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Engineering Dielectric Films For Cmp Stop App 20130189841 - Balseanu; Mihaela ;   et al. | 2013-07-25 |
Conformal Amorphous Carbon For Spacer And Spacer Protection Applications App 20130189845 - Kim; Sungjin ;   et al. | 2013-07-25 |
Low Temperature Plasma Enhanced Chemical Vapor Deposition Of Conformal Silicon Carbon Nitride And Silicon Nitride Films App 20130183835 - Nguyen; Victor ;   et al. | 2013-07-18 |
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Method for depositing boron-rich films for lithographic mask applications Grant 8,337,950 - Nguyen , et al. December 25, 2 | 2012-12-25 |
Copper Oxide Removal Techniques App 20120289049 - YE; WEIFENG ;   et al. | 2012-11-15 |
Adhesion Improvement Of Dielectric Barrier To Copper By The Addition Of Thin Interface Layer App 20120276301 - Lee; Yong-Won ;   et al. | 2012-11-01 |
Methods to improve the in-film defectivity of PECVD amorphous carbon films Grant 8,282,734 - Padhi , et al. October 9, 2 | 2012-10-09 |
Method of forming a non-volatile memory having a silicon nitride charge trap layer Grant 8,252,653 - Balseanu , et al. August 28, 2 | 2012-08-28 |
Method For Depositing An Amorphous Carbon Film With Improved Density And Step Coverage App 20120208373 - PADHI; DEENESH ;   et al. | 2012-08-16 |
Methods To Improve The In-film Defectivity Of Pecvd Amorphous Carbon Films App 20120204795 - Padhi; Deenesh ;   et al. | 2012-08-16 |
Method To Increase Silicon Nitride Tensile Stress Using Nitrogen Plasma In-situ Treatment And Ex-situ Uv Cure App 20120196450 - Balseanu; Mihaela ;   et al. | 2012-08-02 |
Dual Delivery Chamber Design App 20120097330 - Iyengar; Prahallad ;   et al. | 2012-04-26 |
Boron nitride and boron-nitride derived materials deposition method Grant 8,148,269 - Balseanu , et al. April 3, 2 | 2012-04-03 |
Method to increase silicon nitride tensile stress using nitrogen plasma in-situ treatment and ex-situ UV cure Grant 8,138,104 - Balseanu , et al. March 20, 2 | 2012-03-20 |
Plasma-enhanced Chemical Vapor Deposition Of Crystalline Germanium App 20110315992 - Nguyen; Victor T. ;   et al. | 2011-12-29 |
Method of depositing boron nitride and boron nitride-derived materials Grant 8,084,105 - Huh , et al. December 27, 2 | 2011-12-27 |
Silicon Dioxide Layer Deposited With Bdeas App 20110298099 - LEE; Yong-Won ;   et al. | 2011-12-08 |
Methods to obtain low k dielectric barrier with superior etch resistivity Grant 7,964,442 - Xu , et al. June 21, 2 | 2011-06-21 |
Method For Depositing An Amorphous Carbon Film With Improved Density And Step Coverage App 20110104400 - Padhi; Deenesh ;   et al. | 2011-05-05 |
Apparatus And Method For Substrate Clamping In A Plasma Chamber App 20110090613 - Balasubramanian; Ganesh ;   et al. | 2011-04-21 |
Methods and systems for forming at least one dielectric layer Grant 7,871,926 - Xia , et al. January 18, 2 | 2011-01-18 |
Method for depositing an amorphous carbon film with improved density and step coverage Grant 7,867,578 - Padhi , et al. January 11, 2 | 2011-01-11 |
Method of forming non-volatile memory having charge trap layer with compositional gradient Grant 7,816,205 - Balseanu , et al. October 19, 2 | 2010-10-19 |
Method to deposit functionally graded dielectric films via chemical vapor deposition using viscous precursors Grant 7,802,538 - Padhi , et al. September 28, 2 | 2010-09-28 |
Engineering Boron-rich Films For Lithographic Mask Applications App 20100233633 - Nguyen; Victor ;   et al. | 2010-09-16 |
Method to increase the compressive stress of PECVD dielectric films Grant 7,790,635 - Balseanu , et al. September 7, 2 | 2010-09-07 |
Novel Air Gap Integration Scheme App 20100151671 - Demos; Alexandros T. ;   et al. | 2010-06-17 |
Boron derived materials deposition method Grant 7,704,816 - Huh , et al. April 27, 2 | 2010-04-27 |
Non-volatile Memory Having Charge Trap Layer With Compositional Gradient App 20100096688 - Balseanu; Mihaela ;   et al. | 2010-04-22 |
Flash Memory With Treated Charge Trap Layer App 20100099247 - Balseanu; Mihaela ;   et al. | 2010-04-22 |
Boron Film Interface Engineering App 20100098884 - BALSEANU; MIHAELA ;   et al. | 2010-04-22 |
Non-volatile Memory Having Silicon Nitride Charge Trap Layer App 20100096687 - BALSEANU; Mihaela ;   et al. | 2010-04-22 |
Air gap integration scheme Grant 7,670,924 - Demos , et al. March 2, 2 | 2010-03-02 |
Multi-stage curing of low K nano-porous films Grant 7,611,996 - Schmitt , et al. November 3, 2 | 2009-11-03 |
Adhesion And Electromigration Improvement Between Dielectric And Conductive Layers App 20090269923 - Lee; Sang M. ;   et al. | 2009-10-29 |
Boron Nitride And Boron-nitride Derived Materials Deposition Method App 20090263972 - Balseanu; Mihaela ;   et al. | 2009-10-22 |
Techniques promoting adhesion of porous low K film to underlying barrier layer Grant 7,547,643 - Schmitt , et al. June 16, 2 | 2009-06-16 |
Adhesion Improvement Of Dielectric Barrier To Copper By The Addition Of Thin Interface Layer App 20090107626 - Lee; Yong-Won ;   et al. | 2009-04-30 |
Methods and Systems for Forming at Least One Dielectric Layer App 20090104764 - Xia; Li-Qun ;   et al. | 2009-04-23 |
Methods For High Temperature Deposition Of An Amorphous Carbon Layer App 20090093128 - SEAMONS; MARTIN JAY ;   et al. | 2009-04-09 |
Method For Forming An Air Gap In Multilevel Interconnect Structure App 20090093100 - Xia; Li-Qun ;   et al. | 2009-04-09 |
Methods To Obtain Low K Dielectric Barrier With Superior Etch Resistivity App 20090093132 - XU; HUIWEN ;   et al. | 2009-04-09 |
Methods to improve the in-film defectivity of PECVD amorphous carbon films Grant 7,514,125 - Padhi , et al. April 7, 2 | 2009-04-07 |
Formation of low K material utilizing process having readily cleaned by-products Grant 7,501,354 - Ho , et al. March 10, 2 | 2009-03-10 |
Methods To Improve The In-film Defectivity Of Pecvd Amorphous Carbon Films App 20090044753 - Padhi; Deenesh ;   et al. | 2009-02-19 |
Boron Derived Materials Deposition Method App 20090017640 - Huh; Jeong-Uk ;   et al. | 2009-01-15 |
Boron Nitride And Boron Nitride-derived Materials Deposition Method App 20080292798 - Huh; Jeong-Uk ;   et al. | 2008-11-27 |
Plasma-induced Charge Damage Control For Plasma Enhanced Chemical Vapor Deposition Processes App 20080254233 - LEE; KWANGDUK DOUGLAS ;   et al. | 2008-10-16 |
Novel Air Gap Integration Scheme App 20080182404 - DEMOS; ALEXANDROS T. ;   et al. | 2008-07-31 |
Method For Depositing An Amorphous Carbon Film With Improved Density And Step Coverage App 20080153311 - Padhi; Deenesh ;   et al. | 2008-06-26 |
Method To Increase The Compressive Stress Of Pecvd Dielectric Films App 20080146007 - Balseanu; Mihaela ;   et al. | 2008-06-19 |
Multi-stage Curing Of Low K Nano-porous Films App 20080099920 - Schmitt; Francimar ;   et al. | 2008-05-01 |
Apparatus And Method For Substrate Clamping In A Plasma Chamber App 20080084650 - Balasubramanian; Ganesh ;   et al. | 2008-04-10 |
Method To Increase Silicon Nitride Tensile Stress Using Nitrogen Plasma In-situ Treatment And Ex-situ Uv Cure App 20080020591 - Balseanu; Mihaela ;   et al. | 2008-01-24 |
Methods To Improve The In-film Defectivity Of Pecvd Amorphous Carbon Films App 20070295272 - Padhi; Deenesh ;   et al. | 2007-12-27 |
Method To Deposit Functionally Graded Dielectric Films Via Chemical Vapor Deposition Using Viscous Precursors App 20070079753 - Padhi; Deenesh ;   et al. | 2007-04-12 |
Method to deposit functionally graded dielectric films via chemical vapor deposition using viscous precursors Grant 7,166,544 - Padhi , et al. January 23, 2 | 2007-01-23 |
In-situ oxide capping after CVD low k deposition Grant 7,112,541 - Xia , et al. September 26, 2 | 2006-09-26 |
Formation of low K material utilizing process having readily cleaned by-products App 20060160374 - Ho; Dustin W. ;   et al. | 2006-07-20 |
Tensile and compressive stressed materials for semiconductors App 20060105106 - Balseanu; Mihaela ;   et al. | 2006-05-18 |
High-power dielectric seasoning for stable wafer-to-wafer thickness uniformity of dielectric CVD films App 20060093756 - Rajagopalan; Nagarajan ;   et al. | 2006-05-04 |
Post treatment of low k dielectric films Grant 7,018,941 - Cui , et al. March 28, 2 | 2006-03-28 |
Method to deposit functionally graded dielectric films via chemical vapor deposition using viscous precursors App 20060046520 - Padhi; Deenesh ;   et al. | 2006-03-02 |
In-situ oxide capping after CVD low k deposition App 20050250348 - Xia, Li-Qun ;   et al. | 2005-11-10 |
Post Treatment Of Low K Dielectric Films App 20050239293 - Cui, Zhenjiang ;   et al. | 2005-10-27 |
Multi-stage curing of low K nano-porous films App 20050230834 - Schmitt, Francimar ;   et al. | 2005-10-20 |
Techniques promoting adhesion of porous low K film to underlying barrier layer App 20050233591 - Schmitt, Francimar ;   et al. | 2005-10-20 |
Method of operating high density plasma CVD reactor with combined inductive and capacitive coupling Grant 6,465,051 - Sahin , et al. October 15, 2 | 2002-10-15 |
Nitrogen Treatment Of Polished Halogen-doped Silicon Glass App 20010033900 - M'SAAD, HICHEM ;   et al. | 2001-10-25 |