WONG; Chee Wai
Patent Applications and Registrations
Patent applications and USPTO patent grants for WONG; Chee Wai.The latest application filed is for "liposomal corticosteroids for topical injection in inflamed lesions or areas".
- WONG; Chee Wai - Singapore SG
- Wong; Chee Wai - Kuala Lumpur MY
- Wong; Chee Wai - Wilayah P. MY
| Patent | Date |
|---|---|
| Liposomal Corticosteroids For Topical Injection In Inflamed Lesions Or Areas App 20190151236 - METSELAAR; Josbert Maarten ; et al. | 2019-05-23 |
| Integrated circuit die configuration for packaging Grant 7,714,427 - Wong , et al. May 11, 2 | 2010-05-11 |
| Integrated circuit die configuration for packaging Grant 7,341,887 - Wong , et al. March 11, 2 | 2008-03-11 |
| Apparatuses and associated methods for improved solder joint reliability Grant 7,242,084 - Wong , et al. July 10, 2 | 2007-07-10 |
| Integrated Circuit Die Configuration For Packaging App 20070057381 - WONG; CHEE WAI ; et al. | 2007-03-15 |
| Apparatuses and associated methods for improved solder joint reliability App 20060267217 - Wong; Chee Wai ; et al. | 2006-11-30 |
| Integrated circuit die configuration for packaging App 20060094222 - Wong; Chee Wai ; et al. | 2006-05-04 |
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