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Patent applications and USPTO patent grants for WONG; Chee Wai.The latest application filed is for "liposomal corticosteroids for topical injection in inflamed lesions or areas".
Patent | Date |
---|---|
Liposomal Corticosteroids For Topical Injection In Inflamed Lesions Or Areas App 20190151236 - METSELAAR; Josbert Maarten ;   et al. | 2019-05-23 |
Integrated circuit die configuration for packaging Grant 7,714,427 - Wong , et al. May 11, 2 | 2010-05-11 |
Integrated circuit die configuration for packaging Grant 7,341,887 - Wong , et al. March 11, 2 | 2008-03-11 |
Apparatuses and associated methods for improved solder joint reliability Grant 7,242,084 - Wong , et al. July 10, 2 | 2007-07-10 |
Integrated Circuit Die Configuration For Packaging App 20070057381 - WONG; CHEE WAI ;   et al. | 2007-03-15 |
Apparatuses and associated methods for improved solder joint reliability App 20060267217 - Wong; Chee Wai ;   et al. | 2006-11-30 |
Integrated circuit die configuration for packaging App 20060094222 - Wong; Chee Wai ;   et al. | 2006-05-04 |
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