WO; Chun Hong

Patent Applications and Registrations

Patent applications and USPTO patent grants for WO; Chun Hong.The latest application filed is for "semiconductor packages and methods of packaging semiconductor devices".

Company Profile

1.5.7

WO; Chun Hong - Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Packages And Methods Of Packaging Semiconductor Devices App 20190348387 - YANG; Yongbo ; et al.	2019-11-14
Semiconductor packages and methods of packaging semiconductor devices Grant 10,403,592 - Yang , et al. Sep	2019-09-03
Reliable interconnect Grant 9,960,130 - Huang , et al. May 1, 2	2018-05-01
Semiconductor Packages And Methods Of Packaging Semiconductor Devices App 20180033759 - YANG; Yongbo ; et al.	2018-02-01
Semiconductor packages and methods of packaging semiconductor devices Grant 9,786,625 - Yang , et al. October 10, 2	2017-10-10
Reliable Interconnect App 20160233179 - HUANG; Rui ; et al.	2016-08-11
Semiconductor Packages And Methods Of Packaging Semiconductor Devices App 20160043041 - YANG; Yong Bo ; et al.	2016-02-11
Semiconductor Packages And Methods Of Packaging Semiconductor Devices App 20150325511 - YANG; Yongbo ; et al.	2015-11-12
Semiconductor packages and methods of packaging semiconductor devices Grant 9,165,878 - Yang , et al. October 20, 2	2015-10-20
Semiconductor packages and methods of packaging semiconductor devices Grant 9,087,777 - Yang , et al. July 21, 2	2015-07-21
Semiconductor Packages And Methods Of Packaging Semiconductor Devices App 20140264792 - YANG; Yong Bo ; et al.	2014-09-18
Semiconductor Packages And Methods Of Packaging Semiconductor Devices App 20140264789 - Yang; Yongbo ; et al.	2014-09-18

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