-16 |
Vertically oriented metal silicide containing e-fuse device and methods of making same
Grant 10,510,662 - Wong , et al. Dec | 2019-12-17 |
Transistor Fins With Different Thickness Gate Dielectric
App 20190371796 - Zang; Hui ; et al. | 2019-12-05 |
Transistor fins with different thickness gate dielectric
Grant 10,475,791 - Zang , et al. Nov | 2019-11-12 |
Self-aligned single diffusion break isolation with reduction of strain loss
Grant 10,468,481 - Wang , et al. No | 2019-11-05 |
Hybrid material electrically programmable fuse and methods of forming
Grant 10,461,029 - Wong , et al. Oc | 2019-10-29 |
Fins with single diffusion break facet improvement using epitaxial insulator
Grant 10,439,026 - Wong , et al. O | 2019-10-08 |
Fin field-effect transistor (FinFET) and method of production thereof
Grant 10,418,285 - Zang , et al. Sept | 2019-09-17 |
Fin-type Transistors With Spacers On The Gates
App 20190280105 - Shen; Yanping ; et al. | 2019-09-12 |
Self-aligned Single Diffusion Break Isolation With Reduction Of Strain Loss
App 20190229183 - WANG; Haiting ; et al. | 2019-07-25 |
Semiconductor fuses with nanowire fuse links and fabrication methods thereof
Grant 10,332,834 - Wong , et al. | 2019-06-25 |
Vertically Oriented Metal Silicide Containing E-fuse Device And Methods Of Making Same
App 20190139892 - Wong; Chun Yu ; et al. | 2019-05-09 |
Surface Cleaning Apparatus
App 20190117027 - JUPP; SIMEON CHARLES ; et al. | 2019-04-25 |
Fins With Single Diffusion Break Facet Improvement Using Epitaxial Insulator
App 20190115426 - WONG; Chun Yu ; et al. | 2019-04-18 |
Hybrid Material Electrically Programmable Fuse And Methods Of Forming
App 20190067191 - Wong; Chun Yu ; et al. | 2019-02-28 |
Vertical Finfet With Improved Top Source/drain Contact
App 20190067474 - WONG; Chun Yu ; et al. | 2019-02-28 |
Through silicon via device having low stress, thin film gaps and methods for forming the same
Grant 10,043,764 - Liu , et al. August 7, 2 | 2018-08-07 |
Integrated circuits and methods of forming the same with metal layer connection to through-semiconductor via
Grant 9,761,481 - Wong , et al. September 12, 2 | 2017-09-12 |
Dispensers and applicator heads therefor
Grant 9,706,832 - Price , et al. July 18, 2 | 2017-07-18 |
Semiconductor Fuses With Nanowire Fuse Links And Fabrication Methods Thereof
App 20170141031 - WONG; Chun Yu ; et al. | 2017-05-18 |
Semiconductor fuses with nanowire fuse links and fabrication methods thereof
Grant 9,601,428 - Wong , et al. March 21, 2 | 2017-03-21 |
Through Silicon Via Device Having Low Stress, Thin Film Gaps And Methods For Forming The Same
App 20160372425 - Liu; Huang ; et al. | 2016-12-22 |
Methods of fabricating nanowire structures
Grant 9,508,795 - Wong , et al. November 29, 2 | 2016-11-29 |
Semiconductor Fuses With Nanowire Fuse Links And Fabrication Methods Thereof
App 20160284643 - WONG; Chun Yu ; et al. | 2016-09-29 |
Through silicon via device having low stress, thin film gaps and methods for forming the same
Grant 9,455,188 - Liu , et al. September 27, 2 | 2016-09-27 |
Methods Of Fabricating Nanowire Structures
App 20160225849 - WONG; Chun Yu ; et al. | 2016-08-04 |
Integrated circuits and methods of forming the same with multiple embedded interconnect connection to same through-semiconductor via
Grant 9,245,790 - Thangaraju , et al. January 26, 2 | 2016-01-26 |
Through Silicon Via Device Having Low Stress, Thin Film Gaps And Methods For Forming The Same
App 20140203446 - Liu; Huang ; et al. | 2014-07-24 |
Integrated Circuits And Methods Of Forming The Same With Metal Layer Connection To Through-semiconductor Via
App 20140203449 - Wong; Chun Yu ; et al. | 2014-07-24 |
Integrated Circuits And Methods Of Forming The Same With Embedded Interconnect Connection To Through-semiconductor Via
App 20140203827 - Thangaraju; Sarasvathi ; et al. | 2014-07-24 |
User Characteristics-based Sponsored Job Postings
App 20140143163 - Kamat; Sachit ; et al. | 2014-05-22 |
Dispensers and Applicator Heads Therefor
App 20140064821 - PRICE; Amy Marie ; et al. | 2014-03-06 |
3D integrated circuit system with connecting via structure and method for forming the same
Grant 8,637,993 - Wong , et al. January 28, 2 | 2014-01-28 |
3d Integrated Circuit System With Connecting Via Structure And Method For Forming The Same
App 20130277854 - Wong; Chun Yu ; et al. | 2013-10-24 |
Searching based on messages
Grant 7,730,081 - Bromm , et al. June 1, 2 | 2010-06-01 |
Validating inbound messages
Grant 7,571,319 - Gillum , et al. August 4, 2 | 2009-08-04 |
Searching based on messages
App 20070088687 - Bromm; Kristin D. ; et al. | 2007-04-19 |
Web application architecture
App 20060167981 - Bansod; Aditya ; et al. | 2006-07-27 |
Web application communication protocol
App 20060149746 - Bansod; Aditya ; et al. | 2006-07-06 |
Validating inbound messages
App 20060085505 - Gillum; Eliot C. ; et al. | 2006-04-20 |
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