loadpatents
name:-0.036060810089111
name:-0.031271934509277
name:-0.0003969669342041
Woerner; Holger Patent Filings

Woerner; Holger

Patent Applications and Registrations

Patent applications and USPTO patent grants for Woerner; Holger.The latest application filed is for "device including a housing for a semiconductor chip".

Company Profile
0.27.27
  • Woerner; Holger - Regengsburg DE
  • Woerner; Holger - Regensburg DE
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor device stack and method for its production
Grant 8,659,135 - Bauer , et al. February 25, 2
2014-02-25
External contact material for external contacts of a semiconductor device and method of making the same
Grant 7,893,532 - Bauer , et al. February 22, 2
2011-02-22
Semiconductor device with semiconductor chip and rewiring layer and method for producing the same
Grant 7,883,993 - Fuergut , et al. February 8, 2
2011-02-08
Semiconductor component with plastic housing, and process for producing the same
Grant 7,772,105 - Bachmaier , et al. August 10, 2
2010-08-10
Sensor component and panel used for the production thereof
Grant 7,700,956 - Fuergut , et al. April 20, 2
2010-04-20
Device including a housing for a semiconductor chip including leads extending into the housing
Grant 7,692,283 - Bauer , et al. April 6, 2
2010-04-06
Wiring substrate of a semiconductor component comprising rubber-elastic pads embedded in said wiring substrate and method for producing the same
Grant 7,638,418 - Bauer , et al. December 29, 2
2009-12-29
Semiconductor structure with a plastic housing and separable carrier plate
Grant 7,622,733 - Fuergut , et al. November 24, 2
2009-11-24
Smart card, smart card module, and a method for production of a smart card module
Grant 7,575,173 - Fuergut , et al. August 18, 2
2009-08-18
Biosensor with smart card configuration
Grant 7,566,968 - Bauer , et al. July 28, 2
2009-07-28
Semiconductor device with a wiring substrate and method for producing the same
Grant 7,545,047 - Bauer , et al. June 9, 2
2009-06-09
Semiconductor component with a thin semiconductor chip and a stiff wiring substrate, and methods for producing and further processing of thin semiconductor chips
Grant 7,528,054 - Fuergut , et al. May 5, 2
2009-05-05
Electronic component and a panel
Grant 7,524,699 - Fuergut , et al. April 28, 2
2009-04-28
Device Including A Housing For A Semiconductor Chip
App 20090102044 - Bauer; Michael ;   et al.
2009-04-23
Method for manufacturing semiconductor component with a media channel
Grant 7,516,543 - Woerner April 14, 2
2009-04-14
Method for applying rewiring to a panel while compensating for position errors of semiconductor chips in component positions of the panel
Grant 7,514,273 - Hedler , et al. April 7, 2
2009-04-07
Method for producing through-contacts and a semiconductor component with through-contacts
Grant 7,482,198 - Bauer , et al. January 27, 2
2009-01-27
Semiconductor module with a semiconductor stack, and methods for its production
Grant 7,456,495 - Pohl , et al. November 25, 2
2008-11-25
Semiconductor device with a recessed bond pad
Grant 7,408,241 - Bauer , et al. August 5, 2
2008-08-05
Electronic module having plug contacts and method for producing it
Grant 7,391,103 - Fuergut , et al. June 24, 2
2008-06-24
Semiconductor Component with Plastic Housing, and Process for Producing the Same
App 20080050907 - Bachmaier; Ulrich ;   et al.
2008-02-28
Semiconductor component with plastic housing, and process for producing the same
Grant 7,327,023 - Bachmaier , et al. February 5, 2
2008-02-05
Semiconductor Device Stack and Method for Its Production
App 20070278639 - Bauer; Michael ;   et al.
2007-12-06
Electronic component with a plastic package and method for production
Grant 7,276,783 - Goller , et al. October 2, 2
2007-10-02
Wiring Substrate of a Semiconductor Component Comprising External Contact Pads for External Contacts and Method for Producing the Same
App 20070194459 - Bauer; Michael ;   et al.
2007-08-23
Semiconductor Structure with a Plastic Housing and Separable Carrier Plate
App 20070145555 - Fuergut; Edward ;   et al.
2007-06-28
Sensor component and panel used for the production thereof
App 20070128754 - Fuergut; Edward ;   et al.
2007-06-07
Semiconductor device with a wiring substrate and method for producing the same
App 20070126122 - Bauer; Michael ;   et al.
2007-06-07
Semiconductor component with a thin semiconductor chip and a stiff wiring substrate, and methods for producing and further processing of thin semiconductor chips
App 20070096305 - Fuergut; Edward ;   et al.
2007-05-03
Method for producing through-contacts and a semiconductor component with through-contacts
App 20070099345 - Bauer; Michael ;   et al.
2007-05-03
Method for producing a semiconductor component with a plastic housing and carrier plate for performing the method
Grant 7,202,107 - Fuergut , et al. April 10, 2
2007-04-10
External contact material for external contacts of a semiconductor device and method of making the same
App 20070057372 - Bauer; Michael ;   et al.
2007-03-15
Electronic component with a stack of semiconductor chips and a method for producing the electronic component
Grant 7,190,059 - Hagen , et al. March 13, 2
2007-03-13
Semiconductor component with a media channel and method for manufacturing same
App 20060278978 - Woerner; Holger
2006-12-14
Method for encapsulating a semiconductor device and semiconductor device
App 20060255435 - Fuergut; Edward ;   et al.
2006-11-16
Semiconductor device with semiconductor chip and rewiring layer and method for producing the same
App 20060246624 - Fuergut; Edward ;   et al.
2006-11-02
Semiconductor device with surface-mountable outer contacts, and process for producing it
App 20060192298 - Bauer; Michael ;   et al.
2006-08-31
Method for producing a semiconductor component with a plastic housing and carrier plate for performing the method
App 20060183269 - Fuergut; Edward ;   et al.
2006-08-17
Semiconductor device with semiconductor chip and rewiring layer and method for producing the same
Grant 7,091,595 - Fuergut , et al. August 15, 2
2006-08-15
Smart card, smart card module, and a method for production of a smart card module
App 20060175419 - Fuergut; Edward ;   et al.
2006-08-10
Electronic component and panel for producing the same
App 20060125042 - Fuergut; Edward ;   et al.
2006-06-15
Semiconductor component with plastic housing, and process for producing the same
App 20060076667 - Bachmaier; Ulrich ;   et al.
2006-04-13
Semiconductor component with electromagnetic shielding device
Grant 7,009,288 - Bauer , et al. March 7, 2
2006-03-07
Biosensor with smart card configuration
App 20060027905 - Bauer; Michael ;   et al.
2006-02-09
Electronic device configured as a multichip module, leadframe and panel with leadframe positions
App 20050184375 - Goller, Bernd ;   et al.
2005-08-25
Semiconductor module with a semiconductor stack, and methods for its production
App 20050133932 - Pohl, Jens ;   et al.
2005-06-23
Electronic device configured as a multichip module, leadframe, panel with leadframe positions, and method for producing the electronic device
Grant 6,902,951 - Goller , et al. June 7, 2
2005-06-07
Semiconductor device with semiconductor chip and rewiring layer and method for producing the same
App 20050098871 - Fuergut, Edward ;   et al.
2005-05-12
Electronic module having plug contacts and method for producing it
App 20050087851 - Fuergut, Edward ;   et al.
2005-04-28
Semiconductor component with electromagnetic shielding device
App 20050077596 - Bauer, Michael ;   et al.
2005-04-14
Electronic component with a plastic housing and method for production thereof
App 20040232543 - Goller, Bernd ;   et al.
2004-11-25
Electronic device configured as a multichip module, leadframe, panel with leadframe positions, and method for producing the electronic device
App 20040140559 - Goller, Bernd ;   et al.
2004-07-22
Electronic component with a stack of semiconductor chips and a method for producing the electronic component
App 20040063304 - Hagen, Robert-Christian ;   et al.
2004-04-01

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