| Patent | Date |
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Methods of using surface treatment compositions
Grant 11,447,642 - Wojtczak , et al. September 20, 2 | 2022-09-20 |
Cleaning Formulation For Removing Residues On Surfaces
App 20220275313 - Takahashi; Tomonori ; et al. | 2022-09-01 |
Cleaning formulation for removing residues on surfaces
Grant 11,401,487 - Takahashi , et al. August 2, 2 | 2022-08-02 |
Cleaning formulation for removing residues on surfaces
Grant 11,359,169 - Takahashi , et al. June 14, 2 | 2022-06-14 |
Cleaning Formulation For Removing Residues On Surfaces
App 20220145222 - Takahashi; Tomonori ; et al. | 2022-05-12 |
Cleaning formulation for removing residues on surfaces
Grant 11,286,444 - Takahashi , et al. March 29, 2 | 2022-03-29 |
Stripping compositions for removing photoresists from semiconductor substrates
Grant 11,208,616 - Mizutani , et al. December 28, 2 | 2021-12-28 |
Surface treatment compositions and articles containing same
Grant 11,174,394 - Wojtczak , et al. November 16, 2 | 2021-11-16 |
Methods Of Using Surface Treatment Compositions
App 20210122925 - Wojtczak; William A. ; et al. | 2021-04-29 |
Stripping compositions for removing photoresists from semiconductor substrates
Grant 10,947,484 - Mizutani , et al. March 16, 2 | 2021-03-16 |
Etching Composition
App 20210071078 - Takahashi; Kazutaka ; et al. | 2021-03-11 |
Surface Treatment Compositions and Methods
App 20210057210 - Wojtczak; William A. ; et al. | 2021-02-25 |
Cleaning formulation for removing residues on surfaces
Grant 10,927,329 - Takahashi , et al. February 23, 2 | 2021-02-23 |
Cleaning Formulation For Removing Residues On Surfaces
App 20200377829 - Takahashi; Tomonori ; et al. | 2020-12-03 |
Stripping Compositions For Removing Photoresists From Semiconductor Substrates
App 20200339919 - Mizutani; Atsushi ; et al. | 2020-10-29 |
Etching Compositions
App 20200248075 - Kind Code | 2020-08-06 |
Cleaning formulation for removing residues on surfaces
Grant 10,696,933 - Takahashi , et al. June 30, 2 | 2020-06-30 |
Surface treatment methods and compositions therefor
Grant 10,593,538 - Wojtczak , et al. | 2020-03-17 |
Cleaning Formulation For Removing Residues On Surfaces
App 20200048584 - Takahashi; Tomonori ; et al. | 2020-02-13 |
Surface Treatment Compositions and Methods
App 20200035494 - Wojtczak; William A. ; et al. | 2020-01-30 |
Cleaning formulation for removing residues on surfaces
Grant 10,415,005 - Takahashi , et al. Sept | 2019-09-17 |
Cleaning Formulation For Removing Residues On Surfaces
App 20190256807 - Takahashi; Tomonori ; et al. | 2019-08-22 |
Cleaning Formulation For Removing Residues On Surfaces
App 20190241845 - Takahashi; Tomonori ; et al. | 2019-08-08 |
Stripping Compositions For Removing Photoresists From Semiconductor Substrates
App 20190233771 - Mizutani; Atsushi ; et al. | 2019-08-01 |
Surface Treatment Compositions And Methods
App 20190211210 - Wojtczak; William A. ; et al. | 2019-07-11 |
Stripping compositions for removing photoresists from semiconductor substrates
Grant 10,266,799 - Mizutani , et al. | 2019-04-23 |
Cleaning formulation for removing residues on surfaces
Grant 10,253,282 - Takahashi , et al. | 2019-04-09 |
Surface Treatment Methods And Compositions Therefor
App 20180277357 - Wojtczak; William A. ; et al. | 2018-09-27 |
Stripping compositions for removing photoresists from semiconductor substrates
Grant 9,914,902 - Du , et al. March 13, 2 | 2018-03-13 |
Stripping Compositions For Removing Photoresists From Semiconductor Substrates
App 20170335252 - Mizutani; Atsushi ; et al. | 2017-11-23 |
Cleaning Formulation For Removing Residues On Surfaces
App 20170101608 - Takahashi; Tomonori ; et al. | 2017-04-13 |
Cleaning formulation for removing residues on surfaces
Grant 9,562,211 - Takahashi , et al. February 7, 2 | 2017-02-07 |
Stripping Compositions For Removing Photoresists From Semiconductor Substrates
App 20160186106 - Du; Bing ; et al. | 2016-06-30 |
Aqueous Cleaning Composition Containing Copper-specific Corrosion Inhibitor For Cleaning Inorganic Residues On Semiconductor Substrate
App 20150344826 - Wojtczak; William A. ; et al. | 2015-12-03 |
Passivation composition and process
Grant 9,200,372 - Wojtczak , et al. December 1, 2 | 2015-12-01 |
Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate
Grant 9,109,188 - Wojtczak , et al. August 18, 2 | 2015-08-18 |
Cleaning Formulation For Removing Residues On Surfaces
App 20150159124 - Takahashi; Tomonori ; et al. | 2015-06-11 |
Etching composition
Grant 8,889,025 - Takahashi , et al. November 18, 2 | 2014-11-18 |
Novel Etching Composition
App 20140120734 - Takahashi; Tomonori ; et al. | 2014-05-01 |
Etching composition
Grant 8,647,523 - Takahashi , et al. February 11, 2 | 2014-02-11 |
Novel Passivation Composition and Process
App 20130122701 - Krupa; Frank J. ; et al. | 2013-05-16 |
Aqueous Cleaning Composition Containing Copper-specific Corrosion Inhibitor For Cleaning Inorganic Residues On Semiconductor Substrate
App 20130072411 - Wojtczak; William A. ; et al. | 2013-03-21 |
Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate
Grant 8,293,694 - Wojtczak , et al. October 23, 2 | 2012-10-23 |
Novel Etching Composition
App 20120231632 - Takahashi; Tomonori ; et al. | 2012-09-13 |
Cleaning Formulation For Removing Residues On Surfaces
App 20120048295 - Du; Bing ; et al. | 2012-03-01 |
Selective silicon etch process
Grant 7,994,062 - Wojtczak , et al. August 9, 2 | 2011-08-09 |
Selective Silicon Etch Process
App 20110104875 - Wojtczak; William A. ; et al. | 2011-05-05 |
Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrates
Grant 7,662,762 - Wojtczak , et al. February 16, 2 | 2010-02-16 |
Aqueous Cleaning Composition Containing Copper-specific Corrosion Inhibitor For Cleaning Inorganic Residues On Semiconductor Substrate
App 20100035785 - Wojtczak; William A. ; et al. | 2010-02-11 |
Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate
Grant 7,605,113 - Wojtczak , et al. October 20, 2 | 2009-10-20 |
Post plasma ashing wafer cleaning formulation
Grant 7,534,752 - Wojtczak , et al. May 19, 2 | 2009-05-19 |
Cleaning solutions and etchants and methods for using same
Grant 7,192,910 - Wojtczak , et al. March 20, 2 | 2007-03-20 |
Selective wet etching of metal nitrides
App 20060226122 - Wojtczak; William A. ; et al. | 2006-10-12 |
Polishing slurries for copper and associated materials
App 20060084272 - Wojtczak; William A. ; et al. | 2006-04-20 |
Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate
Grant 6,967,169 - Wojtczak , et al. November 22, 2 | 2005-11-22 |
Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate
App 20050215446 - Wojtczak, William A. ; et al. | 2005-09-29 |
Polishing slurries for copper and associated materials
Grant 6,936,542 - Wojtczak , et al. August 30, 2 | 2005-08-30 |
Cleaning solutions and etchants and methods for using same
App 20050143270 - Wojtczak, William A. ; et al. | 2005-06-30 |
Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrates
App 20050124517 - Wojtczak, William A. ; et al. | 2005-06-09 |
Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate
Grant 6,896,826 - Wojtczak , et al. May 24, 2 | 2005-05-24 |
Ammonium borate containing compositions for stripping residues from semiconductor substrates
Grant 6,875,733 - Wojtczak , et al. April 5, 2 | 2005-04-05 |
Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate
App 20050003674 - Wojtczak, William A. ; et al. | 2005-01-06 |
pH buffered compositions useful for cleaning residue from semiconductor substrates
Grant 6,773,873 - Seijo , et al. August 10, 2 | 2004-08-10 |
Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate
Grant 6,755,989 - Wojtczak , et al. June 29, 2 | 2004-06-29 |
Formulations including a 1,3-dicarbonyl compound chelating agent and copper corrosion inhibiting agents for stripping residues from semiconductor substrates containing copper structures
Grant 6,660,700 - Wojtczak , et al. December 9, 2 | 2003-12-09 |
pH buffered compositions useful for cleaning residue from semiconductor substrates
App 20030181342 - Seijo, Ma. Fatima ; et al. | 2003-09-25 |
Boric acid containing compositions for stripping residues from semiconductor substrates
Grant 6,599,870 - Wojtczak , et al. July 29, 2 | 2003-07-29 |
Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate
App 20030078173 - Wojtczak, William A. ; et al. | 2003-04-24 |
Polishing slurries for copper and associated materials
Grant 6,527,819 - Wojtczak , et al. March 4, 2 | 2003-03-04 |
Boric acid containing compositions for stripping residues from semiconductor substrates
App 20030040447 - Wojtczak, William A. ; et al. | 2003-02-27 |
Boric acid containing compositions for stripping residues from semiconductor substrates
Grant 6,492,310 - Wojtczak , et al. December 10, 2 | 2002-12-10 |
Formulations including a 1,3-dicarbonyl compound chelating agent and copper corrosion inhibiting agents for stripping residues from semiconductor substrates containing copper structures
App 20020132744 - Wojtczak, William A. ; et al. | 2002-09-19 |
Polishing slurries for copper and associated materials
App 20020124474 - Wojtczak, William A. ; et al. | 2002-09-12 |
Polishing slurries for copper and associated materials
App 20020081865 - Wojtczak, William A. ; et al. | 2002-06-27 |
Polishing slurries for copper and associated materials
Grant 6,409,781 - Wojtczak , et al. June 25, 2 | 2002-06-25 |
Post plasma ashing wafer cleaning formulation
App 20020068685 - Wojtczak, William A. ; et al. | 2002-06-06 |
Formulations including a 1,3-dicarbonyl compound chelating agent and copper corrosion inhibiting agents for stripping residues from semiconductor substrates containing copper structures
App 20020065204 - Wojtczak, William A. ; et al. | 2002-05-30 |
Selective silicon oxide etchant formulation including fluoride salt, chelating agent, and glycol solvent
Grant 6,383,410 - Wojtczak , et al. May 7, 2 | 2002-05-07 |
Selective Silicon Oxide Etchant Formulation Including Fluoride Salt, Chelating Agent, And Glycol Solvent
App 20020043644 - Wojtczak, William A. ; et al. | 2002-04-18 |
Formulations including a 1,3-dicarbonyl compound chelating agent and copper corrosion inhibiting agents for stripping residues from semiconductor substrates containing copper structures
Grant 6,344,432 - Wojtczak , et al. February 5, 2 | 2002-02-05 |
Formulations including a 1,3-dicarbonyl compound chelating agent and copper corrosion inhibiting agents for stripping residues from semiconductor substrates containing copper structures
App 20020013238 - Wojtczak, William A. ; et al. | 2002-01-31 |
Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate
App 20010050350 - Wojtczak, William A. ; et al. | 2001-12-13 |
Boric acid containing compositions for stripping residues from semiconductor substrates
Grant 6,306,807 - Wojtczak , et al. October 23, 2 | 2001-10-23 |
Selective silicon oxide etchant formulation including fluoride salt, chelating agent, and glycol solvent
Grant 6,280,651 - Wojtczak , et al. August 28, 2 | 2001-08-28 |
Boric acid containing compositions for stripping residues from semiconductor substrates
App 20010008878 - Wojtczak, William A. ; et al. | 2001-07-19 |
Formulations including a 1, 3-dicarbonyl compound chelating agent for stripping residues from semiconductor substrates
Grant 6,211,126 - Wojtczak , et al. April 3, 2 | 2001-04-03 |
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