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Method and device for processing microstructure arrays of polystyrene-graphene nanocomposites
Grant 10,850,304 - Chen , et al. December 1, 2 | 2020-12-01 |
Mass transfer method for micro-LEDs with a temperature-controlled adhesive layer
Grant 10,784,400 - Chen , et al. Sept | 2020-09-22 |
Method And Device For Processing Microstructure Arrays Of Polystyrene-graphene Nanocomposites
App 20200230644 - CHEN; Yun ; et al. | 2020-07-23 |
Mass Transfer Method For Micro-leds With A Temperature-controlled Adhesive Layer
App 20200203558 - CHEN; Yun ; et al. | 2020-06-25 |
Metal-assisted chemical etching of a semiconductive substrate with high aspect ratio, high geometic uniformity, and controlled 3D profiles
Grant 10,134,634 - Li , et al. November 20, 2 | 2018-11-20 |
Silica Fillers and Methods of Making Same
App 20170342273 - Tuan; Chia-Chi ; et al. | 2017-11-30 |
Highly conductive electrically conductive adhesives
Grant 9,490,043 - Zhang , et al. November 8, 2 | 2016-11-08 |
Metal-assisted Chemical Etching Of A Semiconductive Substrate With High Aspect Ratio, High Geometic Uniformity, And Controlled 3d Profiles
App 20160126133 - Li; Liyi ; et al. | 2016-05-05 |
Structures including carbon nanotubes, methods of making structures, and methods of using structures
Grant 8,702,897 - Lin , et al. April 22, 2 | 2014-04-22 |
Highly Conductive Electrically Conductive Adhesives
App 20130056689 - Zhang; Rongwei ; et al. | 2013-03-07 |
Methods and systems for metal-assisted chemical etching of substrates
Grant 8,278,191 - Hildreth , et al. October 2, 2 | 2012-10-02 |
Insulator coating for reducing power line system pollution problems
Grant 8,206,776 - Li , et al. June 26, 2 | 2012-06-26 |
Systems and methods for nanomaterial transfer
Grant 8,173,525 - Graham, Jr. , et al. May 8, 2 | 2012-05-08 |
Stuctures including carbon nanotubes, methods of making structures, and methods of using structures
App 20100304101 - Lin; Wei ; et al. | 2010-12-02 |
Insulator Coating And Method For Forming Same
App 20100189925 - LI; JUN ; et al. | 2010-07-29 |
Insulator coating and method for forming same
Grant 7,722,951 - Li , et al. May 25, 2 | 2010-05-25 |
Electrical condition monitoring method for polymers
Grant 7,663,381 - Watkins, Jr. , et al. February 16, 2 | 2010-02-16 |
Electrically conductive adhesives and methods of making
Grant 7,527,749 - Li , et al. May 5, 2 | 2009-05-05 |
Superhydrophobic Surface And Method For Forming Same
App 20090011222 - Xiu; Yonghao ; et al. | 2009-01-08 |
Electrical condition monitoring method for polymers
App 20080307909 - Watkins, JR.; Kenneth S. ; et al. | 2008-12-18 |
Systems and methods for nanomaterial transfer
App 20080283269 - Graham, JR.; Samuel ; et al. | 2008-11-20 |
Conductive polymer composites
App 20080272344 - Jiang; HongJin ; et al. | 2008-11-06 |
Electrical condition monitoring method for polymers
Grant 7,414,416 - Watkins, Jr. , et al. August 19, 2 | 2008-08-19 |
Poly(arylene ether)s bearing grafted hydroxyalkyls for use in electrically conductive adhesives
Grant 7,189,795 - Burgoyne, Jr. , et al. March 13, 2 | 2007-03-13 |
Underfill on substrate process and ultra-fine pitch, low standoff chip-to-package interconnections produced thereby
App 20060211171 - Tummala; Rao O. ; et al. | 2006-09-21 |
Insulator coating and method for forming same
App 20060081394 - Li; Jun ; et al. | 2006-04-20 |
Low stress conformal coatings of reliability without hermeticity for microelectromechanical system based multichip module encapsulation
Grant 6,989,433 - Wong , et al. January 24, 2 | 2006-01-24 |
Electrical condition monitoring method for polymers
App 20050268734 - Watkins Jr, Kenneth S. ; et al. | 2005-12-08 |
High dielectric polymer composites and methods of preparation thereof
Grant 6,864,306 - Rao , et al. March 8, 2 | 2005-03-08 |
Poly(arylene ether)s bearing grafted hydroxyalkyls for use in electrically conductive adhesives
App 20050014921 - Burgoyne, William Franklin JR. ; et al. | 2005-01-20 |
Process and material for low-cost flip-chip solder interconnect structures
Grant 6,746,896 - Shi , et al. June 8, 2 | 2004-06-08 |
Joining electroconductive materials with electroconductive adhesive containing epoxide-modified polyurethane
Grant 6,740,192 - Lu , et al. May 25, 2 | 2004-05-25 |
High dielectric constant nano-structure polymer-ceramic composite
Grant 6,544,651 - Wong , et al. April 8, 2 | 2003-04-08 |
No-flow reworkable epoxy underfills for flip-chip applications
App 20020035201 - Wang, Lejun ; et al. | 2002-03-21 |
Thermally degradable epoxy underfills for flip-chip applications
App 20020013420 - Wang, Lejun ; et al. | 2002-01-31 |
No-flow underfill of epoxy resin, anhydride, fluxing agent and surfactant
Grant 6,180,696 - Wong , et al. January 30, 2 | 2001-01-30 |
Encapsulation techniques which include forming a thin glass layer onto a polymer layer
Grant 5,439,849 - McBride , et al. August 8, 1 | 1995-08-08 |
Methods for encapsulating electronic devices
Grant 5,348,913 - McBride , et al. September 20, 1 | 1994-09-20 |
Encapsulant method and apparatus
Grant 5,317,196 - Wong May 31, 1 | 1994-05-31 |
Method for encapsulating integrated circuit
Grant 5,275,841 - Wong January 4, 1 | 1994-01-04 |
Devices featuring silicone elastomers
Grant 5,266,352 - Filas , et al. November 30, 1 | 1993-11-30 |
Devices featuring silicone elastomers
Grant 5,217,811 - Filas , et al. June 8, 1 | 1993-06-08 |
Silicone resin electronic device encapsulant
Grant 5,215,801 - Wong June 1, 1 | 1993-06-01 |
Silicone encapsulant
Grant 5,213,864 - Wong May 25, 1 | 1993-05-25 |
Silicone material
Grant 5,085,913 - Wong February 4, 1 | 1992-02-04 |
Silicone encapsulated devices
Grant 4,720,431 - Wong January 19, 1 | 1988-01-19 |
Stabilized silicone gels
Grant 4,665,148 - Wong May 12, 1 | 1987-05-12 |
Process for cleaning a circuit board
Grant 4,604,144 - Wong August 5, 1 | 1986-08-05 |
Silicone encapsulated devices
Grant 4,592,959 - Wong June 3, 1 | 1986-06-03 |
Silicone encapsulated devices
Grant 4,564,562 - Wong January 14, 1 | 1986-01-14 |
Silicone encapsulant containing porphyrin
Grant 4,552,818 - Wong November 12, 1 | 1985-11-12 |
Encapsulated electronic circuit
Grant 4,508,758 - Wong April 2, 1 | 1985-04-02 |
Encapsulated electronic devices and encapsulating compositions
Grant 4,330,637 - Wong May 18, 1 | 1982-05-18 |
Stabilized catalyzed organopolysiloxanes
Grant 4,318,939 - Wong March 9, 1 | 1982-03-09 |
Mask for selectively transmitting therethrough a desired light radiant energy
Grant 4,282,314 - Dinella , et al. August 4, 1 | 1981-08-04 |
Encapsulated electronic devices and encapsulating compositions
Grant 4,278,784 - Wong July 14, 1 | 1981-07-14 |
Mask for selectively transmitting therethrough a desired light radiant energy
Grant 4,255,481 - Dinella , et al. March 10, 1 | 1981-03-10 |
Method of repairing a defective photomask
Grant 4,200,668 - Segal , et al. April 29, 1 | 1980-04-29 |
Method of removing a cured epoxy from a metal surface
Grant 4,171,240 - Wong October 16, 1 | 1979-10-16 |
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