| Patent | Date |
|---|
Semiconductor substrate having a bond pad material based on aluminum
Grant 11,410,950 - Pfahl , et al. August 9, 2 | 2022-08-09 |
Semiconductor Device and Method for Forming a Semiconductor Device
App 20220093483 - Konrath; Jens Peter ; et al. | 2022-03-24 |
Semiconductor device and method for forming a semiconductor device
Grant 11,217,500 - Konrath , et al. January 4, 2 | 2022-01-04 |
Process for Producing an Electrical Contact on a Silicon Carbide Substrate
App 20210265168 - Krivec; Stefan ; et al. | 2021-08-26 |
Electrical contact connection on silicon carbide substrate
Grant 11,043,383 - Krivec , et al. June 22, 2 | 2021-06-22 |
Semiconductor Substrate Having a Bond Pad Material Based on Aluminum
App 20210091025 - Pfahl; Gert ; et al. | 2021-03-25 |
Electronic Device, Electronic Module And Methods For Fabricating The Same
App 20200343094 - Frank; Paul ; et al. | 2020-10-29 |
Electronic device, electronic module and methods for fabricating the same
Grant 10,741,402 - Frank , et al. A | 2020-08-11 |
Electrical Contact Connection on Silicon Carbide Substrate
App 20190362973 - Krivec; Stefan ; et al. | 2019-11-28 |
Semiconductor device having a copper element and method of forming a semiconductor device having a copper element
Grant 10,446,469 - Detzel , et al. Oc | 2019-10-15 |
Semiconductor Device and Method for Forming a Semiconductor Device
App 20190311966 - Konrath; Jens Peter ; et al. | 2019-10-10 |
Method for processing a wafer and wafer structure
Grant 9,935,060 - Yeduru , et al. April 3, 2 | 2018-04-03 |
Electronic Device, Electronic Module And Methods For Fabricating The Same
App 20180082848 - Frank; Paul ; et al. | 2018-03-22 |
Electrically conductive element, power semiconductor device having an electrically conductive element and method of manufacturing a power semiconductor device
Grant 9,812,376 - Woehlert , et al. November 7, 2 | 2017-11-07 |
Method For Processing A Wafer And Wafer Structure
App 20170154857 - Yeduru; Srinivasa Reddy ; et al. | 2017-06-01 |
Method of manufacturing a device by locally heating one or more metalization layers and by means of selective etching
Grant 9,634,108 - Rupp , et al. April 25, 2 | 2017-04-25 |
Method for processing a wafer and wafer structure
Grant 9,589,880 - Yeduru , et al. March 7, 2 | 2017-03-07 |
Method, A Semiconductor Device And A Layer Arrangement
App 20170053879 - YEDURU; SRINIVASA REDDY ; et al. | 2017-02-23 |
Semiconductor Device Having a Copper Element and Method of Forming a Semiconductor Device Having a Copper Element
App 20160329263 - Detzel; Thomas ; et al. | 2016-11-10 |
Integrated circuit and method of forming an integrated circuit
Grant 9,418,937 - Detzel , et al. August 16, 2 | 2016-08-16 |
Method of manufacturing a device by locally heating one or more metalization layers and by means of selective etching
Grant 9,391,154 - Rupp , et al. July 12, 2 | 2016-07-12 |
Method of Manufacturing a Device by Locally Heating One or More Metalization Layers and by Means of Selective Etching
App 20160155861 - Rupp; Roland ; et al. | 2016-06-02 |
Method of Manufacturing a Device by Locally Heating One or More Metalization Layers and by Means of Selective Etching
App 20160064504 - Rupp; Roland ; et al. | 2016-03-03 |
Electrically Conductive Element, Power Semiconductor Device Having an Electrically Conductive Element and Method of Manufacturing a Power Semiconductor Device
App 20160013117 - Woehlert; Stefan ; et al. | 2016-01-14 |
Method of manufacturing a device by locally heating one or more metallization layers and by means of selective etching
Grant 9,209,281 - Rupp , et al. December 8, 2 | 2015-12-08 |
Method For Processing A Wafer And Wafer Structure
App 20150097294 - Yeduru; Srinivasa Reddy ; et al. | 2015-04-09 |
Integrated circuit including power transistor cells and a connecting line
Grant 8,502,274 - Matoy , et al. August 6, 2 | 2013-08-06 |
Integrated Circuit and Method of Forming an Integrated Circuit
App 20130147047 - Detzel; Thomas ; et al. | 2013-06-13 |
Semiconductor chip, semiconductor device and methods for producing the same
Grant 8,324,115 - Otremba , et al. December 4, 2 | 2012-12-04 |
Semiconductor device
Grant 8,156,643 - Schneegans , et al. April 17, 2 | 2012-04-17 |
Semiconductor arrangement including a load transistor and sense transistor
Grant 8,097,918 - Kadow , et al. January 17, 2 | 2012-01-17 |
Semiconductor Device
App 20110107595 - Schneegans; Manfred ; et al. | 2011-05-12 |
Semiconductor Arrangement Including A Load Transistor And Sense Transistor
App 20110037126 - Kadow; Christoph ; et al. | 2011-02-17 |
Integrated circuit having a semiconductor arrangement
Grant 7,834,427 - Detzel , et al. November 16, 2 | 2010-11-16 |
Semiconductor Device
App 20080315423 - Schneegans; Manfred ; et al. | 2008-12-25 |
Method of manufacturing a device by locally heating one or more metallization layers and by means of selective etching
App 20080258183 - Rupp; Roland ; et al. | 2008-10-23 |
Integrated Circuit Having A Semiconductor Arrangement
App 20080179669 - Detzel; Thomas ; et al. | 2008-07-31 |
Semiconductor chip, semiconductor device and methods for producing the same
App 20080105907 - Otremba; Ralf ; et al. | 2008-05-08 |
Silicon wafer with solderable coating on its wafer rear side, and process for producing it
App 20060273810 - Ganitzer; Paul ; et al. | 2006-12-07 |
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