Womac; David J.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Womac; David J..The latest application filed is for "field configurable fan operational profiles".
- Womac; David J. - Saint Charles IL
- Womac; David J. - St. Charles IL US
- Womac; David J. - Lagrangeville NY
- Womac; David J. - Avon CT
| Patent | Date |
|---|---|
| Field Configurable Fan Operational Profiles App 20180306195 - Kangas; Bradley R. ; et al. | 2018-10-25 |
| Field configurable fan operational profiles Grant 10,036,396 - Kangas , et al. July 31, 2 | 2018-07-31 |
| Apparatus, system, and method for venting a chassis Grant 8,944,896 - Womac , et al. February 3, 2 | 2015-02-03 |
| Field Configurable Fan Operational Profiles App 20140255146 - Kangas; Bradley R. ; et al. | 2014-09-11 |
| Apparatus and method for configuring a dual rack-mountable chassis Grant 8,328,026 - Boduch , et al. December 11, 2 | 2012-12-11 |
| Apparatus, System, And Method For Venting A Chassis App 20080233858 - Womac; David J. ; et al. | 2008-09-25 |
| Apparatus And Method For Configuring A Dual Rack-mountable Chassis App 20080217962 - Boduch; Mark E. ; et al. | 2008-09-11 |
| Multi-chip module and heat-sink cap combination Grant 6,373,133 - DiGiacomo , et al. April 16, 2 | 2002-04-16 |
| Method for bonding heatsink to multiple-height chip App 20020017715 - Giacomo, Giulio Di ; et al. | 2002-02-14 |
| Structural support for direct lid attach Grant 6,333,460 - Toy , et al. December 25, 2 | 2001-12-25 |
| Method for bonding heatsink to multiple-height chip Grant 6,214,647 - Di Giacomo , et al. April 10, 2 | 2001-04-10 |
| Direct chip-cooling through liquid vaporization heat exchange Grant 6,085,831 - DiGiacomo , et al. July 11, 2 | 2000-07-11 |
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