loadpatents
Patent applications and USPTO patent grants for Wolfe; Mark.The latest application filed is for "instrument panel with integral hidden door cover and method of manufacture thereof".
Patent | Date |
---|---|
Instrument Panel With Integral Hidden Door Cover And Method Of Manufacture Thereof App 20160361911 - Wolfe; Mark ;   et al. | 2016-12-15 |
Citrate containing deicing compositions with improved eutectic temperatures Grant 8,808,572 - Trujillo , et al. August 19, 2 | 2014-08-19 |
System, apparatus and method for cooling electronic components Grant 8,619,426 - Chamseddine , et al. December 31, 2 | 2013-12-31 |
Citrate Containing Deicing Compositions With Improved Eutectic Temperatures App 20130306904 - Trujillo; Joshua J. ;   et al. | 2013-11-21 |
System, Apparatus and Method for Cooling Electronic Components App 20130168058 - Chamseddine; Ahmad ;   et al. | 2013-07-04 |
System, apparatus and method for cooling electronic components Grant 8,395,898 - Chamseddine , et al. March 12, 2 | 2013-03-12 |
Disk drive with multiple level power reduction during write Grant 8,218,257 - Escobar-Bowser , et al. July 10, 2 | 2012-07-10 |
System, apparatus and method for cooling electronic components Grant 8,208,259 - Wolfe , et al. June 26, 2 | 2012-06-26 |
Instrument Panel With Integral Hidden Door Cover And Method Of Manufacture Thereof App 20120091698 - Wolfe; Mark ;   et al. | 2012-04-19 |
Circuit module with thermal casing systems Grant 7,737,549 - Wehrly, Jr. , et al. June 15, 2 | 2010-06-15 |
Heat sink for a high capacity thin module system Grant 7,626,259 - Wehrly, Jr. , et al. December 1, 2 | 2009-12-01 |
Optimized mounting area circuit module system and method Grant 7,542,297 - Wehrly, Jr. , et al. June 2, 2 | 2009-06-02 |
Split core circuit module Grant 7,522,421 - Roper , et al. April 21, 2 | 2009-04-21 |
Thin Circuit Module And Method App 20090073661 - Wolfe; Mark ;   et al. | 2009-03-19 |
Circuit Module with Thermal Casing Systems App 20090052124 - Wehrly, JR.; James Douglas ;   et al. | 2009-02-26 |
High Capacity Thin Module System App 20090046431 - Wehrly, Jr.; James Douglas ;   et al. | 2009-02-19 |
Disk Drive With Multiple Level Power Reduction During Write App 20080298186 - Escobar-Bowser; Priscilla ;   et al. | 2008-12-04 |
High capacity thin module system Grant 7,459,784 - Wehrly, Jr. , et al. December 2, 2 | 2008-12-02 |
Circuit module with thermal casing systems Grant 7,446,410 - Wehrly, Jr. , et al. November 4, 2 | 2008-11-04 |
High capacity thin module system Grant 7,443,023 - Wehrly, Jr. , et al. October 28, 2 | 2008-10-28 |
High Capacity Thin Module System and Method App 20080094803 - Wehrly; James Douglas JR. ;   et al. | 2008-04-24 |
Split Core Circuit Module App 20070258217 - Roper; David L. ;   et al. | 2007-11-08 |
Communicating Information Relating to a Network Resource App 20070136418 - Wolfe; Mark | 2007-06-14 |
System and Method for Enhanced Information Retrieval App 20070106704 - Wolfe; Mark | 2007-05-10 |
Preamplifier system having programmable resistance Grant 7,152,800 - Ranmuthu , et al. December 26, 2 | 2006-12-26 |
High capacity thin module system and method App 20060091529 - Wehrly; James Douglas JR. ;   et al. | 2006-05-04 |
Circuit module with thermal casing systems and methods App 20060090102 - Wehrly; James Douglas JR. ;   et al. | 2006-04-27 |
Optimized mounting area circuit module system and method App 20060050489 - Wehrly; James Douglas JR. ;   et al. | 2006-03-09 |
Preamplifier system having programmable resistance App 20040035941 - Ranmuthu, Indumini ;   et al. | 2004-02-26 |
Downset lead frame for semiconductor packages Grant 6,246,110 - Kinsman , et al. June 12, 2 | 2001-06-12 |
Downset lead frame for semiconductor packages Grant 6,075,283 - Kinsman , et al. June 13, 2 | 2000-06-13 |
SEC | 0001320732 | Wolfe Mark |
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