Wong; Cheng-Chou

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wong; Cheng-Chou.The latest application filed is for "electric conductive heat dissipation substrate".

Company Profile

0.7.10

Wong; Cheng-Chou - Hsinchu County TW
WONG; Cheng-Chou - Jhudong Township TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electric conductive heat dissipation substrate Grant 9,397,279 - Wang , et al. July 19, 2	2016-07-19
Electric Conductive Heat Dissipation Substrate App 20150188016 - Wang; Cheng-Chuan ; et al.	2015-07-02
Protection structure forthermal dissipation and preventing thermal runaway diffusion in battery system Grant 8,785,026 - Hu , et al. July 22, 2	2014-07-22
Thermoelectric Generator And Thermoelectric Generating System App 20140158178 - Wong; Cheng-Chou ; et al.	2014-06-12
High Thermally Conductive Composites And Illumination Device App 20130242578 - CHEN; Chien-Ming ; et al.	2013-09-19
High Thermally Conductive Composites App 20130164510 - CHEN; Chien-Ming ; et al.	2013-06-27
Metal thermal interface material and thermal module and packaged microelectronic component containing the material Grant 8,373,991 - Fann , et al. February 12, 2	2013-02-12
Protection Structure Forthermal Dissipation And Preventing Thermal Runaway Diffusion In Battery System App 20110159340 - Hu; Hsien-Lin ; et al.	2011-06-30
Melting temperature adjustable metal thermal interface materials and packaged semiconductors including thereof Grant 7,952,192 - Fann , et al. May 31, 2	2011-05-31
Melting Temperature Adjustable Metal Thermal Interface Materials And Packaged Semiconductors Including Thereof App 20090236729 - Fann; Yuan-Chang ; et al.	2009-09-24
Melting temperature adjustable metal thermal interface materials and application thereof Grant 7,576,428 - Fann , et al. August 18, 2	2009-08-18
Metal Thermal Interface Material And Thermal Module And Packaged Microelectronic Component Containing The Material App 20090135567 - Fann; Yuan-Chang ; et al.	2009-05-28
Melting Temperature Adjustable Metal Thermal Interface Materials And Application Thereof App 20080110609 - Fann; Yuan-Chang ; et al.	2008-05-15
Heat dissipation device and composite material with high thermal conductivity App 20070053166 - Hwang; Jen-Dong ; et al.	2007-03-08

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