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System and method for post-vehicle crash intelligence
Grant 10,916,139 - Feit , et al. February 9, 2 | 2021-02-09 |
Interconnect structure and related methods
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Interconnect Structure and Related Methods
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Interconnects formed by a metal displacement reaction
Grant 10,580,696 - Lin , et al. | 2020-03-03 |
Interconnects Formed By A Metal Displacement Reaction
App 20200066585 - Lin; Sean Xuan ; et al. | 2020-02-27 |
System And Method For Post-vehicle Crash
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Methods of forming air gaps in metallization layers on integrated circuit products
Grant 9,768,058 - Sun , et al. September 19, 2 | 2017-09-19 |
Methods Of Forming Air Gaps In Metallization Layers On Integrated Circuit Products
App 20170047242 - Sun; Zhiguo ; et al. | 2017-02-16 |
Electric power train for the steerable axle of a motor vehicle
Grant 9,440,531 - Fischer , et al. September 13, 2 | 2016-09-13 |
Interlayer Ballistic Conductor Signal Lines
App 20160104670 - Augur; Roderick A. ; et al. | 2016-04-14 |
Low Capacitance Ballistic Conductor Signal Lines
App 20160104672 - Augur; Roderick A. ; et al. | 2016-04-14 |
Methods of forming a metal cap layer on copper-based conductive structures on an integrated circuit device
Grant 9,236,299 - Zhang , et al. January 12, 2 | 2016-01-12 |
Methods Of Forming A Metal Cap Layer On Copper-based Conductive Structures On An Integrated Circuit Device
App 20150255339 - Zhang; Xunyuan ; et al. | 2015-09-10 |
Methods for integration of pore stuffing material
Grant 9,054,052 - Licausi , et al. June 9, 2 | 2015-06-09 |
Methods of self-forming barrier integration with pore stuffed ULK material
Grant 8,932,934 - Chae , et al. January 13, 2 | 2015-01-13 |
Electric Power Train For The Steerable Axle Of A Motor Vehicle
App 20140374185 - Fischer; Raphael ; et al. | 2014-12-25 |
Methods For Integration Of Pore Stuffing Material
App 20140353802 - LICAUSI; Nicholas Vincent ; et al. | 2014-12-04 |
Methods Of Self-forming Barrier Integration With Pore Stuffed Ulk Material
App 20140353835 - CHAE; Moosung M. ; et al. | 2014-12-04 |
Methods Of Semiconductor Contaminant Removal Using Supercritical Fluid
App 20140353805 - RYAN; Errol Todd ; et al. | 2014-12-04 |
Methods Of Forming Graphene Liners And/or Cap Layers On Copper-based Conductive Structures
App 20140145332 - Ryan; Errol T. ; et al. | 2014-05-29 |
MOSFET integrated circuit having doped conductive interconnects and methods for its manufacture
Grant 8,580,665 - Witt November 12, 2 | 2013-11-12 |
Mosfet Integrated Circuit Having Doped Conductive Interconnects And Methods For Its Manufacture
App 20130089980 - Witt; Christian | 2013-04-11 |
Defectivity and process control of electroless deposition in microelectronics applications
Grant 7,615,491 - Chen , et al. November 10, 2 | 2009-11-10 |
Defectivity and process control of electroless deposition in microelectronics applications
Grant 7,611,988 - Chen , et al. November 3, 2 | 2009-11-03 |
Defectivity and process control of electroless deposition in microelectronics applications
Grant 7,611,987 - Chen , et al. November 3, 2 | 2009-11-03 |
Defectivity and process control of electroless deposition in microelectronics applications
Grant 7,410,899 - Chen , et al. August 12, 2 | 2008-08-12 |
Capping of metal interconnects in integrated circuit electronic devices
Grant 7,393,781 - Yakobson , et al. July 1, 2 | 2008-07-01 |
Cobalt and nickel electroless plating in microelectronic devices
Grant 7,332,193 - Valverde , et al. February 19, 2 | 2008-02-19 |
Capping Of Metal Interconnects In Integrated Circuit Electronic Devices
App 20070298609 - Yakobson; Eric ; et al. | 2007-12-27 |
Capping of metal interconnects in integrated circuit electronic devices
Grant 7,268,074 - Yakobson , et al. September 11, 2 | 2007-09-11 |
Copper electrodeposition in microelectronics
App 20070178697 - Paneccasio; Vincent JR. ; et al. | 2007-08-02 |
Defectivity and process control of electroless deposition in microelectronics applications
App 20070062408 - Chen; Qingyun ; et al. | 2007-03-22 |
Defectivity and process control of electroless deposition in microelectronics applications
App 20070066059 - Chen; Qingyun ; et al. | 2007-03-22 |
Defectivity and process control of electroless deposition in microelectronics applications
App 20070066058 - Chen; Qingyun ; et al. | 2007-03-22 |
Defectivity and process control of electroless deposition in microelectronics applications
App 20070066057 - Chen; Qingyun ; et al. | 2007-03-22 |
Cobalt electroless plating in microelectronic devices
App 20060280860 - Paneccasio; Vincent JR. ; et al. | 2006-12-14 |
Cobalt self-initiated electroless via fill for stacked memory cells
App 20060188659 - Chen; Qingyun ; et al. | 2006-08-24 |
Cobalt and nickel electroless plating in microelectronic devices
App 20060083850 - Valverde; Charles ; et al. | 2006-04-20 |
Capping of metal interconnects in integrated circuit electronic devices
App 20050275100 - Yakobson, Eric ; et al. | 2005-12-15 |
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