Wisnieski; Michael S.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Wisnieski; Michael S..The latest application filed is for "protecting thin semiconductor wafers during back-grinding in high-volume production".
- Wisnieski; Michael S. - Keizer OR
- Wisnieski; Michael S. - Pleasanton CA
- Wisnieski; Michael S. - O'Fallon MO
| Patent | Date |
|---|---|
| Protecting thin semiconductor wafers during back-grinding in high-volume production Grant 7,186,629 - Wesselmann , et al. March 6, 2 | 2007-03-06 |
| Protecting thin semiconductor wafers during back-grinding in high-volume production App 20060008650 - Wesselmann; Mark ; et al. | 2006-01-12 |
| Mixing manifold for multiple inlet chemistry fluids Grant 6,632,012 - Vogtmann , et al. October 14, 2 | 2003-10-14 |
| Mixing manifold for multiple inlet chemistry fluids App 20020141284 - Vogtmann, Michael R. ; et al. | 2002-10-03 |
| Method and apparatus for controlling flatness of polished semiconductor wafer Grant 5,787,595 - Desai , et al. August 4, 1 | 1998-08-04 |
| Method of rough polishing semiconductor wafers to reduce surface roughness Grant 5,571,373 - Krishna , et al. November 5, 1 | 1996-11-05 |
| Semiconductor wafer polisher and method Grant 5,422,316 - Desai , et al. June 6, 1 | 1995-06-06 |
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